OSD335x SiP Family - Octavo Systems

Product Highlights > OSD335x System-in-Package (SiP) Family

            OSD335x System-in-Package (SiP) Family
                    Octavo Systems integrates the TI AM335x, TPS65217C, TL5209, and DDR3 in a 27 mm x 27 mm package
    

Image of Octavo Systems' OSD335x System-in-Package (SiP) Family Octavo Systems' OSD335x family of SiP products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC and TI TL5209 LDO, up to 1 GB of DDR3 memory, and over 140 resistors, capacitors, and inductors all into a single design-in-ready package.

With this level of integration the OSD335x family of SIPs allows designers to focus on the key aspects of their system without spending time on the complicated high-speed design of the processor/DDR3 interface. It also reduces the overall size and complexity of the design. The OSD335x can significantly decrease the time to market for AM335x-based products.

OSD335x Block Diagram

Features
TI AM335x features: ARM^® Cortex^®-A8 up to 1GHz 8-channel 16-bit SAR AD Ethernet 10/100/1000 x 2 USB 2.0 HS OTG + PHY x2 MMC, SD, and SDIO x2 LCD controller and 3D graphics engine		TI AM335x, TPS65217C, TL5209, DDR3, and over 140 passive components integrated into a single package Access to all AM335x GPIOs and peripherals Up to 1 GB DDR3 PWR in from 5 VDC, USB, or Li-Ion battery PWR out: 1.8 V, 3.3 V, and Sys 400 ball 1.27 mm pitch BGA (20 x 20)
Benefits
Integrates over 140 components into one Compatible with AM335x development tools and software Wide BGA ball pitch allows for low-cost assembly. Significantly reduces design time Decreases layout complexity Saves board space		Increased reliability through reduced number of components Power savings and increased performance Shorter signal trace lengths Reduced parasitics 27 mm x 27 mm package size Temperature range: 0°C to +90°C or -40°C to +85°C

OSD335x System-in-Package (SiP)

	Image	Manufacturer Part Number	Description	Available Quantity	View Details
		OSD3358-512M-BAS	IC MODULE CORTEX-A8 1GHZ 512MB	0	View Details
		OSD3358-512M-IND	IC MODULE CORTEX-A8 1GHZ 512MB	0	View Details

Published: 2016-05-18

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OSD335x C-SiP System-in-Package Family This PTM will introduce the OSD335x C-SiP™, A Complete, System-in-Package including technical details, example applications, and benefits to designers.

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