MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

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Related Parts

ImageManufacturer Part NumberDescriptionPackage CooledAttachment MethodAvailable QuantityView Details
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMBGAThermal Tape, Adhesive (Included)0View Details
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMBGAClip, Thermal Material193 - ImmediateView Details
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMBGAThermal Tape, Adhesive (Included)203 - ImmediateView Details
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMBGAClip, Thermal Material0View Details
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMBGAClip, Thermal Material925 - ImmediateView Details
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMBGAClip, Thermal Material123 - ImmediateView Details
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMBGAClip, Thermal Material149 - ImmediateView Details
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMBGAClip, Thermal Material85 - ImmediateView Details
HEAT SINK 19MM X 19MM X 9MMATS-56001-C3-R0HEAT SINK 19MM X 19MM X 9MMASICThermal Tape, Adhesive (Included)0View Details
PTM Published on: 2011-10-13