GP2S60 Datasheet by Sharp Microelectronics

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SHARP GPZSGO GP2$60 I Descrip on GFZSBD is a compact-package, pnototranslstor output. reflective photclnterrupter, with emitter and detector lacing the same direction in a molding that pmVides nonconlacl sensing. The compact package series is a result oi unique tecnnoiogy, cornoing transfer and injection molding. tnat also blocks Visible light to minimize lalse detection. This phctointerrupter can be ordered in different CTR ranks, and has a thin, leadless (T&R) package. suitable tor reilow soldering. lFeatures 1 Reflective with Phototranslstor Output 2. Highlights. - Compact Size - Surface Mount Type (SMT), reflow soldering . Tape and Reel (TiER) 2 000 pcs per reel 3 Key Parameters- - Optimal Sensmg Distance . 0.5mm - Package: 3.2x1.7x‘l.‘lmm - Visible lignt cut resin to prevent 4. RDHS directive compliant SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Reflective Photointerrupter lAgency approvals/Compliance 1. Compliant with RDHS directive lApplications 1 Detection oi object presence or motion 2. Any application, which pruduction is migrating to 100% surface mount components. Example : printer, optical storage Notice Trie content or data sneet is Sumect to criange wltholfl prior notice. in tne aosence oi confirmation by oeuice specitication sneets. SHARP takes no responsibility tor any delects that may occur in equipment using any SHARP devices sncwn in catalogs, data books. etc Contaci SHARP in mder io opiain ine latest device specification sneets petcre using any SHARP oeyice Street No DaerzimENeA
SHARP GPZSGO I Internal Connection Diagram m Vim 5/ \E G) Collector ‘2) Emitter :2 ® Cathode 2 a C4) Anode I Outline Dimensions (Unit mm) Top View <0 7)="" detector="" center="" (o="" 55=""> W l 1 7 i (0.7) Emitter center (0.63) (0 55) 2.7 Opaque resin molding portion 1' \::J L <16) tc="" “5.="" o="" if="" l"="" p="" |:|piating="" area="" [7="" o7="" a="" pattern="" for="" directional="" g="" distinction="" (nc)="" 9'="" -="" unspeciiieu="" tolerance="" :0="" 15mm="" -="" dimensions="" in="" parenlhesus="" are="" snown="" for="" relerence="" ~="" dimensions="" on="" zne="" outline="" drawing="" is="" we="" maximum="" value="" excluding="" burr.="" -="" the="" dimensions="" shown="" do="" nol="" include="" burr.="" -="" burrs="" dimensiun="" a="" 15mm="" max="" product="" mass="" :="" approx.="" 0.019="" plating="" material="" :="" au="" sneei="" no.2="" daerzmi="" enva="">
SHARP causes I Absolute Maxtmum Ratings (1' 25”C) parameter Symbol Rating Urttt Fttrwartt eurrerrt It 50 mA Input Reverse voltage Vtt 6 V Power dissipation Pr) 75 mW Colleclurremmer voltage ch 35 V Emillercollecmr voltage VECU 5 v Output Collector current 1C 20 mA Cullcclor power d1 ’ 1>¢ 75 mW Total power dissipation Pm. 100 mW Operating temperature '1“0w 72510 +85 ‘C Storage temperature '1‘“; 740 ttr +100 'c “ Soldering lcmpcralurc Tmi 260 5C 'i i-nr 5x or in»: l Electra-optical Characteristics (TF25'C) Parameter Symbol Conditinn MIN 'l'YP, MAX, L'nil Forward vnllagc vr iteztnrr/t , 12 L4 v Input Rcvcrec current IR VR:6V — — 10 MA Output Coneetor dark current It-m Vrr=20V , 1 100 nA Transfer 'lCollccmr Current 15 Ir=4mA, V¢E=ZV 40 as 130 “A chum "peak current 1LEAK 1t=4mA,va=zv , , 500 nA _ _ Rise time t, VCL:2V, [Fianna _ 21) 100 iensncs Response time V 11s Full ttme t Rr,:1k52, (1: 1mm _ 20 100 '7 The condition and umngement or the reflectwe obJee-t me show bcim» the rank Splitting ottoueeter Mule)“ at) shall be executed according to tire taMe below. Rtnk Collector currentt In MAM A A u 65 to ill! '1 wtttwttt mllcuhvc eerttt 0 Test Condition and Arrangement for Collector Current Aiuminum evaporattort 1 d=i mm t giass plate Sheet No DaerzwiENrA
SHARP GPZSSO l Model Line-up Model Nn. Rank Ich) Conduinns GPZSGU A or B 40 to I30 I..=4mA GPZSSDA A 40 to so vm=2v GstsoB B (.5 m 130 Tn=25'C Please contact a Incal SHARP sales representative to see the actlal s‘atus of the produlcllon. Sheet No DaerzquNrA
SHARP GPZSSO Fig.1 Forward Current vs. Ambient Fig.2 Power Dissipation vs. Temperature Ambient Temperature 60 120 E r... 50 g 100 e’. (5 40 fi 80 7mm : 75 E 30 :3 m i; 20 g 40 “‘ S. l() 20 15 ”””””””””””” (l U 725 l) 25 50 75 85 lot) 725 0 25 50 75 85 100 Ambient tempuamm 1‘. CC) Ambient tempcmture 'r. ('C) Fig.3 Forward Current vs. Forward Fig.4 Collector Current vs. Voltage Forward Current 700 vcfzw Ta=25C 600 100 g 500 . E E 5 400 E E E a 300 E '0 = 2 C7 200 100 l 0 0 U 5 l 1.5 l 2.5 3 0 5 lo 15 20 Forwald voltage V, (v) Fonmrd culrcnl I} (mA) Fig.5 Collector Current vs. Fig.6 Relative Collector Current vs. Collector-Emitter Voltage Ambient Temperature 600 120 7 .. Vcrzv TrZS ( / [F4mA 500 it)“ 2 E 5 400 g 30 L4 ‘=‘ g : \ g we a 00 5: 200 § 40 U .1 :4 100 20 I) U i) Z 4 b X 10 725 0 25 50 75 Culiccmpcrmucr voltage VCE (v) Ambient Iempemture '1'. ('0 Sheet No DaerzwiENrA
SHARP GPZSSO Fig.7 Collector Dark Current vs. Ambient Temperature ‘0’“ Vn.=20v 1m dark current I. m) (A) 10’” 107m 0 25 so 75 mo Ambient rcmpcmrum T. (‘C7 Fig.9 Test Circuit for Response Time Reflector Plato V060 \ RL "D ”m g input_ _ o—AAAfi \1 »—0 input ”A Output Output — ,,,,,,,,,, m.” XZ K , W" , "90% (a is 777 7+7 " t' Fig.11 Spectral Sensitivity mo 80 50 f 40 / 20 o J (sou 700 800 900 woo Hut) 1200 r,=25‘c Relative .«emuivny 0/.) Wavelength A (nm) Fig.8 Response Time vs. Load Resistance l 000 mu at i to ion I000 Luad mum-e Kl. (k9) Fig.1!) Relative Collector Current vs. Distance HM) 90 vcfizv l JmA J 80 T, ."C Al evapovalion glass [ll/[1111111 DEE 70 w 50 40 an 20 uuill52253354455 mum hum" sunkur and Aluminum Livapurdlwu glms L (mm7 Fig.12 Detecting Position Characteristics (1) 100 OMS test card .43 1mm m Sensor . \ mu + -0- - Vol. 11' m2\ d: l min g E a 2n 47240121456 OVIS Lard rum/mg distance (mm) Sheet No DaerzwiENrA
SHARP Fig.13 Detecting Position Characteristics (2) GPZSSO 1°“ 0 %an A BU \ E 50 E E 40 g 20 77> 72 r i 0 i 2 I 4 5 h OMS curd moving distance (mm) Remarks : Piease be aware Iha1 all data in the graph are just for reference and not (or guarantee. Sheet No DaerzwiENrA
SHARP 6.22560 lDesign Considerations 0 Design guide 1) Regarding to prevention of malfunction To prevent photointerrupter from faulty operation caused by external iight. do not set the detecting face to the external light. 2) Distance characteristic The distance between the photointerrupter and the obiect to be detected shall be determined the distance by referencing Fig.10 "Relative collector current vs distance". 3) For wiring on a mounting PCB To avoid possibility for short. please do not apply pattern wiring on the back side of the device. 4) Regarding to mounting this product There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc. Please use this product alter weil confirmation of conditions in your production line. This product is not designed against irradiation and incorporates non-coherent IRED. 0 Degradation In the case of long term operation. please take the general IRED degradation (50% degradation over 5 years) into the design consideration. 0 Parts This product is assembled using the below parts. - Light detector (qty. : 1) _ _ ._ Maximum Sensitivit) Sensitivity . , Category Material wavelength (nm) wavelength (um) Response time (its) Phnlnltanstsler silicon (st) 930 700 to 1 200 20 - Light emitter (qty. : 1) Catt: or Material Mmmumngmc‘mm“ 1/0 Frc ucnc (MHZ) ‘ 1‘ y wavelength (nm) ‘4 y Infrared em‘mng dmde Gallium arsenide (GaAs) 950 0.3 (non-coherent) - Material Case PCB Lead frame plating Epoxy resin Black polyphenylene sulfide Gm“ “my mm A“ PM“: Sheet No DaerziotENrA
SHARP GPZSGO . Recommended pattern (Unlt mm) 271 271 7 271 l‘—’l l‘—’l measure lolerance :01 x 2—0 65 '79 2-0 45 2-0 65 m area - Please do not apply the pattern wlrlng to averd lne pasamrlrly olsnprt clrcull Regarding amount olsolder. ll there ls solder leakage m lernnnal wlrlng oallern belween PCB and nousing main body, the reliabillly will be deterlaraled. Please oneck the proper arnounl of solder m advance nol to nave solder leakage mto terminal wlrlng pattern between PCB and housmg mam body. sneel No.2 Daerzml ENVA
SHARP 6.22560 l Manufacturing Guidelines 0 Storage and management after open Storage condition Storage temp.: 5 to 30"C. Storage humidity : 70%RH or less at regular packaging Treatment after opening the moisture-proof package After opening, you should mount the products while keeping them on the condition of 5 to 250 and 60%RH or less in humidity Within days. After opening the bag once even If the prolonged storage is necessary, you should mount the products Within two weeks. And when you store the rest ol products you should put into a DRY BOX. OthenNise alter the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 3°C and 70%FlH or less in humidity. Baking before mounting When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted Within one time. Recommended condition : 125C, 16 to 24 hours *Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fix temporarily the products to substrate Sheet No DaerzioiENrA l o
2
SHARP O Soldering Method Reflow Soldering: Hellow soldering should lollow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please solder Within one time. GPZSSO MAX 240‘C i to 4‘C/s 200>C MAX iss‘c 1 ‘0 473/5 i to Ive/s 25"C iii/1;?“ won 205 ”“st MAX9US Other notice Please take care not to let any external force exert on lead pins. Please test the soldering method in actual condition and make sure the soldering works fine. since the Impact on the lunction between the deVice and PCB varies depending on the cooling and soldering conditions. 0 Cleaning instructions Solvent cleaning : Solvent temperature should be 45"C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : Do not execute ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and lsopropyl alcohol. Sheet No DaerzioiENrA i i
SHARP GPZSGO 0 Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.17Trichloroethane (Methylchloroforrn) Specific brominated flame retardants such as the PBBOs and P885 are not used In this product at all This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). -Lead, Mercury. Cadmium, Hexavalent chromium. Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Intormation Products Regulation (Chinese : Fl] 1’laEfflsifztélifllfifi/Hfia). Toxic and hazardous substances Hexavalent Polybrominated Polybrorninated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (H9) (Cd) 5. (Cr ) (PBB) (PBDE) Photointerrupter v v v v v v 1/ . indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T11363-2006 standard. ‘2 Sheet No.2 Daerzim ENVA
SHARP 6.22560 Direction of product insertion PuH-oul dwrecuon [Packing : 2 OOOpcslreell Storage method Storage candmons should iollow the condrtron shown below. Storage temperature : 5 to 30“C Storage hunidrty : 70%RH or less Sheer No DaerzerNrA IA
SHARP GPZSGO I Important Notices - The circuit application examples in lhis publication are provided to explain representative applications oi SHARP devices and are not inlended lo guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right oia third party resulting from the use of SHARF's devices - Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subiecl lo change without notice. - These specification sheels include materials prolecled under copyright of Sharp Corporation (“Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. - When using this product, please obseNe lhe absolute maximum ratings and the instructions for use outlined in these speciiication sheels, as well as the precaulions mentioned below. Sharp assumes no responsibility for any damage resulting irom use at the product which does not comply with the absolute maximum ratings and lhe instructions included in these specification sheets, and the precautions mentioned below Please do verily the validity at this part alter assembling it in cuslomer's producls, when customer warils lo make catalogue and instruction manual based on the specification sheet ol this part. (Precautions) (1 l This producl is designed for use in the following application areas : -OA equipmenl - Audio visual equipmenl Home appliances Telecommunication equipment (Terminal) Measuring equipment Tooling machines lf the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. Computers (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and saiety in function and precision, such as , Transportation control and saiety equipment (aircrart, train, automobile etc.) Traffic signals Gas leakage sensor breakers Rescue and security equipment Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and saiety in function and precision, such as , Space equipment Telecommunication equipment (for trunk lines) Nuclear power control equipment - Medical equipment Power generation and power transmission control system (Key system) (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above rour paragraphs Please contact and consult with a Sharp sales representative tor any questions about this product. if the SHARP devices listed In this publication fall within the scope or strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices sheet No.2 oaerzmi ENrA

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