TS391LT50

DigiKey Part Number
TS391LT50-ND
Manufacturer
Manufacturer Product Number
TS391LT50
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time
3 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Shipping Info
-
Base Product Number
All prices are in AUD
Bulk
QuantityUnit PriceExt Price
1$34.93000$34.93
Manufacturers Standard Package