ECMF02-2AMX6 Datasheet by STMicroelectronics

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March 2017
DocID17815 Rev 3
1/13
This is information on a product in full production.
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ECMF02-2AMX6
Common mode filter with ESD protection for USB 2.0 and
MIPI D-PHY/MDDI interface
Datasheet - production data
Features
High common mode attenuation:
-34 dB at 900 MHz
-20 dB between 800 MHz and 2.2 GHz
Large bandwidth: 1.7 GHz
Very low PCB space consumption
Thin package: 0.55 mm max.
RoHS package
High reduction of parasitic elements through
integration
Complies with the following standards
IEC 61000-4-2 (exceeds level 4)
±15 kV (air discharge)
±8 kV (contact discharge)
Applications
Mobile phones
Notebook, laptop
Portable devices
PND
Description
The device is a highly integrated common mode
filter designed to suppress EMI/RFI common
mode noise on high speed differential serial
buses like MIPI D-PHY, MDDI or USB 2.0.
Also it can protect and filter one differential lane.
Figure 1: Pin configuration
QFN-6L
D+ D+
GND NC
D-
ESD
ESD
ESD
ESD
D-
parameter Breakdown vonage Leakage cunem @ vRM Siand-o" voltage Breakdown Current Van VRuI lm m
Characteristics
ECMF02-2AMX6
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DocID17815 Rev 3
1 Characteristics
Table 1: Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
VPP
Peak pulse voltage
IEC 61000-4-2:
Contact discharge
Air discharge
8
20
kV
IDC
Maximum DC current
200
mA
Tj
Maximum junction temperature range
-55 to +125
°C
Tstg
Storage temperature range
-55 to +150
TL
Maximum temperature for soldering during 10 s
260
Figure 2: Electrical characteristics (definitions)
Table 2: Electrical characteristics (Tamb = 25 °C)
Symbol
Test condition
Min.
Typ.
Max.
Unit
VBR
IR = 1 mA
6
V
IRM
VRM = 1.5 V per line
100
nA
RDC
DC serial resistance
1.8
2.5
Ω
Compliant with USB 2.0 high speed sync field test (150 mV diff).
ECMF02-2AMX6
Characteristics
DocID17815 Rev 3
3/13
1.1 Characteristics (curves)
Figure 3: Differential insertion losses
(Z0 diff = 100 Ω)
Figure 4: Differential insertion losses
(Z0 diff = 90 Ω)
Figure 5: Common mode attenuation (Z0 com = 50 Ω)
Figure 6: Common mode attenuation (Z0 com = 45 Ω)
Figure 7: Differential return loss (Z0 diff = 100 Ω)
Figure 8: Differential (ZDD21) and common mode
(ZCC21) impedance versus frequency
300k 1M
SDD21 (dB)
3M 10M 30M 100M 300M 1G 3G
-3
-2.8
-2.6
-2.4
-2.2
-2
-1.8
-1.6
-1.4
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
F(Hz)
300k 1M 3M 10M 30M 100M 300M 1G 3G
- 3
- 2.8
- 2.6
- 2.4
- 2.2
- 2
- 1.8
- 1.6
- 1.4
- 1.2
- 1
- 0.8
- 0.6
- 0.4
- 0.2
0
F(Hz)
SDD21 (dB)
300k 1M 3M 10M 30M 100M 300M 1G 3G
- 36
- 34
- 32
- 30
- 28
- 26
- 24
- 22
- 20
- 18
- 16
- 14
- 12
- 10
- 8
- 6
- 4
- 2
0
F(Hz)
SCC21 (dB)
300k 1M 3M 10M 30M 100M 300M 1G 3G
- 36
- 34
- 32
- 30
- 28
- 26
- 24
- 22
- 20
- 18
- 16
- 14
- 12
- 10
- 8
- 6
- 4
- 2
0
F(Hz)
SCC21 (dB)
300k 1M 3M 10M 30M 100M 300M 1G 3G
- 40
- 35
- 30
- 25
- 20
- 15
- 10
- 5
0
SDD11
SDD22
F(Hz)
SDD11 / SDD22 (dB)
1E4 ZDD21 and ZCC21 ()
1E3
1E2
1E1
1E7 1E8 1E9 6E9
ZDD ZCC
F(Hz)
Characteristics
ECMF02-2AMX6
4/13
DocID17815 Rev 3
0.2V/div
342.2ps/div
Figure 9: ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 10: ESD response to IEC 61000-4-2
(-8 kV contact discharge)
Figure 11: Low power pulse response
Figure 12: USB 2.0 HSync measurement result
Figure 13: USB 2.0 eye diagram, mask T1
PIN 6
PIN 5
20 V/Div 20 ns/Div
50 V/Div 20 ns/Div
C2
C3
82.3 V
112 V
PIN 6
-71.1 V
-115 V
PIN 5
20 V/Div 20 ns/Div
50 V/Div 20 ns/Div
C2
C3
500 mV/div
500 mV/div
200 ns/di v
200 ns/div
Pulse: 50 ns, tr= tf= 5 ns
200 mV/Div
200 mV/Div 5 ns/Div
5 ns/Div
mmnmxs EcMFoorAAMxn m we . \ w \ EM ma mms awn/2mm- ammm )«w :m m m um USE Transcewer ESDALcsvt-wz : Vaus ESDAxxP senes MmrorUSB E]
ECMF02-2AMX6
Application schematics
DocID17815 Rev 3
5/13
2 Application schematics
Figure 14: MIPI D-PHY
Figure 15: USB 2.0
Package information
ECMF02-2AMX6
6/13
DocID17815 Rev 3
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
3.1 QFN-6L package information
Figure 16: QFN-6L package outline
Table 3: QFN-6L package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.02
0.05
0.00
0.0008
0.0009
b
0.18
0.25
0.30
0.007
0.010
0.012
D
1.65
1.70
1.75
0.065
0.067
0.069
E
1.45
1.50
1.55
0.057
0.059
0.061
e
0.45
0.50
0.55
0.018
0.020
0.022
L
0.30
0.40
0.50
0.012
0.016
0.020
E] a 25 9 oasxfl ‘ s (017751 A as mum 4"; a 7 mom v «25 (0 m5) Mammum cover tape lmcknsss a 1 mm / Sprocket ho‘e ./ men / M" 14.4 \E 20 2 mm 205 32 205,/ /
ECMF02-2AMX6
Package information
DocID17815 Rev 3
7/13
Figure 17: Footprint recommendations,
dimensions in mm (inches)
Figure 18: Marking layout
Figure 19: Package orientation in reel
Figure 20: Tape and reel orientation
Figure 21: Reel dimensions in mm
Figure 22: Inner box dimension definition in mm
XX : Marking
Y : Year
Q : Quarter
X X
Y Q
pin 1
Pin 1 located according to EIA-481
Note: Pocket dimensions are not on scale
Pocket shape may vary depending on package
‘ P0 . 21 D0 H. i /o o o O Q o o‘o~-o~~1— ----------- \ - I F W i i 1 ‘ o o 30 O\® 7777777777 i/ I I K0 3 P1 3 3 1 P2 Q D1 User direction of unreeling > Note: Pocket dimensions are not on scale Pocket shape may vary depending on package
Package information
ECMF02-2AMX6
8/13
DocID17815 Rev 3
Figure 23: Tape dimension definitions
Table 4: Tape mechanical data
Ref.
Dimensions
Millimeters
Min.
Typ.
Max.
P0
3.9
4.0
4.1
P1
3.9
4.0
4.1
P2
1.95
2
2.05
Ø D0
1.5
1.55
1.6
Ø D1
1
F
3.4
3.5
3.6
K0
0.65
0.7
0.75
W
7.7
8
8.3
7m" —> 600 um zsoum - Stenci‘ window Foutprint 19 as 07 E]
ECMF02-2AMX6
Recommendation on PCB assembly
DocID17815 Rev 3
9/13
4 Recommendation on PCB assembly
4.1 Stencil opening design
1. General recommendation on stencil opening design
a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).
2. General design rule
a. Stencil thickness (T) = 75 ~ 125 μm
b. Aspect ratio = 𝑊
𝑇≥ 1.5
c. Aspect area = 𝐿×𝑊
2𝑇(𝐿+𝑊)≥ 0.66
3. Reference design
a. Stencil opening thickness: 100 μm
b. Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 24: Recommended stencil window position
Figure 25: Recommended stencil window position
Recommendation on PCB assembly
ECMF02-2AMX6
10/13
DocID17815 Rev 3
4.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 μm.
4.3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system,
not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
4.4 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
4.5 Layout recommendation
Connection to PCB GND must be as short as possible to ensure ESD remaining voltage
and SCC21 performance.
Figure 26: Layout recommendation
Vias to GND plane
Zdiff according to
the application
E] Temperature (“0) Twme (5) 90 120 150 180 210 240 270 300
ECMF02-2AMX6
Recommendation on PCB assembly
DocID17815 Rev 3
11/13
4.6 Reflow profile
Figure 27: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement. Maximum soldering profile corresponds to the latest
IPC/JEDEC J-STD-020.
Ordering information
ECMF02-2AMX6
12/13
DocID17815 Rev 3
5 Ordering information
Figure 28: Ordering information scheme
Table 5: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
ECMF02-2AMX6
KD(1)
QFN-6L
3.35 mg
3000
Tape and reel 7"
Notes:
(1)The marking can be rotated by 90° to differentiate assembly location
6 Revision history
Table 6: Document revision history
Date
Revision
Changes
10-Aug-2010
1
Initial release.
28-Jun-2011
2
Added Complies with the following standards:, and Air discharge
parameter in Table 1. Removed Figure 6. Sdd41 / Sdd23 inter-lane
differential cross-coupling measurements.
01-Mar-2017
3
Updated marking in Figure 17 and Figure 18 and inserted Figure 9.
Removed Figure 11 and Figure 14.
Updated cover page, Section 3.1: "QFN-6L package information",
Section 1: "Characteristics" and Table 5: "Ordering information".
ECMF 02 2 A xxx
Function
ESD common mode filter
Number of lines
02 = 2 lines
Number of ESD protected lines
2 = 2 ESD protected lines
Version
Package
MX6 = QFN-6L
ECMF02-2AMX6
DocID17815 Rev 3
13/13
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