OPA337PA Datasheet by Texas Instruments

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FEATURES
DMicroSIZE PACKAGES:
SOT23-5, SOT23-8
DSINGLE-SUPPLY OPERATION
DRAIL-TO-RAIL OUTPUT SWING
DFET-INPUT: IB = 10pA max
DHIGH SPEED:
OPA337: 3MHz, 1.2V/µs (G = 1)
OPA338: 12.5MHz, 4.6V/µs (G = 5)
DOPERATION FROM 2.5V to 5.5V
DHIGH OPEN-LOOP GAIN: 120dB
DLOW QUIESCENT CURRENT: 525µA/amp
DSINGLE AND DUAL VERSIONS
APPLICATIONS
DBATTERY-POWERED INSTRUMENTS
DPHOTODIODE PRE-AMPS
DMEDICAL INSTRUMENTS
DTEST EQUIPMENT
DAUDIO SYSTEMS
DDRIVING ADCs
DCONSUMER PRODUCTS
SPICE model available at www.ti.com.
DESCRIPTION
The OPA337 and OPA338 series rail-to-rail output CMOS
operational amplifiers are designed for low cost and
miniature applications. Packaged in the SOT23-8, the
OPA2337EA and OPA2338EA are Texas Instruments’
smallest dual op amps. At 1/4 the size of a conventional
SO-8 surface-mount, they are ideal for space-sensitive
applications.
Utilizing advanced CMOS technology, the OPA337 and
OPA338 op amps provide low bias current, high-speed
operation, high open-loop gain, and rail-to-rail output
swing. They operate on a single supply with operation as
low as 2.5V while drawing only 525µA quiescent current.
In addition, the input common-mode voltage range
includes ground—ideal for single-supply operation.
The OPA337 series is unity-gain stable. The OPA338 series
is optimized for gains greater than or equal to 5. They are
easy-to-use and free from phase inversion and overload
problems found in some other op amps. Excellent
performance is maintained as the amplifiers swing to their
specified limits. The dual versions feature completely
independent circuitry for lowest crosstalk and freedom from
interaction, even when overdriven or overloaded.
G = 1 STABLE G 5 STABLE
PACKAGE SINGLE
OPA337 DUAL
OPA2337 SINGLE
OPA338 DUAL
OPA2338
SOT23-5 n n
SOT23-8 n n
MSOP-8 n
SO-8 n n n n
DIP-8 n n
1
2
3
4
8
7
6
5
NC
V+
Output
NC
NC
In
+In
V
OPA337, OPA338
DIP−8(1), SO−8, MSOP8(1)
NC = No Connection
1
2
3
4
8
7
6
5
V+
Out B
In B
+In B
Out A
In A
+In A
V
OPA2337, OPA2338
DIP−8(1),SO8,SOT238
A
B
1
2
3
5
4
V+
In
Out
V
+In
OPA337, OPA338
SOT23−5
NOTE: (1) DIP AND MSOP8 versions for OPA337, OPA2337 only.
OPA337, OPA2337
OPA338, OPA2338
SBOS077BJUNE 1997 − REVISED MARCH 2005
MicroSIZE, Single-Supply
CMOS OPERATIONAL AMPLIFIERS
MicroAmplifierE Series
         
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Copyright 1997-2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
*9 TEXAS INSTRUMENTS OPA337 n :1 mm. 4m- m .as< mm="" 7401c="" m="">
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2
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage 7.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2) (V−) − 0.5V to (V+) + 0.5V. . . . . . . . . . . . . . . . . . . .
Input Current(2) 10mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit(3) Continuous. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature −55°C to +125°C. . . . . . . . . . . . . . . . . . . . .
Storage Temperature −55°C to +125°C. . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering, 10s) 300°C. . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input signal voltage is limited by internal diodes connected to
power supplies. See text.
(3) Short-circuit to ground, one amplifier per package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT DESCRIPTION PACKAGE-LEAD PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING ORDERING
NUMBER TRANSPORT
MEDIA, QUANTITY
OPA337 Series
SOT23-5
DBV
C37
OPA337NA/250 Tape and Reel, 250
SOT23-5 DBV C37 OPA337NA/3K Tape and Reel, 3000
Single,
MSOP-8
DGK
G37
OPA337EA/250 Tape and Reel, 250
OPA337 Single,
G = 1 Stable
MSOP-8 DGK −40°C to +85°CG37 OPA337EA/2K5 Tape and Reel, 2500
OPA337
G = 1 Stable
DIP-8 P
−40 C to +85 C
OPA337PA OPA337PA Rails
SO-8
D
OPA337UA
OPA337UA Rails
SO-8
Surface-Mount D OPA337UA OPA337UA/2K5 Tape and Reel, 2500
SOT23-8
DCN
A7
OPA2337EA/250 Tape and Reel, 250
Dual,
SOT23-8 DCN A7 OPA2337EA/3K Tape and Reel, 3000
OPA2337 Dual,
G = 1 Stable
DIP-8 P −40°C to +85°COPA2337PA OPA2337PA Rails
OPA2337
G = 1 Stable
SO-8
D
−40 C to +85 C
OPA2337UA
OPA2337UA Rails
SO-8
Surface-Mount D OPA2337UA OPA2337UA/2K5 Tape and Reel, 2500
OPA338 Series
SOT23-5
DBV
A38
OPA338NA/250 Tape and Reel, 250
OPA338
Single,
SOT23-5 DBV
−40°C to +85°C
A38 OPA338NA/3K Tape and Reel, 3000
OPA338
Single,
G 5 Stable
SO-8
D
−40°C to +85°C
OPA338UA
OPA338UA Rails
SO-8
Surface-Mount D OPA338UA OPA338UA/2K5 Tape and Reel, 2500
SOT23-8
DCN
A8
OPA2338EA/250 Tape and Reel, 250
OPA2338
Dual,
SOT23-8 DCN
−40°C to +85°C
A8 OPA2338EA/3K Tape and Reel, 3000
OPA2338
Dual,
G 5 Stable
SO-8
D
−40°C to +85°C
OPA2338UA
OPA2338UA Rails
SO-8
Surface-Mount D OPA2338UA OPA2338UA/2K5 Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
*5 TEXAS INSTRUM ENTS vs : 5v v0 : 3va
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3
ELECTRICAL CHARACTERISTICS: VS = 2.7V to 5.5V
Boldface limits apply over the specified temperature range, −405C to +855C, VS = 5V.
At TA = +25°C and RL = 25k connected to VS/2, unless otherwise noted.
OPA337, OPA2337,
OPA338, OPA2338
PARAMETER CONDITION MIN TYP(1) MAX UNIT
OFFSET VOLTAGE
Input Offset Voltage VOS ±0.5 ±3 mV
TA = −40°C to +85°C±3.5 mV
vs Temperature dVOS/dT ±2µV/°C
vs Power-Supply Rejection Ratio PSRR VS = 2.7V to 5.5V 25 125 µV/V
TA = −40°C to +85°C VS = 2.7V to 5.5V 125 µV/V
Channel Separation (dual versions) dc 0.3 µV/V
INPUT BIAS CURRENT
Input Bias Current IB±0.2 ±10 pA
TA = −40°C to +85°CSee Typical Curve
Input Offset Current IOS ±0.2 ±10 pA
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz 6µVPP
Input Voltage Noise Density, f = 1kHz en26 nV/Hz
Current Noise Density, f = 1kHz in0.6 fA/Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM TA = −40°C to +85°C −0.2 (V+) − 1.2 V
Common-Mode Rejection Ratio CMRR −0.2V < VCM < (V+) − 1.2V 74 90 dB
TA = −40°C to +85°C−0.2V < VCM < (V+) − 1.2V 74 dB
INPUT IMPEDANCE
Differential 1013 2 Ω  pF
Common-Mode 1013 4 Ω  pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain AOL RL = 25k, 125mV < VO < (V+) − 125mV 100 120 dB
TA = −40°C to +85°C RL = 25k, 125mV < VO < (V+) − 125mV 100 dB
RL = 5k, 500mV < VO < (V+) − 500mV 100 114 dB
TA = −40°C to +85°C RL = 5k, 500mV < VO < (V+) − 500mV 100 dB
OPA337 FREQUENCY RESPONSE
Gain-Bandwidth Product GBW VS = 5V, G = 1 3 MHz
Slew Rate SR VS = 5V, G = 1 1.2 V/µs
Settling TIme: 0.1% VS = 5V, 2V Step, CL = 100pF, G = 1 2µs
0.01% VS = 5V, 2V Step, CL = 100pF, G = 1 2.5 µs
Overload Recovery Time VIN × G = VS2µs
Total Harmonic Distortion + Noise THD+N VS = 5V, VO = 3VPP, G = 1, f = 1kHz 0.001 %
OPA338 FREQUENCY RESPONSE
Gain-Bandwidth Product GBW VS = 5V, G = 5 12.5 MHz
Slew Rate SR VS = 5V, G = 5 4.6 V/µs
Settling TIme: 0.1% VS = 5V, 2V Step, CL = 100pF, G = 5 1.4 µs
0.01% VS = 5V, 2V Step, CL = 100pF, G = 5 1.9 µs
Overload Recovery Time VIN × G = VS0.5 µs
Total Harmonic Distortion + Noise THD+N VS = 5V, VO = 3VPP, G = 5, f = 1kHz 0.0035 %
(1) VS = 5V.
(2) Output voltage swings are measured between the output and negative and positive power-supply rails.
*9 TEXAS INSTRUMENTS
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4
ELECTRICAL CHARACTERISTICS: VS = 2.7V to 5.5V (continued)
Boldface limits apply over the specified temperature range, −405C to +855C, VS = 5V.
At TA = +25°C and RL = 25k connected to VS/2, unless otherwise noted.
OPA337, OPA2337,
OPA338, OPA2338
PARAMETER UNITMAXTYP(1)
MINCONDITION
OUTPUT
Voltage Output Swing from Rail(2) RL = 25k, AOL 100dB 40 125 mV
TA = −40°C to +85°C RL = 25k, AOL 100dB 125 mV
RL = 5k, AOL 100dB 150 500 mV
TA = −40°C to +85°C RL = 5k, AOL 100dB 500 mV
Short-Circuit Current ±9 mA
Capacitive Load Drive See Typical Curve
POWER SUPPLY
Specified Voltage Range VSTA = −40°C to +85°C 2.7 5.5 V
Minimum Operating Voltage 2.5 V
Quiescent Current (per amplifier) IQIO = 0 0.525 1 mA
TA = −40°C to +85°C IO = 0 1.2 mA
TEMPERATURE RANGE
Specified Range −40 +85 °C
Operating Range −55 +125 °C
Storage Range −55 +125 °C
Thermal Resistance qJA
SOT23-5 Surface-Mount 200 °C/W
SOT23-8 Surface-Mount 200 °C/W
MSOP-8 150 °C/W
SO-8 Surface-Mount 150 °C/W
DIP-8 100 °C/W
(1) VS = 5V.
(2) Output voltage swings are measured between the output and negative and positive power-supply rails.
(an'i *5 TEXAS INSTRUM Ems (wfi
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5
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and RL = 25k connected to VS/2, unless otherwise noted.
OPEN−LOOP GAIN/PHASE vs FREQUENCY
Frequency (Hz)
Open−Loop Gain (dB)
Phase (_)
160
140
120
100
80
60
40
20
0
20 1 10 100 10k1k 100k 10M1M
OPA337
OPA338
G
φ
0
45
90
135
180
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
Frequency (Hz)
Voltage Noise (nVHz)
1k
100
10
1
0.1
1k
100
10
1
0.1
1 10 100 1k 10k 100k 1M
Current Noise (fAHz)
Voltage Noise
Current Noise
INPUT BIAS CURRENT vs TEMPERATURE
Temperature (_C)
Input Bias Current (pA)
100
10
1
0.1
0.01
75 50 25 0 25 50 75 100 125
POWER−SUPPLY REJECTION RATIO AND
COMMON−MODE REJECTION RATIO vs FREQUENCY
Frequency (Hz)
PSRR, CMRR (dB)
100
90
80
70
60
50
40
30
20
10 1 10 100 1k 10k 100k 1M 10M
+PSRR
PSRR
CMRR
CHANNEL SEPARATION vs FREQUENCY
Frequency (Hz)
Channel Separation (dB)
140
130
120
110
100
90
80100 10k1k 1M100k
Dual Versions
INPUT BIAS CURRENT
vs INPUT COMMON−MODE VOLTAGE
Common−Mode Voltage (V)
Input Bias Current (pA)
0.5
0.4
0.3
0.2
0.1
0
0.1
1210543
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6
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, and RL = 25k connected to VS/2, unless otherwise noted.
AOL, CMRR, PSRR vs TEMPERATURE
Temperature (_C)
A
OL
,CMRR(dB)
PSRR (dB)
140
130
120
110
100
90
80
130
120
110
100
90
80
70
75 50 25 0 25 50 75 100 125
PSRR
CMRR
AOL
QUIESCENT AND SHORTCIRCUIT CURRENT
vs SUPPLY VOLTAGE
Supply Voltage (V)
Quiescent Current (
µ
A)
Short−Circuit Current (mA)
700
650
600
550
500
450
400
±12
±10
±8
±6
±4
±2
0
2.5 4.03.53.0 5.55.04.5
+ISC
ISC IQ
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
0.1
0.01
0.001
0.0001
20 100 1k 10k 20k
G=+10,R
L=5k
,25k
G=+5,R
L=5k
, 25k
RL=25k
RL=5k
G=+1
VO=3V
PP
OPA337
OPA338
QUIESCENT CURRENT AND SHORTCIRCUIT CURRENT
vs TEMPERATURE
Temperature (_C)
Quiescent Current (µA)
600
550
500
450
400
350
300
12
11
10
9
8
7
6
ShortCircuit Current (mA)
75 50 25 0 25 50 75 100 125
ISC
+ISC
IQ
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
Frequency (Hz)
Output Voltage (VPP)
6
5
4
3
2
1
010k 100k 100M1M 10M
Maximum output
voltage without slew
rate−induced distortion.
OPA337
OPA338
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
Output Current (mA)
Output Voltage (V)
2.5
2.0
1.5
1.0
0.5
0
0.5
1.0
1.5
2.0
2.5
0±3
±2
±1±6±7±8
±5
±4
125_C
Sinking
Sourcing
25_C
VS=±2.5V
RLTied to Ground
55_C
55_C
*9 TEXAS INSTRUM ENTS Seuhn 01:11:37 01% m 100 1k C‘nseernop Gem (v V) SMALLESIGNAL STEP RESPONSE ‘ , ‘ cL mow v: .5v ’ owmv ‘ G = 1 somv drv OPASIE ‘ G = 5 1H5 dw m In
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7
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, and RL = 25k connected to VS/2, unless otherwise noted.
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
Percent of Amplifiers (%)
Offset Voltage (mV)
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5
1.0
1.5
2.0
2.5
3.0
25
20
15
10
5
0
Typical distribution
of packaged units.
SETTLING TIME vs CLOSEDLOOP GAIN
ClosedLoop Gain (V/V)
Settling Time (µs)
100
10
111k10 100
0.01%
OPA337
0.1%
OPA338
SMALLSIGNAL STEP RESPONSE
1µs/div
50mV/div
OPA337
G=1
OPA338
G=5
CL= 100pF
VS=+5V
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
Percent of Amplifiers (%)
Offset Voltage Drift (µV/_C)
30
25
20
15
10
5
0
Typical distribution
of packaged units.
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE
Load Capacitance (pF)
Overshoot (%)
60
50
40
30
20
10
010 10k100 1k
OPA337
(G = ±1)
OPA337
(G = ±10)
OPA338
(G = ±50)
OPA338
(G = ±5)
LARGE−SIGNAL STEP RESPONSE
2µs/div
500mV/div
OPA337
G=1
OPA338
G=5
CL= 100pF
VS=+5V
*9 TEXAS INSTRUMENTS a
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8
APPLICATIONS INFORMATION
The OPA337 and OPA338 series are fabricated on a
state-of-the-art CMOS process. The OPA337 series is
unity-gain stable. The OPA338 series is optimized for
gains greater than or equal to 5. Both are suitable for a
wide range of general-purpose applications. Power-
supply pins should be bypassed with 0.01µF ceramic
capacitors.
OPERATING VOLTAGE
The OPA337 series and OPA338 series can operate from
a +2.5V to +5.5V single supply with excellent
performance. Unlike most op amps which are specified at
only one supply voltage, these op amps are specified for
real-world applications; a single limit applies throughout
the +2.7V to +5.5V supply range. This allows a designer
to have the same assured performance at any supply
voltage within the specified voltage range. Most behavior
remains unchanged throughout the full operating voltage
range. Parameters which vary significantly with operating
voltage are shown in the Typical Characteristic curves.
INPUT VOLTAGE
The input common-mode range extends from (V−) − 0.2V
to (V+) − 1.2V. For normal operation, inputs should be
limited to this range. The absolute maximum input voltage
is 500mV beyond the supplies. Inputs greater than the
input common-mode range but less than maximum input
voltage, while not valid, will not cause any damage to the
op amp. Furthermore, if input current is limited the inputs
may go beyond the power supplies without phase
inversion (as shown in Figure 1) unlike some other op
amps.
OPA337, VIN =±3V Greater Than VS=±2.5V
3V
0V
3V
G=±1VOUT,G=+1
(limited by input
common−mode
range)
VOUT,G=1
(not limited by
input common−
mode range)
Figure 1. OPA337—No Phase Inversion with
Inputs Greater than the Power-Supply Voltage
Normally, input currents are 0.2pA. However, large inputs
(greater than 500mV beyond the supply rails) can cause
excessive current to flow in or out of the input pins.
Therefore, as well as keeping the input voltage below the
maximum rating, it is also important to limit the input
current to less than 10mA. This is easily accomplished
with an input resistor as shown in Figure 2.
5k
OPA337
10mA max
+5V
VIN
VOUT
IOVERLOAD
Figure 2. Input Current Protection for Voltages
Exceeding the Supply Voltage
USING THE OPA338 IN LOW GAINS
The OPA338 series is optimized for gains greater than or
equal to 5. It has significantly wider bandwidth (12.5MHz)
and faster slew rate (4.6V/µs) when compared to the
OPA337 series. The OPA338 series can be used in lower
gain configurations at low frequencies while maintaining
its high slew rate with the proper compensation.
Figure 3 shows the OPA338 in a unity-gain buffer
configuration. At dc, the compensation capacitor C1 is
effectively open resulting in 100% feedback (closed-loop
gain = 1). As frequency increases, C1 becomes lower
impedance and closed-loop gain increases, eventually
becoming 1 + R2/R1 (in this case 5, which is equal to the
minimum gain required for stability).
C1=1
2πfCR1
R1
2.5k
C1
68pF
R2
10k
OPA338
VIN
VOUT
Where fCis the frequency at which closed−loop
gains less than 5 are not appropriate
see text.
Improved slew rate (4.6V/µs) versus
OPA337 (1.2V/µs) in unity gain.
Figure 3. Compensation of the OPA338 for
Unity-Gain Buffer
*4; TEXAS INSTRUM Ems
""#$ %""#
""&$ %""&
SBOS077BJUNE 1997 − REVISED MARCH 2005
www.ti.com
9
The required compensation capacitor value can be
determined from the following equation:
C1 = 1/(2πfCR1)
Since fC may shift with process variations, it is
recommended that a value less than fC be used for
determining C1. With fC = 1MHz and R1 = 2.5k, the
compensation capacitor is about 68pF.
The selection of the compensation capacitor C1 is
important. A proper value ensures that the closed-loop
circuit gain is greater than or equal to 5 at high frequencies.
Referring to the Open-Loop Gain vs Frequency plot in the
Typical Characteristics section, the OPA338 gain line
(dashed in the curve) has a constant slope
(−20dB/decade) up to approximately 3MHz. This
frequency is referred to as fC. Beyond fC the slope of the
curve increases, suggesting that closed-loop gains less
than 5 are not appropriate.
Figure 4 shows a compensation technique using an
inverting configuration. The low-frequency gain is set by
the resistor ratio while the high-frequency gain is set by the
capacitor ratio. As with the noninverting circuit, for
frequencies above fC the gain must be greater than the
recommended minimum stable gain for the op amp.
C1
150pF
C2=,C
1=(G
H1) ×C2
1
2πfCR2
OPA338
VIN
VOUT
R1
5k
R2
10k
Where GHis the high−frequency gain,
GH=1+C
1/C2
Improved slew rate versus OPA337
(see Figure 5).
C2
15pF
Figure 4. Inverting Compensation Circuit of the
OPA338 for Low Gain
Resistors R1 and R2 are chosen to set the desired dc
signal gain. Then the value for C2 is determined as follows:
C2 = 1/(2πfCR2)
C1 is determined from the desired high-frequency gain (GH):
C1 = (GH − 1) × C2
For a desired dc gain of 2 and high-frequency gain of 10,
the following resistor and capacitor values result:
R1 = 10kC1 = 150pF
R2 = 5kC2 = 15pF
The capacitor values shown are the nearest standard
values. Capacitor values may need to be adjusted slightly
to optimize performance. For more detailed information,
consult the section on Low Gain Compensation in the
OPA846 data sheet (SBOS250) located at www.ti.com.
Figure 5 shows the large-signal transient response using
the circuit given in Figure 4. As shown, the OPA338 is
stable in low gain applications and provides improved slew
rate performance when compared to the OPA337.
500mV/div
Time (2µs/div)
OPA338
OPA337
Figure 5. G = 2, Slew-Rate Comparison of the
OPA338 and the OPA337
TYPICAL APPLICATION
See Figure 6 for the OPA2337 in a typical application. The
ADS7822 is a 12-bit, micropower, sampling analog-to-
digital converter available in the tiny MSOP-8 package. As
with the OPA2337, it operates with a supply voltage as low
as +2.7V. When used with the miniature SOT23-8 package
of the OPA2337, the circuit is ideal for space-limited and
low-power applications. In addition, the OPA2337’s high
input impedance allows large value resistors to be used
which results in small physical capacitors, further reducing
circuit size. For further information, consult the ADS7822
data sheet (SBAS062) located at www.ti.com.
*9 TEXAS INSTRUMENTS + 1,2 ovum: 1 ‘2 mum: +
""#$ %""#
""&$ %""&
SBOS077BJUNE 1997 − REVISED MARCH 2005
www.ti.com
10
1/2
OPA2337E 1/2
OPA2337E ADS7822
12−Bit A/D
C3
V+
GND
3
18
45
6
7
IN
+IN
2
C2
33pF DCLOCK
Serial
Interface
1000pF
R1
1.5k
R4
20k
R5
20k
R6
100k
R8
150k
R9
510k
R7
51k
DOUT
VREF
V+ = +2.7V to 5V
CS/SHDN
C1
1000pF
Electret
Microphone(1)
G=100
Passband 300Hz to 3kHz
R3
1M
R2
1M
NOTE: (1) Electret microphone
with internal transistor (FET)
powered by R1.
Figure 6. Low-Power, Single-Supply, Speech Bandpass Filtered Data Acquisition System
0.035
(0.889)
0.10
(2.54)
0.018
(0.457) 0.026
(0.66)
SOT23−8
(Package Designator: DCN)
For further information on solder
pads for surface−mount packages, consult Application Bulletin SBFA015A.
SOT23−5
(Package Designator: D)
0.035
(0.889)
0.10
(2.54)
0.0375
(0.9525)
0.0375
(0.9525)
0.075
(1.905)
0.027
(0.686)
Figure 7. Recommended SOT23-5 and SOT23-8 Solder Footprints
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I‘KO '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width ED Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w Overau Wiotn onhe carrier tape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE QOODOOOO ,,,,,,,,,,, ‘ User DIreCIIDn 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2337EA/250 SOT-23 DCN 8 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA2337EA/3K SOT-23 DCN 8 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA2337UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA2338EA/250 SOT-23 DCN 8 250 180.0 8.4 3.15 3.1 1.55 4.0 8.0 Q3
OPA2338EA/3K SOT-23 DCN 8 3000 180.0 8.4 3.15 3.1 1.55 4.0 8.0 Q3
OPA2338UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA337EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA337NA/250 SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
OPA337NA/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA337NA/3K SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
OPA337UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA338NA/250 SOT-23 DBV 5 250 178.0 8.4 3.3 3.2 1.4 4.0 8.0 Q3
OPA338NA/3K SOT-23 DBV 5 3000 178.0 8.4 3.3 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2021
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2337EA/250 SOT-23 DCN 8 250 213.0 191.0 35.0
OPA2337EA/3K SOT-23 DCN 8 3000 213.0 191.0 35.0
OPA2337UA/2K5 SOIC D 8 2500 853.0 449.0 35.0
OPA2338EA/250 SOT-23 DCN 8 250 210.0 185.0 35.0
OPA2338EA/3K SOT-23 DCN 8 3000 210.0 185.0 35.0
OPA2338UA/2K5 SOIC D 8 2500 853.0 449.0 35.0
OPA337EA/250 VSSOP DGK 8 250 210.0 185.0 35.0
OPA337NA/250 SOT-23 DBV 5 250 180.0 180.0 18.0
OPA337NA/3K SOT-23 DBV 5 3000 203.0 203.0 35.0
OPA337NA/3K SOT-23 DBV 5 3000 180.0 180.0 18.0
OPA337UA/2K5 SOIC D 8 2500 853.0 449.0 35.0
OPA338NA/250 SOT-23 DBV 5 250 565.0 140.0 75.0
OPA338NA/3K SOT-23 DBV 5 3000 565.0 140.0 75.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2021
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
‘J
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
Yl“‘+
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
MECHANICAL DATA P (RiPMPi’E) "LAST‘C >4 >4 7 A V A A M Hnear dw‘ensmns are m inches (miH'nem's) B TH: druwmq is s bje“ :0 change thruut nonce C mus wmhm Juli"; Msiom vanmm BA NUTS DKMLiwi, N¥ PAL’KAC: 4 r ( “ V ‘ 7 v m 31H A H ‘ ‘ M H ‘—’ H w: H J; W“ D u‘ L , ,_ , 40mm: 04/2010 INSI'RUMENTS www.mzam
MECHANICAL DATA DGK (S—PDSO—GS) PLASTIC SMALL—OUTLINE PACKAGE m1 WW“: {[0 VAX % j 3,010 I 4073329/E 05/06 NO'ES' A AH imec' dimensmrs c'e m m'hmeiers 5 Th: drawing is enmec: :e change within: nciice. Body icnqth Coos mi mciucc maid Hash, protrusions or we tms Mom 'iush, aromons, ov qaw burrs shaH m exceed 015 per end b Budy mm does not wcude inierieud flasi‘ inieriead ‘iush s'mii 'mi exceed 050 pe' we : FuHs wiUHn JEDEC M0487 quulion AA, except 'vievieud ricer INSTRUMENTS w. (i. com
LAND PATTERN DATA DGK (37PD30708) PLASTIC SMALL OUTLINE PACKAGE Exampie Board Layout Exampie stencii Openings Based on a stencii thickness of .127mm L005inch), (See Nate 0) (,0 65) TYP ‘ Li 5 LLLLL L, pm ,,,,, PKG PKG "\ i i 4 — ----- i — ----- i D DU D i i ’ PKG PKG Q G . / Exampie , Non Soldermusk Defined Pad i , , —\ L A ~/ ‘\ Example \ Spider Musk Opening / +1 1‘(0,45) ‘ (See Note E) t 1 (1,45) < ‘="" \pud="" geometry="" ’="" (see="" note="" c)="" \="" +ii¢="" (0,05)="" \="" ah="" around="" «="" ,="" \="" e="" ’="" i="" ‘\-=""> muss/A 11/13 NOTES: A. Ali iinear dimensions are in miilimeters. a. This drawing is subject ta change without natiee, C, Publication |PCi7351 is recommended ior alternate designsu a. Laser cutting apertures with trapezoidui walls and aisa rounding corners w‘iH ofler eetter paste veiease. Customers snouid Contact their board ussembiy site for stencii design recommendations. Rater tn IFS—7525 for other slenci'i recummendutions. Customers should Contact their tmurd fabrication site for solder musk tolerances between and around signal pads. .r'I {I TEXAS INSTRUMENTS www.li.com
MECHANICAL DATA DCN 1‘ AST C SMA‘ \ 70UT N7 PAC
LAND PATTERN DATA DCN (RiPD80768) PLASTIC SM ALLi OU TLl NE PACKAGE (DlE DOWN) Example Board Luyoul Example stencil Design 0.125mm Stencil Thickness (Nate D) Q Q 540765) +1 No.35) *1 i i ,,1,,,# i,,,,,,, Example NonsSolder Mask Delined Pad Example Solder Mask oaenina (Note E) Fad Geometry Lioiosl * ‘1 All Around (0,45) mum/c o7/i3 NOTES: A, All linear dimensions are in millimetersa B. This drawing is subject to change without notice. 0. Publication IPCr7J5i is recommended tor alternate designs. D. Laser cutting apertures with trapezoidal walls and also rounding corners will alter better paste release. Customers should contact their board assembly site tor stencil design recommendations. Refer to chs7525. Eu Customers should contact their board lubrication site tar solder mask tolerances between and around signal pads, {a TEXAS INSTRUMENTS www.ti.com
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