MDCTITl-Z
Technical Data Sheet
LOCTITE C 502
September-2014
PRODUCT DESCRIPTION
LOCTITE C 502 provides the following product characteristics:
Technology Solder wire - Cored
Activity Medium
Product Benefits • No clean
• Clear residue
• Good wetting
• Fast soldering
• Mild odor
• Pb-free and SnPb alloys available
IPC/J-STD-004
Classification
ROM1
Application Soldering
Surface Finishes Copper, Brass and Nickel
LOCTITE C 502 cored solder wire has been specially
formulated to complement no clean wave and reflow soldering
processes. LOCTITE C 502 is also well suited for soldering
applications requiring high melting temperature alloys.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead • SN63
• SN60
• SN62
Alloys - Lead Free • 96SC (SAC387)
• 97SC (SAC305)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
Acid Value 156 to 172 mg KOH/g
Halide content 0.2%
Flux Content (%) 2.7
ALLOYS:
The alloys used in LOCTITE C 502 cored solder wires conform
to the purity requirements of the common national and
international standards.
FLUX:
LOCTITE C 502 solid flux is based on modified rosin and
carefully selected activators. In practice they exhibit a mild
rosin odor and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with LOCTITE C 502 does not require any special
methods or deviation from standard hand soldering practices.
Soldering Iron:
Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
Wipe the tip on a clean, damp sponge before re-tinning
with LOCTITE C 502 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply LOCTITE C 502 flux cored wire to a part of the joint
surface away from the soldering iron and allow to form a
joint fillet. This will be virtually instantaneous. Do not
apply excessive solder to the joint as this will not improve
joint integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
LOCTITE C 502 flux cored solder wire has been formulated to
leave amber flux residues and resist spitting and fuming. In
most industrial and consumer electronics applications,
cleaning will not be required. The product may, therefore, be
used to complement a no-clean wave soldering or reflow
process or to allow repairs to cleaned boards without the need
for a second cleaning process. In high-reliability applications,
the residues should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
TDS LOCTITE C 502, September-2014
RELIABILITY PROPERTIES
J-STD-004 Solder spread mm² 310
Corrosion Test Pass
SIR (without cleaning) IPC-SF-818 Class 3 Pass
Bellcore
TR-NWT-000078
Pass
Electromigration (without cleaning) Bellcore
TR-NWT-000078
Pass
Classification EN29454-1 1.1.2
IPC-SF-818 MR3CN
J-STD-004 ROM1
PACKAGING
LOCTITE C 502 is available in various diameters, flux
percentages, and reel sizes.
DATA RANGES
The data contained herein may be reported as a typical value
and/or a range. Values are based on actual test data and are
verified on a periodic basis.
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Not for Product Specifications
The technical information contained herein is intended for reference
only. Please contact Henkel Technologies Technical Service for
assistance and recommendations on specifications for this product.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
µm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including
the recommendations for use and application of the product are based
on our knowledge and experience of the product as at the date of this
TDS. The product can have a variety of different applications as well as
differing application and working conditions in your environment that
are beyond our control. Henkel is, therefore, not liable for the suitability
of our product for the production processes and conditions in respect
of which you use them, as well as the intended applications and
results. We strongly recommend that you carry out your own prior trials
to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or
any other written or oral recommendation(s) regarding the concerned
product is excluded, except if otherwise explicitly agreed and except in
relation to death or personal injury caused by our negligence and any
liability under any applicable mandatory product liability law.
In case products are delivered by Henkel Belgium NV, Henkel
Electronic Materials NV, Henkel Nederland BV, Henkel
Technologies France SAS and Henkel France SA please
additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal
following disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including
the recommendations for use and application of the product are based
on our knowledge and experience of the product as at the date of this
TDS. Henkel is, therefore, not liable for the suitability of our product for
the production processes and conditions in respect of which you use
them, as well as the intended applications and results. We strongly
recommend that you carry out your own prior trials to confirm such
suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or
any other written or oral recommendation(s) regarding the concerned
product is excluded, except if otherwise explicitly agreed and except in
relation to death or personal injury caused by our negligence and any
liability under any applicable mandatory product liability law.
In case products are delivered by Henkel Corporation, Resin
Technology Group, Inc., or Henkel Canada, Inc.the following
disclaimer is applicable:
The data contained herein are furnished for information only and are
believed to be reliable. We cannot assume responsibility for the results
obtained by others over whose methods we have no control. It is the
user's responsibility to determine suitability for the user's purpose of
any production methods mentioned herein and to adopt such
precautions as may be advisable for the protection of property and of
persons against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation specifically
disclaims all warranties expressed or implied, including
warranties of merchantability or fitness for a particular purpose,
arising from sale or use of Henkel Corporation’s products. Henkel
Corporation specifically disclaims any liability for consequential
or incidental damages of any kind, including lost profits. The
discussion herein of various processes or compositions is not to be
interpreted as representation that they are free from domination of
patents owned by others or as a license under any Henkel Corporation
patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application
before repetitive use, using this data as a guide. This product may be
covered by one or more United States or foreign patents or patent
applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are
trademarks of Henkel Corporation in the U.S. and elsewhere. ®
denotes a trademark registered in the U.S. Patent and Trademark
Office,
Reference 0.2
TDS LOCTITE C 502, September-2014
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