Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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70-3213-0810

DigiKey Part Number
70-3213-0810-ND
Manufacturer
Manufacturer Product Number
70-3213-0810
Description
SOLDER PASTE NXG1 NO CLEAN 500GM
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
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Category
Mesh Type
3
Manufacturer
Kester Solder
Process
Lead Free
Series
Form
Jar, 17.64 oz (500g)
Packaging
Bulk
Shelf Life
8 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Digi-Key Storage
Refrigerated
Melting Point
423 ~ 424°F (217 ~ 218°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 11
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All prices are in AUD
Bulk
QuantityUnit PriceExt Price
1$333.79000$333.79
5$287.48800$1,437.44
10$269.51000$2,695.10
30$243.18100$7,295.43
50$231.77860$11,588.93
Manufacturers Standard Package
Unit Price without GST:$333.79000
Unit Price with GST:$367.16900