NSI45020AT1G Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 6 1Publication Order Number:
NSI45020A/D
NSI45020AT1G
Constant Current Regulator
& LED Driver
45 V, 20 mA + 10%, 460 mW Package
The linear constant current regulator (CCR) is a simple, economical
and robust device designed to provide a cost−effective solution for
regulating current in LEDs (similar to Constant Current Diode, CCD).
The CCR is based on Self-Biased Transistor (SBT) technology and
regulates current over a wide voltage range. It is designed with a
negative temperature coefficient to protect LEDs from thermal
runaway at extreme voltages and currents.
The CCR turns on immediately and is at 25% of regulation with
only 0.5 V Vak. It requires no external components allowing it to be
designed as a high or low−side regulator. The high anode-cathode
voltage rating withstands surges common in Automotive, Industrial
and Commercial Signage applications. The CCR comes in thermally
robust packages and is qualified to AEC-Q101 standard, and
UL94−V0 certified.
Features
Robust Power Package: 460 mW
Wide Operating Voltage Range
Immediate Turn-On
Voltage Surge Suppressing − Protecting LEDs
UL94−V0 Certified
SBT (Self−Biased Transistor) Technology
Negative Temperature Coefficient
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Automobile: Chevron Side Mirror Markers, Cluster, Display &
Instrument Backlighting, CHMSL, Map Light
AC Lighting Panels, Display Signage, Decorative Lighting, Channel
Lettering
Switch Contact Wetting
Application Note AND8391/D − Power Dissipation Considerations
Application Note AND8349/D − Automotive CHMSL
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
Anode−Cathode Voltage Vak Max 45 V
Reverse Voltage VR500 mV
Operating and Storage Junction
Temperature Range
TJ, Tstg −55 to +150 °C
ESD Rating: Human Body Model
Machine Model
ESD Class 1C
Class B
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
AD = Device Code
M = Date Code
G= Pb−Free Package
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SOD−123
CASE 425
STYLE 1
MARKING DIAGRAM
AD M G
G
Device Package Shipping
ORDERING INFORMATION
NSI45020AT1G SOD−123
(Pb−Free)
3000/Tape & Reel
(Note: Microdot may be in either location)
Anode 2
Cathode 1
1
2
12
Ireg(SS) = 20 mA
@ Vak = 7.5 V
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
NSV45020AT1G SOD−123
(Pb−Free)
3000/Tape & Reel
IHEG, CURRENT REGULATION (mA) VAK, ANODE-CATHODE VOLTAGE (V)
NSI45020AT1G
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Steady State Current @ Vak = 7.5 V (Note 1) Ireg(SS) 18 20 22 mA
Voltage Overhead (Note 2) Voverhead 1.8 V
Pulse Current @ Vak = 7.5 V (Note 3) Ireg(P) 19.85 22.5 25.15 mA
Capacitance @ Vak = 7.5 V (Note 4) C 2.5 pF
Capacitance @ Vak = 0 V (Note 4) C 5.7 pF
1. Ireg(SS) steady state is the voltage (Vak) applied for a time duration 10 sec, using FR−4 @ 300 mm2 1 oz. Copper traces, in still air.
2. Voverhead = Vin − VLEDs. Voverhead is typical value for 85% Ireg(SS).
3. Ireg(P) non−repetitive pulse test. Pulse width t 300 msec.
4. f = 1 MHz, 0.02 V RMS.
Figure 1. CCR Voltage−Current Characteristic
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3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation (Note 5) TA = 25°C
Derate above 25°CPD208
1.66 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 5) RθJA 600 °C/W
Thermal Reference, Lead−to−Ambient (Note 5) RψLA 404 °C/W
Thermal Reference, Junction−to−Cathode Lead (Note 5) RψJL 196 °C/W
Total Device Dissipation (Note 6) TA = 25°C
Derate above 25°CPD227
1.8 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 6) RθJA 550 °C/W
Thermal Reference, Lead−to−Ambient (Note 6) RψLA 390 °C/W
Thermal Reference, Junction−to−Cathode Lead (Note 6) RψJL 160 °C/W
Total Device Dissipation (Note 7) TA = 25°C
Derate above 25°CPD347
2.8 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 7) RθJA 360 °C/W
Thermal Reference, Lead−to−Ambient (Note 7) RψLA 200 °C/W
Thermal Reference, Junction−to−Cathode Lead (Note 7) RψJL 160 °C/W
Total Device Dissipation (Note 8) TA = 25°C
Derate above 25°CPD368
2.9 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 8) RθJA 340 °C/W
Thermal Reference, Lead−to−Ambient (Note 8) RψLA 208 °C/W
Thermal Reference, Junction−to−Cathode Lead (Note 8) RψJL 132 °C/W
Total Device Dissipation (Note 9) TA = 25°C
Derate above 25°CPD436
3.5 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 9) RθJA 287 °C/W
Thermal Reference, Lead−to−Ambient (Note 9) RψLA 139 °C/W
Thermal Reference, Junction−to−Cathode Lead (Note 9) RψJL 148 °C/W
Total Device Dissipation (Note 10) TA = 25°C
Derate above 25°CPD463
3.7 mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 10) RθJA 270 °C/W
Thermal Reference, Lead−to−Ambient (Note 10) RψLA 150 °C/W
Thermal Reference, Junction−to−Cathode Lead (Note 10) RψJL 120 °C/W
Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C
5. FR−4 @ 100 mm2, 1 oz. copper traces, still air.
6. FR−4 @ 100 mm2, 2 oz. copper traces, still air.
7. FR−4 @ 300 mm2, 1 oz. copper traces, still air.
8. FR−4 @ 300 mm2, 2 oz. copper traces, still air.
9. FR−4 @ 500 mm2, 1 oz. copper traces, still air.
10.FR−4 @ 500 mm2, 2 oz. copper traces, still air.
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
‘ : 746°C ’1 70 052 mAJQ TA‘ : 25°C :yp @ Vak : ,5 V ’1 70 044 mAFC TA:35§C ‘D@Vak:7,5V ‘ Vak@75V WmZ/z oz \ 300 mmZ/I Dz \ N 100 mm2/1 Dz \ //
NSI45020AT1G
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4
TYPICAL PERFORMANCE CURVES
Minimum FR−4 @ 300 mm2, 1 oz Copper Trace, Still Air
Figure 2. Steady State Current (Ireg(SS)) vs.
Anode−Cathode Voltage (Vak) Figure 3. Pulse Current (Ireg(P)) vs.
Anode−Cathode Voltage (Vak)
Figure 4. Steady State Current vs. Pulse
Current Testing
Vak, ANODE−CATHODE VOLTAGE (V)
Ireg(P), PULSE CURRENT (mA)
109.08.07.06.05.04.0
20.0
21.0
21.5
22.5
23.0
2423222019
19
20
21
Ireg(P), PULSE CURRENT (mA)
Ireg(SS), STEADY STATE CURRENT (mA)
21
22.0
25 26
22
Non−Repetitive Pulse Test
3.0
18
Vak @ 7.5 V
20.5
TA = 25°C
TA = 25°C
Figure 5. Current Regulation vs. Time
TIME (s)
3025201050
21
22
23
Ireg, CURRENT REGULATION (mA)
15 35
19
20
Vak @ 7.5 V
TA = 25°C
Figure 6. Power Dissipation vs. Ambient
Temperature @ TJ = 1505C
Vak, ANODE−CATHODE VOLTAGE (V)
96543
0
5
15
20
25
Ireg(SS), STEADY STATE CURRENT (mA)
710
DC Test Steady State, Still Air
8
10
TA = −40°C
TA = 25°C
TA = 85°C
[ −0.052 mA/°C
typ @ Vak = 7.5 V
[ −0.044 mA/°C
typ @ Vak = 7.5 V
210
TA, AMBIENT TEMPERATURE (°C)
8060200−20−40
200
300
500
PD, POWER DISSIPATION (mW)
40
500 mm2/2 oz
500 mm2/1 oz
300 mm2/1 oz
400
100
100 mm2/1 oz
100 mm2/2 oz
300 mm2/2 oz
600
800
700
+15 to 20 V 35V 3.5V 3.5V 54 '4 LED String _ CD +12 lo 20 V O 3,1V \\ _ 3.1V LED Stnng \} 3.1V __\} +1Mo18 v ”V - \iA ngher current 3 5V LED String \ ' CCR in parallel \ ccn CD CD ccn L
NSI45020AT1G
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5
APPLICATIONS INFORMATION
The CCR is a self biased transistor designed to regulate the
current through itself and any devices in series with it. The
device has a slight negative temperature coefficient, as
shown in Figure 2 – Tri Temp. (i.e. if the temperature
increases the current will decrease). This negative
temperature coefficient will protect the LEDS by reducing
the current as temperature rises.
The CCR turns on immediately and is typically at 20% of
regulation with only 0.5 V across it.
The device is capable of handling voltage for short
durations of up to 45 V so long as the die temperature does
not exceed 150°C. The determination will depend on the
thermal pad it is mounted on, the ambient temperature, the
pulse duration, pulse shape and repetition.
Single LED String
The CCR can be placed in series with LEDs as a High Side
or a Low Side Driver. The number of the LEDs can vary
from one to an unlimited number. The designer needs to
calculate the maximum voltage across the CCR by taking the
maximum input voltage less the voltage across the LED
string (Figures 7 and 8).
Figure 7.
Figure 8.
Higher Current LED Strings
Two or more fixed current CCRs can be connected in
parallel. The current through them is additive (Figure 9).
Figure 9.
+10t018 v Adjustable current \i‘ LED String with CCR in Parallel \\ 3.5V Tau YDFF 3.5V T- Duty Cycle = Duly name = D = CCR "3.).” LED Swing With PWM dimming n. - am. 0 ‘ll/H mum-n sv Iumnn S
NSI45020AT1G
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6
Other Currents
The adjustable CCR can be placed in parallel with any
other CCR to obtain a desired current. The adjustable CCR
provides the ability to adjust the current as LED efficiency
increases to obtain the same light output (Figure 10).
Figure 10.
Dimming using PWM
The dimming of an LED string can be easily achieved by
placing a BJT in series with the CCR (Figure 11).
Figure 11.
The method of pulsing the current through the LEDs is
known as Pulse Width Modulation (PWM) and has become
the preferred method of changing the light level. LEDs being
a silicon device, turn on and off rapidly in response to the
current through them being turned on and off. The switching
time is in the order of 100 nanoseconds, this equates to a
maximum frequency of 10 Mhz, and applications will
typically operate from a 100 Hz to 100 kHz. Below 100 Hz
the human eye will detect a flicker from the light emitted
from the LEDs. Between 500 Hz and 20 kHz the circuit may
generate audible sound. Dimming is achieved by turning the
LEDs on and off for a portion of a single cycle. This on/off
cycle is called the Duty cycle (D) and is expressed by the
amount of time the LEDs are on (Ton) divided by the total
time of an on/off cycle (Ts) (Figure 12).
Figure 12.
The current through the LEDs is constant during the period
they are turned on resulting in the light being consistent with
no shift in chromaticity (color). The brightness is in proportion
to the percentage of time that the LEDs are turned on.
Figure 13 is a typical response of Luminance vs Duty Cycle.
Figure 13. Luminous Emmitance vs. Duty Cycle
DUTY CYCLE (%)
100908070605040
0
1000
3000
ILLUMINANCE (lx)
2000
30
4000
6000
20100
5000
Lux
Linear
Reducing EMI
Designers creating circuits switching medium to high
currents need to be concerned about Electromagnetic
Interference (EMI). The LEDs and the CCR switch
extremely fast, less than 100 nanoseconds. To help eliminate
EMI, a capacitor can be added to the circuit across R2.
(Figure 11) This will cause the slope on the rising and falling
edge on the current through the circuit to be extended. The
slope of the CCR on/off current can be controlled by the
values of R1 and C1.
The selected delay / slope will impact the frequency that
is selected to operate the dimming circuit. The longer the
delay, the lower the frequency will be. The delay time should
not be less than a 10:1 ratio of the minimum on time. The
frequency is also impacted by the resolution and dimming
steps that are required. With a delay of 1.5 microseconds on
the rise and the fall edges, the minimum on time would be
30 microseconds. If the design called for a resolution of 100
dimming steps, then a total duty cycle time (Ts) of 3
milliseconds or a frequency of 333 Hz will be required.
"w 22WM: Full wave Ema: LED‘s xx xx xx xx xx xx cm 9
NSI45020AT1G
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7
Thermal Considerations
As power in the CCR increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the device has good thermal conductivity through the PCB,
the junction temperature will be relatively low with high
power applications. The maximum dissipation the device
can handle is given by:
PD(MAX) +TJ(MAX) *TA
RqJA
Referring to the thermal table on page 2 the appropriate
RqJA for the circuit board can be selected.
AC Applications
The CCR is a DC device; however, it can be used with full
wave rectified AC as shown in application notes
AND8433/D and AND8492/D and design notes
DN05013/D and DN06065/D. Figure 14 shows the basic
circuit configuration.
Figure 14. Basic AC Application
4 fl
NSI45020AT1G
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8
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.22
0.048
0.91
0.036
2.36
0.093
4.19
0.165
ǒmm
inchesǓ
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
b
DA
L
C
1
2
A1
DIM MIN NOM MAX
MILLIMETERS INCHES
A0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b0.51 0.61 0.71 0.020
c
1.60
0.15
0.055D1.40 1.80
E2.54 2.69 2.84 0.100
---
3.68 0.140
L0.25
3.86
0.010
HE
0.046
0.002
0.024
0.063
0.106
0.145
0.053
0.004
0.028
0.071
0.112
0.152
MIN NOM MAX
3.56
HE
---
--- ---
0.006
--- ---
--- ---
q
--- ---
q00
10 10
°°° °
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