FC6946010R Datasheet by Panasonic Electronic Components

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Doc No. TT47EA712652 Revision. 2 Panasonic R m m r ) SSMiniG-FS-B JEITA SC-107C Code SOT-666 Parameter Symbol Rating Unit Drain»source breakdown voltage VDSS 60 V D1 (G2 SZ Gate»source breakdown voltage VGSS : V 6 5 4 Drain current ID 100 mA H H I7 Pulse drain current Do 200 mA Total power dissipation PT 125 mW Channel temperature Tch 150 5 {El Operating ambient temperature Topr ~40 to +85 5 Storage temperature Tstg >55 to +150 5 LI 1 2 3 Established : 2010706725 Revised : 2013707704
Product Standards
MOS FET
FC6946010R
Basic Part Number :
Packaging
000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25C
Page
1. Source(FET1) 4.
Pin name
3. Drain(FET2) 6. Drain(FET1)
Panasonic SSMini6-F3-B
Gate(FET2)
Drain(FET1)Drain(FET2) 6.
SC-107C
Source(FET2)1. Source(FET1) 4.
Code
JEITA
Internal Connection
Source(FET2)
Gate(FET1) 5. Gate(FET2)
2. Gate(FET1) 5.
V
Drain current
C
3.
Drain-source breakdown voltage VDSS
Gate-source breakdown voltage VGSS
Pulse drain current IDp
ID
Rating
60
+85 C
mA
12
100
200
Dual FK390601 (Individual
)
Embossed type (Thermo-compression sealing): 8
of 6
Unit : mm
2.
SOT-666
1
FC6946010
R
Dual N-channel MOS FET
Features
For switching
Low drive voltage: 2.5 V drive
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL : Level 1 compliant)
V
Marking Symbol
:
V6
Parameter Symbol Unit
FET1
FET2
Overall
Total power dissipation
Channel temperature
Operating ambient temperature
Storage temperature Tstg -55 to +150
Topr -40 to
mA
125
Tch 150
mWPT
C
3
(D2)
(S2)
4
1
(S1) 2
(G1)
(D1)
6(G2)
5
FET1
FET2
1.6
1.6
(0.6)
1.2
0.130.2
1.0
(0.5) (0.5)
123
456
Doc No.
TT4-EA-12652
Revision.
2
:
2010-06-25
Revised
:
2013-07-04
Doc No. TT47EAV 12652 Revision. 2 Panasonic Parameter Symbol Condifions Min Typ Max Uni1 Dram-source breakdown vo1lage VDSS 1D :1 mA. VGS : 0 60 V Dram-source culoff currenl IDSS VDS : 60 V. VGS : 0 1.0 p Gale-source culoff currenl 1653 1 t M Gale Ihreshom vo1lage VTH p 0.9 1,2 1.5 V 1D:10mA.VGS: ,5V 8 15 D. 1D:10mA.VGS: ,0V 6 12 0. Forward Iransfer admxuance |st| 10 :10 mA. VDS : 30 V 20 60 mS Inpul capacxlance Ciss 12 pF Oulpul capacxlance Cass 7 pF Reverse Iransfer capacxlance Crss 3 pF VDD:3V.VGS:0103V VDD:3V.VGS:3100V Established : 2010706725 Revised : 2013707704
Product Standards
MOS FET
FC6946010R
FET1,FET2
Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
*1 Turn-on and Turn-off test circuit
Page
Note) 1.
2.
Turn-off time *1 toff VDD = 3 V, VGS = 3 to 0 V
ID = 10 mA
pF
Output capacitance
pF
Turn-on time *1 ton VDD = 3 V, VGS = 0 to 3 V 100 ns
Electrical Characteristics Ta = 25C 3C
Forward transfer admittance |Yfs| ID = 10 mA, VDS = 3.0 V2060mS
2of6
Parameter Symbol Conditions Min Typ Max Unit
Drain-source breakdown voltage VDSS ID = 1 mA, VGS = 0 60 V
A
A
Drain-source cutoff current IDSS 1.0 VDS = 60 V, VGS = 0
Gate-source cutoff current IGSS VGS =
10 V, VDS = 0
ID = 1.0
A, VDS = 3.0 V 0.9
10
1.5
12
V
815
Input capacitance Ciss
VDS = 3 V, VGS = 0, f = 1 MHz
1.2
Drain-source ON resistance RDS(on)1 ID = 10 mA, VGS = 2.5 V
Gate threshold voltage VTH
12
Coss
RDS(on)2 ID = 10 mA, VGS = 4.0 V 6
pF
Reverse transfer capacitance Crss 3
7
ID = 10 mA
ns100
Doc No.
TT4-EA-12652
Revision.
2
:
2010-06-25
Revised
:
2013-07-04
Doc No. TT47EA712652 Revision. 2 Panasonic ‘1 Turn-on and Turn-off test circuii VDD Page 3 of 6 Established : 2010706725 Revised : 2013707704
Product Standards
MOS FET
FC6946010R
*1 Turn-on and Turn-off test circuit
Page 3 of 6
50Ω
VDD=3V
Vin
VGS=0~3V
ID=10mA
RL=300Ω
Vout
D
S
G
50Ω
VDD=3V
Vin
VGS=0~3V
ID=10mA
RL=300Ω
Vout
D
S
G
10%
90%
10%
90%
V GS
V ou
t
ton toff
Doc No.
TT4-EA-12652
Revision.
2
:
2010-06-25
Revised
:
2013-07-04
Doc No. TT47EA712652 Revision. 2 Panasonic Technical Data 1 reference ) // / \ / \\ 4/ Established : 2010706725 Revised : 2013707704
Product Standards
MOS FET
FC6946010R
Technical Data ( reference )
Page
Capacitance - VDS
ID - VDS ID - VGS
VDS - VGS RDS(on) - ID
Dynamic Input/Output Characteristics
4of6
0
0.025
0.05
0.075
0.1
0123
Gate-source voltage VGS (V)
Drain current ID (A)
25
Ta = 85
-40
0
0.05
0.1
0.15
0.2
23456
Gate-source Voltage VGS (V)
Drain-source Voltage VDS (V)
ID = 20 mA
10 mA
5 mA
0.1
1
10
100
0.1 1 10 100
Drain-source Voltage VDS (V)
Capacitance C (pF)
Ciss
Coss
Crss
0
1
2
3
012
Total Gate Charge Qg (nC)
Gate-source Voltage VGS (V)
VDD = 10 V
0
0.005
0.01
0.015
0.02
0 0.1 0.2 0.3
Drain-source voltage VDS (V)
Drain current ID (A)
1.5V
2.5 V
VGS = 2.0 V
4.0 V
1
10
0.01 0.1
Drain current ID (A)
Drain-source On-state Resistance
RDS(on) ()
4.0 V
VGS = 2.5 V
Doc No.
TT4-EA-12652
Revision.
2
:
2010-06-25
Revised
:
2013-07-04
Doc No. TT47EAV 12652 Revision. 2 Panasonlc Technical Data 1 reference 1 \ // \ Established : 2010706725 Revised : 2013707704
Product Standards
MOS FET
FC6946010R
Technical Data ( reference )
Page
Vth - Ta RDS(on) - Ta
PD - Ta
5of
Rth - tsw
6
0
0.5
1
1.5
2
2.5
-50 0 50 100 150
Temperature ()
Gate-source Threshold Voltage (V)
0
2
4
6
8
10
-50 0 50 100 150
Temperature ()
Drain-source On-resistance
RDS(on) ()
VGS = 2.5 V
4.0 V
0
0.05
0.1
0.15
0.2
0 50 100 150
Temperature Ta (C)
Total Power Dissipation PD (W)
1
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Pulse Width tsw (s)
Thermal Resistance Rth (C/W)
Doc No.
TT4-EA-12652
Revision.
2
:
2010-06-25
Revised
:
2013-07-04
Doc No. TT47EA712652 Revision. 2 Panasonic ‘0. 55:0 05 0. 20:0 05 fl 0t00.05“ Established : 2010706725 Revised : 2013707704
Product Standards
MOS FET
FC6946010R
Unit: mm
Page 6
SSMini6-F3-B
6of
Land Pattern (Reference) (Unit : mm)
0.13+0.05
-0.02
1.00
±0.05
1.60
±0.05
(0.5) (0.5)
1.60
±0.05
0 to 0.05 0.20
±0.05
0.55
±0.05
0.20+0.05
-0.02
1.20
±0.05
(0.27)
123
456
(5°)
(5°)
0.4
0.35
1.6
0.50.5
Doc No.
TT4-EA-12652
Revision.
2
:
2010-06-25
Revised
:
2013-07-04
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents. the laws and regulations of the exporting country. espeCially. those With regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore. no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment. communications equipment. measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications. moreover please exchange documents separately on terms of use etc,: Special applications (such as for in-vehicle equipment. airplanes. aerospace. automotive equipment. traffic signaling equipment. combustion equipment. medical equipment and safety devices) in which exceptional quality and reliability are required. or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. (4) The products and product speCifications described in this book are subject to change wtthout notice for modification and/or improvement, At the final stage of your design. purchasing. or use of the products, therefore. ask for the most up- to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially. please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode»switching. Other- wtse. we Will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design. arresting the spread of tire or preventing glitch are recommended in order to prevent physical injury. fire. somal damages. for example. by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD. EOS. thermal stress and mechanical stress) at the time of handling. mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required. satisfy the conditions. such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination. please understand that customers will bear the burden. (B) This book may be not reprinted or reproduced whether wholly or partially. without the prior written permission of our company.
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information de-scribed in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-
to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
No.010618

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