Data Center Solutions
Molex Seamless Connectivity for Switch/Router, Server, and Storage Applications
Data centers need fast and reliable connectivity to meet the growing demands of 5G, edge computing and an evolving cloud. Molex is a leader in this industry who helps set standards, and applies decades of experience with network, server and storage device connectivity. From passive copper connectors and cable assemblies for Ethernet applications to high performing optoelectronics expertise with our Oplink active transceivers, Molex offers solutions to help you future-proof your data center requirements today.
The SpeedMezz family delivers versatile solutions for high-speed mezzanine, rugged edge card, and lower speed applications. This family offers data rates up to 56 Gbps.
NeoPress High-Speed Mezzanine System offers data rates up to 28 Gbps and enables design flexibility on space-constrained PCBs with low stack heights and tunable differential pairs.
The modular NeoScale Mezzanine System delivers a data rate of 56 Gbps and a high-speed triad wafer design with Solder Charge Technology.
SEARAY Mezzanine Connectors and Jumpers deliver a 12.5-Gbps data rate and a robust solder-charge termination while SEARAY Slim Connectors also improve airflow to address thermal management issues. This family is low-profile with a small footprint.
Avaialble in multiple orientations and PCB thicknesses make EdgeLine connectors ideal for high-signal transmissions and high-density signal applications.
SAS connectors protect storage investments and lower the total cost of ownership through interoperability, compatibility, and scalability.
Impel Backplane solutions enable migrations to faster data rates without an architecture redesign, allowing customers to secure a high-speed.
Electrical perfomance up to 28 Gbps with the Impact zX2 connector, the Impact Backplane System meets next generation high-speed demands.
The zCD Interconnect System delivers 400 Gbps per port with great signal integrity performance and high port and bandwidth density.
The zQSFP+ and QSFP+ Interconnect Systems transmit up to 28 Gbps per-serial-land and offer thermal protection and Temp-Flex and Optical Cable Assemblies. This ensures strong signal.
Superier EMI protection for next-generation Ethernet and Fibre Channel applications, the zSFP+ delivers unparalleled siganl integrity.
iPass connector and cable assemby solutions enable flexible speed, provide higher density, and are compatible for applications ranging from 1.5 G up through 10 G. This covers networking, telecommunications, and data/communications applications.
Improve system airflow and signal integrity (SI) by eliminating midplane connections; iPass+ HD Interconnect System offers low-power optical consumption and long reaches up to 100m.
: Molex’s MXMag RJ45 connectors are robust, high-reliability magnetic jacks designed to meet customer demands for mechanical, electrical, and environmental performance.
Molex modular jacks are avialble in a variety of styles and configurations, such as right-angle, top-entry, bottom-entry, through-hole and SMT.
Nano-Pitch I/O Interconnect System and Cable Assemblies are redefining PCIe and SAS solutions in the storage, mobile and enterprise industries. This interconnect system offers multi-protocol support and enhanced signal integrity.
Designed for high-density applications, QSFP and QSFP+ solutions offer the Electro Magnetic Interference (EMI) shielding cage, active optical cables (AOC), optical MTP cable assembly, and optical loopback.
Molex MTP/MPO Data Center Solutions support the integration of high-performance networks while reducing the number of cables required and, thus, reducing overall system cost and maintenance.
Oplink's SFP and SFP+ products can be used for wireless, datacenter, datacom, and telecom applications, and are compliant to Ethernet, SONET, CPRI, and Fibre Channel standards.
The QSFP28 transceivers by Oplink, a Molex company, support 100 Gbps data rate applications and enable system design with high port density.
DDR3 DIMM Sockets are low-profile SMT and maximize air flow around memory modules. Molex's DDR3 products increase data bandwidth and performance.
Meeting JEDEC specifications, these high-speed sockets offer greater PCB real-estate and cost savings with excellent assembly-processing compatibility.
Molex's miniDIMM Sockets' small form-factor achieves PCB space-saving making this series ideal for tight-spaced memory applications such as high-end computing, personal computers, and telecommunications.