Heat Sink TO-268 (D³Pak) 1.0W @ 20°C Top Mount
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Heat Sink TO-268 (D³Pak) 1.0W @ 20°C Top Mount
573400D00000G
573400D00000G

573400D00000G

DigiKey Part Number
HS525-ND
Manufacturer
Boyd Laconia, LLC
Manufacturer Product Number
573400D00000G
Description
BOARD LEVEL HEAT SINK
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink TO-268 (D³Pak) 1.0W @ 20°C Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Boyd Laconia, LLC
Series
-
Packaging
Bulk
Part Status
Active
Type
Top Mount
Package Cooled
TO-268 (D³Pak)
Attachment Method
SMD Pad
Shape
Rectangular, Fins
Length
0.500" (12.70mm)
Width
1.220" (30.99mm)
Diameter
-
Fin Height
0.401" (10.20mm)
Power Dissipation @ Temperature Rise
1.0W @ 20°C
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 600 LFM
Thermal Resistance @ Natural
14.00°C/W
Material
-
Material Finish
Tin
Base Product Number
573400
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In-Stock: 2,541
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
Quantity
All prices are in AUD
Bulk
QuantityUnit PriceExt Price
1$5.01000$5.01
10$4.42900$44.29
25$4.21840$105.46
50$4.06620$203.31
100$3.91910$391.91
250$3.73288$933.22
500$3.59776$1,798.88
3,000$3.27002$9,810.06
Manufacturers Standard Package
Unit Price without GST:$5.01000
Unit Price with GST:$5.51100
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