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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B60023G | |
|---|---|
DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Bulk | Power Dissipation @ Temperature Rise 1.5W @ 50°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Solder Anchor | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 1,983
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Quantity
All prices are in AUD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $5.40000 | $5.40 |
| 10 | $4.77700 | $47.77 |
| 25 | $4.55040 | $113.76 |
| 50 | $4.38580 | $219.29 |
| 216 | $4.05787 | $876.50 |
| 432 | $3.91095 | $1,689.53 |
| 648 | $3.82744 | $2,480.18 |
| 1,080 | $3.72468 | $4,022.65 |
| Unit Price without GST: | $5.40000 |
|---|---|
| Unit Price with GST: | $5.94000 |
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