OSD335x-SM System-in-Package (SiP) Family

Octavo Systems' OSD335x-SM is the smallest SiP device in the OSD335x family

Image of Octavo Systems' OSD335x-SM System-in-Package (SiP) FamilyThe OSD335x-SM family of SiP products from Octavo Systems leverages Texas Instruments’ Sitara™ AM335x processors to allow easy and cost-effective system implementations based on these powerful chips. These SiPs integrate TI’s AM335x processors, TPS65217C PMIC, and TL5209 LDO with up to 1 GB of DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and resistors, capacitors, and inductors into a design-in-ready package of just 21 mm x 21 mm.

This level of integration allows developers using the OSD335x-SM SiP family to concentrate on the essential system features and not spend time on the PMIC power distribution or the rather involved design of the high-speed processor to DDR3 interface.  This SiP can greatly reduce time-to-market for AM335x-based designs by reducing overall size and complexity along with the required supply chain.

OSD335x-SM Block Diagram

Features
  • TI AM335x features:
    • Arm® Cortex®-A8 up to 1 GHz
    • 8-channel 12-bit SAR ADC
    • Ethernet 10/100/1000 x 2
    • USB 2.0 HS OTG + PHY x2
    • MMC, SD, and SDIO x3
    • LCD controller
    • SGX 3D graphics engine
    • PRU subsystem
  • TI AM335x, TPS65217C, TL5209, DDR3, EEPROM and passive components integrated into a single package
  • Access to all AM335x peripherals: CAN, SPI, UART, I2C, GPIO, etc.
  • Up to 1 GB DDR3
  • PWR In: AC adapter, USB, or single cell (1S) Li-Ion / Li-Po battery
  • PWR Out: 1.8 V, 3.3 V, and SYS
  • Selectable AM335x I/O voltage: 1.8 V or 3.3 V
Benefits
  • Integrates over 100 components into one package
  • Compatible with AM335x development tools and software
  • Wide BGA ball pitch allows for low-cost assembly
  • Significantly reduces design time
  • Decreases layout complexity
  • 60% reduction in board space vs discrete implementation
  • Increased reliability through reduced number of components

OSD335x-SM System-in-Package (SiP) Family

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-BSMIC MODULE CORTEX-A8 1GHZ 512MB0View Details
OSD335X-SM EVAL BRDOSD3358-SM-REDOSD335X-SM EVAL BRD0View Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-ISMIC MODULE CORTEX-A8 1GHZ 512MB0View Details

Associated Parts

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-BASIC MODULE CORTEX-A8 1GHZ 512MB0View Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-INDIC MODULE CORTEX-A8 1GHZ 512MB0View Details
Published: 2017-09-18