Advanced Thermal Solutions Inc

maxiFLOW™ with maxiGRIP™ Heatsinks

Ultra-high performance BGA cooling solutions with maxiGRIP attachment from Advanced Thermal Solutions

Image of Advanced Thermal Solutions' maxiFLOW™ with maxiGRIP™ HeatsinksAdvanced Thermal Solutions maxiFLOW design features a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling. The maxiGRIP attachment applies steady, even pressure to the component and does not require holes in the PCB. These devices meet Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL-STD-810 Shock and Unpackaged Drop Testing standards. They come preassembled with high performance, phase changing, thermal interface materials.

Published: 2012-12-07

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Heat Sink Attachment Solutions Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.

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Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.