TS391SNL50

DigiKey Part Number
TS391SNL50-ND
Manufacturer
Manufacturer Product Number
TS391SNL50
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time
3 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Base Product Number
All prices are in AUD
Bulk
QuantityUnit PriceExt Price
1$28.75000$28.75
Manufacturers Standard Package