DSGP.1575.18.4.A.02 Specification Datasheet by Taoglas Limited

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A“ TAOGLASQ
DSP-15-8-SPE-17-8-030/A/SS Page 1 of 17
SPECIFICATION
Part No.
:
DSGP.1575.18.4.A.02
Description
:
GPS L1 / GALILEO E1 1575MHz SMT 18*18*4mm
Ceramic Patch SMT Antenna
Features
:
4.20 dBi Peak Gain for GPS/GALILEO Band
Dims: 18*18*4mm
SMT Direct Mount Ceramic Patch Antenna
Automotive TS16949 Approved
RoHS Compliant
A“ TAOGLASQ
DSP-15-8-SPE-17-8-030/A/SS Page 2 of 17
1. Introduction
The DSGP.1575.18.4.A.02 is an 18mm square ceramic GPS L1 / GALILEO E1 passive
patch antenna. 18mm square with a height of just 4mm, this low profile antenna is
ideal for space constrained applications in telematics devices, vehicle tracking/fleet
management systems, wearables and navigation.
The antenna has been tuned on a 50*50mm ground plane, working at 1575.42MHz
with a 4.20dBi gain. The radiation pattern is broadly hemispherical with a stable gain
across elevations.
The ceramic patch is mounted via SMT process, ideal for high volume low cost
assembly. It is manufactured and tested in a TS16949 first tier automotive approved
facility.
For further optimization to customer specific device environments, custom tuned
patch antennas can be supplied, subject to NRE and MOQ. For more details please
contact your regional Taoglas sales office.
A“ TAOGLASQ
DSP-15-8-SPE-17-8-030/A/SS Page 3 of 17
2. Specification
ELECTRICAL
Application Bands
GPS/GALILEO
Operation Frequency
1575.42 ±1.023MHz
Return Loss
<-10dB
Gain at Zenith
4.20dBi
Efficiency
83.33%
Impedance
50
Ceramic Dimension
18*18*4mm
Weight
5.8g
Operation Temperature
-40°C to 85°C
Humidity
Non-condensing 65°C 95% RH
*Antenna properties were measured with the antenna mounted on 50*50mm Ground Plane
Taoglas Part # DSGPD.18A
TAOGLASQ —DSGP.1575‘18.4.A.02 ~40 1500 1510 1540 1560 1580 1600 1620 1640 (MN!) 100 90 I —DSGP,1575.13.4.A.02 80 70 60 40 30 20 1o 0 1550 1560 1570 1580 1590 1600 1610 1620 1830 {MHz}
DSP-15-8-SPE-17-8-030/A/SS Page 4 of 17
3. Antenna Characteristics
3.1. Return Loss
3.2. Efficiency
TAOGLASQ —DSGP.1575.1E.4.A.02 1550 1560 1570 1580 1590 1600 1610 1620 1630mm) 10 I I —DSGP.1575.18.4.A.02 -20 1550 1560 1570 1580 1590 1600 1610 1620 1630(MHz)
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3.3. Average Gain
3.4. Peak Gain
\ TAOGLASQ
DSP-15-8-SPE-17-8-030/A/SS Page 6 of 17
4. Antenna Radiation Pattern
4.1. Measurement Setup
The DSGP.1575.18.4 antenna is tested with 50*50mm ground plane in a CTIA certified
ETS-Lindgren Anechoic Chamber. The test setup is shown below.
Y
X
Z
Plan X o 107 , 330 300 270: 240 210 , , 130 z 300 so 270 so X 240 120 210 150 180 (as) —1 575.42 MHz TAOGLASQ 30 so :90 Y 120 150 —1575.42 MHz (d5) 2 300 60 270 90 V 240 120 210 15° —1575.42 MM: 180 (dB)
DSP-15-8-SPE-17-8-030/A/SS Page 7 of 17
4.2. 2D Radiation Pattern
XY Plane
XZ Plane YZ Plane
X
Y
A“ TAOGLASe Alimufll - 114.3 5 Elevation - 40.1 Roll - 7543 o a 75 . . C a a. g .10 x v ,15 .20
DSP-15-8-SPE-17-8-030/A/SS Page 8 of 17
4.3. 3D Radiation Pattern
1575.42MHz
To Wew 18*0-5 a (a _ 99 17510.3 2-5“).J 8M6 Wew M A“ TAOGLASQ Bofiom VEW
DSP-15-8-SPE-17-8-030/A/SS Page 9 of 17
5. Mechanical Drawing (Unit: mm)
TAOGLASQ ('2 Ma (5| 3'3 3 a... (an: m, pmmn v-umwnh 5m: Vlew .n n d 41 V 1/4“ 3W0!“ Mew Name Maleria‘ mesh QTV 1 PCB SMA(F) ST FR4 Gem ‘ 2 DSGP157518 4 A 02 Antenna Ceramlc Clear 1 3 PCB (50x50x1mm) Fm 1 01 Black 1
DSP-15-8-SPE-17-8-030/A/SS Page 10 of 17
6. Evaluation Board - DSGPD.18A (Unit: mm)
Unit:mm
A“ TAOG LAS® 25 m I 4 Connected to. 50 ohm transmission line. 35 NOTE: Ag Plated area Solder Mask area Copper area Paste area Copper Keepout area Copper Keepout should extend through all PCB layers. Any vias in pads should be either filled or tented to prevent solder from wicking away from the pad dunng reflow 8 The dimension tolerances should follow standard PCB manufacturing guidelines Newewwe
DSP-15-8-SPE-17-8-030/A/SS Page 11 of 17
7. PCB Footprint Recommendation
7.1. Footprint Copper Keepout Area (Unit: mm)
Pads 1, 2, 3, 4, 5, 6, 7 and 9 are the same size. They should be connected to GND
TAOGLAS® NOTE: Ag Plated area _ Solder Mask area _ Copper area - Paste area Copper Keepout area m Copper Keepout should extend through all PCB layers. Any vias in pads should be either filled or tented to prevent solder from wicking away from the pad dunng reflow 8. The dimension tolevances should follow standard PCB manufactuving gmddmes NP‘P‘PPNE‘
DSP-15-8-SPE-17-8-030/A/SS Page 12 of 17
7.2. Paste Area (unit: mm)
Pads 1, 2, 3, 4, 5, 6, 7 and 9 are the same size.
TAOGLASI 5.2 NOTE: Ag Plated area Solder Mask area Copper area Paste area Copper Keepout area Copper Keepout should extend through all PCB layers. Any vias in pads should be either filled or tented to prevent solder from wicking away from the pad dunng reflow 8. The dimension tolerances should follow standard PCB manufactufing guidelines _ _ - m NP‘P‘PPNE‘
DSP-15-8-SPE-17-8-030/A/SS Page 13 of 17
7.3. Top Solder Mask (Unit: mm)
Pads 1, 2, 3, 4, 5, 6, 7 and 9 are the same size. This drawing is a negative of solder
mask. Black regions are anti-mask.
A“ TAOGLASQ NOTE: Ag Plated area Solder Mask area Copper area Paste area Copper Keepout area Copper Keepout should extend through all PCB layers. . Any vias in pads should be either filled or tented to prevent solder fr m wicking away from the pad during reflow 8. The dimension tolerances should follow standard PCB manufacturing guidelines “Pl-“PENN?
DSP-15-8-SPE-17-8-030/A/SS Page 14 of 17
7.4. Composite Diagram (unit: mm)
TAOGLASQ Phase Pnlile Features Ph-Free AssemMy lSnAQCuI PREHEAT Tempe-rattle Min(TsnIin) 150'0 Tenperalue Max(Tsmax) 2m Tlmefls) 1mm (Tsml'n lo Tsrnax) HHZD seconds RAMP-UP Avg. Fhmp-up Rate (Tsmax lo 1?) 3‘Clsecond(max) REFLOW Temperall'efl'L) 211-c Total Time above TL (1L) 30-10.) seconds PEAK TemperalueflP) 260‘0 Tlmeflp) 2-5 seconds RAMP-DOWN Rate 3°Clsecond(max) fine from 25°C to Peak Taupemlure 8 minutes "Bx. Cornposilim cl soldev paste $.5SvV3AgID.5Cu Solder Pasie Model SHENMAO PFHE—PZB Mgr-phicmmnpanuu Mhbrmwmwpminmm H 'v m—‘I'c 5-0 m o T "L \ '5 l L— 'L'—\ .3 - E U E El; 0 h .. B L—mzs‘cmm Soldev‘ng hm comm: Sensing imn lenperalule 2701mm. Tlme :3 my prMng m IZU'C [or 2-3 "Ilium Firm singing [at mil luminal min a mm; H soldering iron Wa- Iule mmntm or 3 seconds. iI will mine came component mace peeling ov damage.
DSP-15-8-SPE-17-8-030/A/SS Page 15 of 17
8. Recommended Reflow Soldering Profile
DSGP.18 can be assembled using lead-free process. According to the standard
IPC/JEDEC J-STD-020C, the temperature profile suggested is as follows:
A, TAOG LASQ Packaging Specifications , w 200 p: DSGP.1575.18.4.AV02 per reel Dimensions - @330‘50mm Welght-15565g azquo—VE- l mm m) 5 ML 1 ”a _ __u ,c-H ++H+>H7I «(3440 I s r\ T /7 g5 ELLE: __Ls.1_tuz
DSP-15-8-SPE-17-8-030/A/SS Page 16 of 17
9. Packaging (Unit: mm)
1 pr: reel in small in Anti»static Bag Dimensions - 3A0‘350‘70mm Weight 7 1,86Kg A Reels i n Anti-static Bags 800 pcs in one carton Carton Dimensions 7 37U‘360‘305mm Weighl - 8.2Kg Pallet Dimensions l200‘1flflfl‘1420mm 2A Canons per Pallel 5 Canons per layer A Layers TAOGLASQ 350 mm
DSP-15-8-SPE-17-8-030/A/SS Page 17 of 17
Taoglas makes no warranties based on the accuracy or completeness of the contents of this document
and reserves the right to make changes to specifications and product descriptions at any time without
notice. Taoglas reserves all rights to this document and the information contained herein.
Reproduction, use or disclosure to third parties without express permission is strictly prohibited.
Copyright © Taoglas Ltd.

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