SML-P24 Series Datasheet by Rohm Semiconductor

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SML-P24MUW(R) lFeatures 0 Ultra compact and thin Zicolor type LED 1.0><1.0, t:o.2mm="" 0="" low="" height="" contributes="" to="" the="" improvement="" of="" coior="" mixture="" data="" sheet="" i="" size="" 00="" i="" dimensions="" i="" recommended="" solder="" pattern="" h="" i="" specifications="" x1="" :="" duty="" 1/10,="" lkhz="" *2="" measurement="" toierance="" ilnm="" ‘picoledtm="" i5="" rohm‘s="" pending="" trademark.="">
SML-P24MUW(R)
Data Sheet
Features
■外観図
Ultra compact and thin 2-color type LED 1.0×1.0, t=0.2mm
Low height contributes to the improvement of color mixture
Size
Recommended Solder Pattern
Specications
Typ. I
F
Max. V
R
Min.*
2
Typ.
Max.*
2
I
F
Min. Typ. I
F
(V) (mA) (µA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
2.2 569 572 575 10 21
2.1 615 620 625 25 52
*3 : For the case of lighting a single color. When lighting two colors at the same time, the absolute maximum ratings of each color will be 50% of it.
*PICOLED
TM
is ROHM's pending trademark.
      PICOLED
TM
-Duo
Reverse
Operating Temp.
Storage Temp.
SML-P24MUW (R)
AlGaInP
Yellowish Green
54 20 100*
1
5-40 +85 -40+100
Red 52 20
I
FP
(mA)
V
R
(V)
Current
Current
Voltage
P
D
(mW)
I
F
(mA)
Part No.
Chip Structure
Absolute Maximum Ratings (Ta=25ºC) *
3
Electrical and Optical Characteristics (Ta=25ºC)
Power
Forward Peak Forward
Emitting
Color
Forward Voltage V
F
Reverse Current I
R
Dominant Wavelength λ
D
Luminous Intensity I
V
Dissipation
T
opr
(ºC) T
stg
(ºC)
20 10 5 20
*1 : Duty 1/10, 1kHz *2 : Measurement tolerance: ±1nm
Tolerance : ±0.2
(unit : mm) (unit : mm)
1010 (0404)
1.0×1.0mm (t=0.2mm)
Color U
M
RG
( 1) ( 2 )
( 3 )( 4)
( 3)( 4 )
( 1 ) ( 2)
( 4) ( 3 )
0.4
(0.08)
Cathode Mark
1
0. 9
( 2 )
0. 3
(1)
0.2
+0.05
-0.02
0. 6
R
0.9
G
1
0.5 0.4 0.5
0.3 0.5
0.5
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 1/9 2019.2 - Rev.008
l Electrical Characteristics Curves Fig.1 Forward Current - Forward Voltages Fig.3 Luminous Intensity - Forward Current |_l_L 7 /7 747, Reference Fig.2 Luminous Intensit y. Atmosphere Temperature |:| Fig.4 Derating I SML
    
[Data Sheet]
Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
     Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-P24MUW(R) series]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 5 10 15 20
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100
1
10
100
1.5 2.0 2.5
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=20mA
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Ta=25ºC
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SML-P24MUW (R) (U)
SML-P24MUW (R) (M)
SML-P24MUW (R)
SML-P24MUW (R) (U)
SML-P24MUW (R) (M)
0
10
20
30
-40 -20 0 20 40 60 80 100
SML
-P24MUW (R)
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 2/9 2019.2 - Rev.008
I Viewing Angle Reference
    
[Data Sheet]
Viewing Angle
Reference
[SML-P24MUW(R) series]
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
SML-P24MUW (R) (M)
SML-P24MUW (R) (U)
SML
-P24MUW (R) (M)
SML
-P24MUW (R) (U)
050 100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100 50
X
X X
X -
--
- Y
YY
Y
YELLOW
GREEN RED
スキャン方向
(Scanning Direction)
X
XX
XY
YY
Y
050 100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100 50
X'
X' X'
X' -
--
- Y'
Y'Y'
Y'
スキャン方向
(Scanning Direction)
RED
X'
X'X'
X' Y'
Y'Y'
Y'
YELLOW
GREEN
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 3/9 2019.2 - Rev.008
l Rank Reference of Brightness“ *Measurement tolerance : i10% 40~52 53~10 mus 15~25 25~40 «we: exam: 90~140 mu~2zu zzu~2ao VeHuwxsh Gveen
    
[Data Sheet]
Rank Reference of Brightness*
*Measurement tolerance±10%
[SML-P24MUW(R) series]
(Ta=25ºC, IF20mA)
K
L
M
N
P
Q
R
S
T
U
4.06.3 6.310 1016 1625 2540 40 63 63100 90140 140 220 220360
Red
Yellowish Green
Rank
Iv (mcd)
SML-P24MUW (R)
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©2019 ROHM Co., Ltd. All rights reserved 4/9 2019.2 - Rev.008
l Taping(T86) EeE‘ crass secllorial View A A‘ crass sediunal VlEW paganunmmuH I Part NO. Construction WE/B/E germ: Emlttirig colur w iim Wm LED) (Brightness —_I:—_I: ‘5 % % m 1 Elm 5 t=u 2mm 0 R T we a l m w Milknv whim r37 m 2 uz m a Elatk 1 m 3 D Orange 7 m 7 v3 Yellow 01 T v2 Yellow riuticel 51 series, 81 3e. T v Yellow me A; 7 w Yellow m T m Yelluwiah green K1 M WWW a 5qu W mam/amt I- needed I Packing Specification ROHM LED products are being shipped With desiccant (silica gel) included in moisture-proof bags. Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request. Please contact the nearest sales office or distributer if necessaw.
    
[Data Sheet]
Taping(T86)
Unit:mm
Note)Tolerance is within ±0.1mm unless
otherwise specified.
Part No. Construction
Packing Specication
ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags.
or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
[SML-P24MUW(R) series]
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags
B
B'
A A'
A- A'
B- B'
( )
引き出し
φ13
φ1.5
+0.1
4
±0 . 1
1.12
±0.05
±1
11.4
2
±0.05
1.75
±0.1
RG
1. 1 2
±0. 0 5
0.28
±0. 0 3
2
±0 . 0 5
3.5
±0. 0 5
φ0.5
±0 . 0 5
8
φ1 8 0
0
-3
φ60
0
+1
0
包装数量
5000pcs/リール
B-B' cross sectional view
Description
A-A' cross sectional view
Packing quantity
5000pcs/reel
Pull
direction
*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign
WB/B/E series. Emitting color WB/B/E series. (for white LED (Brightness Rank)*
Series name Package Type Chip type Emitting Color Resin Color Taping Specification Special Control Symbol
SML
P1 0 V T
E1 1 U W
D1
2U2 B
H1
3D
M1
4Y3
01 5Y2 noticeS1 series81 seires
Z1/ZN
6Y
A1 7W
81/82
8
M2
K1 M
*Concerning the Brightness rank.
S1 F
*Please refer to the rank chart above for
P2 P
luminous intensity classification.
52 E
*Part name is individual for each rank.
P34
B
*When shipped as sample,the part name will
P36 WB
be a representative part name.
VN
T
General products are free of ranks.
RGB
Please contact sales if rank appointment
SCM 01
is needed.
2S M L - P 6 R
Standard Type
Red
Transparent Colorless
T86
Cathode at sprocket hole side(the top)
4 MU W T 8 NP
High Brightness type
Red 1
Orange
For white LED,
csthode at sprocket hole side
Cathode at sprocket hole side(the back)
3
Yellow
Chip LED
1.0x0.6 t=0.2mm
1.6x0.8 t=0.36mm
1.6x0.8 t=0.55mm
Black
2.0x1.25 t=0.8mm
Ultra High Brightness type
Low Current Type
Red
Milkey White
T87
Anode at sprocket hole side(the top)
3.0x2.0 t=1.3mm
Yellow
3.5x2.8 t=1.9mm
Yellow T86
1.6x1.15 t=0.55mm
Yellow T68
Cathode at sprocket hole side(the top)
3.4x1.25 t=1.1mm
Yellowish green
4.5x2.0 t=0.6mm
Yellowish green
3.2x1.6 t=1.85mm
Green
1.0x1.0 t=0.2mm
Green
1.3x1.5 t=0.6mm
Green
1.0x1.0 t=0.2mm
Blue
1.5x1.0 t=0.2mm
White
3.5x2.8 t=0.6mm
Phototransistors
Red/Green/Blue
Chip LED
3.0x1.5 t=2.2mm
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 5/9 2019.2 - Rev.008
Precau n (Surface Mount Device) 1. Storage If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. Therefore, the package is waterproof. Please use the product following the conditions: 'Using Conditions Classification Humidity Expiration Date Remark Within 1 year from Receiving Please storing in the airtight container with our desiccant (silica gel) 'Baking Bake the product in case of below: ®The expiration date is passed. ®The color of indicator (silica gel) turned from blue to colorless or from green to pink. (Even if the product is within the expiration date.) 'Baking Conditions Temperature Time Humidity 60i3°C 12~24h Below 20%RH ~Bake products in reel. ~Reel and embossed tape are easy to be deformed when baking, so please tw not to apply stress on it. ~Recommend bake once. 2. Application Methods 2 7 1. Precaution for Drive System and Off Mode Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially, for the products with the Ag7paste used in the die bonding, there's high possibility to cause electro migration and result in function failure. 2 7 2. About Derating It is considered that derating characteristics will not result in LED chip's electrical destruction. Even within the derating, the reliability and luminous life can be affected depending on operating conditions and ambient environment. So we would be appreciate it if you can confirm with your application again. 2 7 3. About product life Depending on operating conditions and environment(applied current, ambient temperature and humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even within the specification conditions. Please contact our sales office if you use it for the following applications. ®It requires long luminosity life ®It is always lit 2 7 4. Applied Stress on Product No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, please pay attention to the overstress on it which may influence its reliability. 2 7 5. Usage The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier, Switching and so on.
    
[Data Sheet]
Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
Using Conditions
Baking
Bake the product in case of below:
The expiration date is passed.
The color of indicator (silica gel) turned from blue to colorless or from green to pink.
Baking Conditions
Application Methods
Precaution for Drive System and O Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, theres high possibility to cause electro migration and result
About Derating
 It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
It requires long luminosity life
It is always lit
Applied Stress on Product
No resin hardening agent such as filler is used in the sealing resin of the product.
Therefore, please pay attention to the overstress on it which may influence its reliability.
Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
Please storing in the airtight container
Temperature
Time
Humidity
Bake products in reel.
Reel and embossed tape are easy to be deformed when baking,
[SML-P24MUW(R) series]
Precaution (Surface Mount Device)
Classification
Temperature
Humidity
Expiration Date
Remark
①Before using 5〜30℃ 30〜70%RH
Within 1 year
from Receiving Storage with waterproof package
Remark
so please try not to apply stress on it.
Recommend bake once.
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
in function failure.
②After opening
package
5〜30℃ Below 70%RH Within 168h
with our desiccant (silica gel)
(Even if the product is within the expiration date.)
60±3℃
12〜24h
Below 20%RH
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 6/9 2019.2 - Rev.008
3 . Others 3 7 1. Surrounding Gas Not e that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of cause die bonding (Ag7paste) materials. All of the above will function failure of the products. Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). 3 7 2. Electrostatic Damage The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance value of electrostatic discharge and it is recommended to introduce the ESD protection circuit. The resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our Sales staffs for inquiries. 3 7 3. Electromagnetic Wave Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED, therefore please evaluate before using it.
    
[Data Sheet]
Others
Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
Therefore, please pay attention to the storage environment for mounted product (concern the
Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
[SML-P24MUW(R) series]
the products.
generated gas of the surrounding parts of the products and the atmospheric environment).
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©2019 ROHM Co., Ltd. All rights reserved 7/9 2019.2 - Rev.008
4 . Mounting 4 7 1. Soldering 'No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product's reliability. 'The product is not guaranteed for flow soldering. 'Do not expose the product in the environment of high temperature (over 100”C) or rapid temperature shift (within 3"C/sec. of temperature gradient) during the flow soldering of surrounding pars. In case of carn/ing out flow soldering of surrounding parts without recommended conditions, please contact us for inquiries. -Please set appropriate reflow temperature based on our product usage conditions and specification. 'The max for refiowing is 2 times, please finish the second reflow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. 'Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. 'For our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its reliability.Therefore, please be informed, concerning it before using it. 4 7 2. Automatic Mounting 4 7 2 7 1. Silicon Resin Sealing Product The sealing resin of LED is vew soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. 4 7 2 7 2. Mini Package Smaller than 1608 size 'Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of the mounter to control the product stabilization. In addition, it is recommended to set ionizer to prevent electrostatic charge. 4 7 3. Mountin Location The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. /—\// D A Slit E El] / Stress strength according to J o 9 o o t 1 O O O O ( he mounting posmon: A>B>C>D 1 .3 [El B circuit Board Brake 474. Mechanical Stress after Mountin The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on product. 4 7 5. Solderin Pattern for Recommendation We recommend the soldering pattern that shows on the right. It will be different according to mounting situation of circuit board, therefore, please concern before designing. >1
    
[Data Sheet]
Stress strength according to
he mounting position:
ABCD
so please pay attention to the touch on product.
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
 and rear electrodes but not for formation of solder llet.
--. Mini Package (Smaller than 1608 size)
Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
The max for reowing is 2 times, please nish the second reow soldering and ow soldering
with other parts within the usage limitation after open the moistureproof package.
Compare with N2 reow, during air reow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
 one of its specic characteristics is that solder will penetrate into LED. Thus, there's high possibility
The product is not guaranteed for ow soldering.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
Please set appropriate reow temperature based on our product usage conditions and specication.
[SML-P24MUW(R) series]
Mounting
. Soldering
. Automatic Mounting
--. Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress
directly on the sealing section.
Soldering Pattern for Recommendation
finally has bad influence on the products reliability.
to prevent electrostatic charge.
. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
No resin hardening agent such as ller is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process and
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
For our product that has no solder resist, because of its solder amount and soldering conditions,
that will influence its reliability.Therefore, please be informed, concerning it before using it.
Do not expose the product in the environment of high temperature (over 100) or rapid temperature
shift (within 3/sec. of temperature gradient) during the flow soldering of surrounding parts.
Mask open area ratio:80%
Mask thickness:80〜100μm
Reference
0.5 0.4 0.5
0.3 0.5
0.5
(Unit : mm)
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©2019 ROHM Co., Ltd. All rights reserved 8/9 2019.2 - Rev.008
4 7 6. Reflow Profile For reflow profile, please refer to the conditions below:(>2<) lmeaning="" of="" marks,="" conditions="" mark="" meanings="" conditions="" 7="" tr="" ten“="" 180°c="" e="" t?="" ate/at="" tsmm="" 140°c="" g="" ts="" ts="" over="" 605ec.="" ‘e‘="" m"="" '="" ate/at="" tl="" reference="" temperature="" 230n260°c="" i="" ten="" :="" tl="" retention="" time="" for="" tl="" within="" 405ec.="" gg="" tp="" peak="" temperature="" 260°c(max)="" 1.95:0="" _="" ___="" ___="" tp="" within="" 105ec.="" ‘="" atr/at="" temperature="" rising="" rate="" under="" 3°c/sec.="" —l=""> ATD/At Over -3°C/sec. >I
    
[Data Sheet]
SOLDER USED
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
400 within 3 sec.
Heating on PCB pattern, not direct to the
Above conditions are for reference. Therefore, evaluate by customers own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
LED products do not contain reinforcement material such as a glass fillers.
Peak temperature
Time for peak temperature
Temperature rising rate
Within 40sec.
260(Max)
Within 10sec.
Under 3/sec.
Time from Tsmin to Tsmax
Reference temperature
Mark
Ts
max
Ts
min
t
s
T
L
Conditions
Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
[SML-P24MUW(R) series]
Reow Prole
For reow prole, please refer to the conditions below:()
Meaning of marks, Conditions
180℃
140℃
Over 60sec.
230260
Meanings
Maximum of pre-heating temperature
Minimum of pre-heating temperature
ΔT
D
/Δt
Temperature decreasing rate
Retention time for TL
Over -3/sec.
t
L
T
P
t
P
ΔT
R
/Δt
Ultrasonic Cleaning
15WBelow 1 liter (capacity of tank)
Drying
Under 100 within 3 minutes
furnaces vary by customers own conditions.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a) Heating method
b)
Handling after
soldering
Please handle after the part temp.
goes down to room temp.
Temperature
Under 30 within 3 minutes
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
LED. (Fig-1)
Sn-CuSn-Ag-CuSn-Ag-Bi-Cu
HAND SOLDERING CONDITION
Fig-1
SOLDERING
LAND
SOLDERING IRON
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©2019 ROHM Co., Ltd. All rights reserved 9/9 2019.2 - Rev.008
ROHm SEMICONDUCTOR
R1102
A
www.rohm.com
© 201 ROHM Co., Ltd. All rights reserved.
Notice
ROHM Customer Support System
http://www.rohm.com/contact/
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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Datasheet
Part Number SML-P24MUW(R)
Package SML-P24
Unit Quantity 5000
Minimum Package Quantity 5000
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
SML-P24MUW(R) - Web Page
Distribution Inventory
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