24-3518

Aries Electronics

Connectors, Interconnects | IC Sockets

Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
24-3518-10
24-3518-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
290
In Stock
1 : $4.01000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-10T
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
336 : $2.21530
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-00
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
139 : $5.38122
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-11
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
144 : $5.76993
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-101
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
96 : $7.41260
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-10H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
96 : $7.49792
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-10M
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
96 : $8.09438
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-101H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
87 : $8.17943
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-102
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
84 : $8.54881
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-111
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
75 : $10.04507
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-112
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
67 : $10.65045
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-10E
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
64 : $12.32609
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-11H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
58 : $12.43966
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN IC DIP SOCKET 24POS GOLD
24-3518-01
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
0
In Stock
Check Lead Time
42 : $16.09000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
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