BLM18HyyyySZ1D Ref Sheet Datasheet by Murata Electronics

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8950. N0. JENF243AV9123A701 BLM‘EHE1OZSZ‘ D BLM‘EHE1SZSZ‘ D Z‘D Z‘D BLM‘EHB12‘SZ‘D BLM‘EHBZZ‘SZ‘D 300'2 score 600(‘2 500(‘2 500(‘2 4oo(*2
Spec. No. JENF243A-9123A-01 P.1/8
MURATA MFG.CO., LTD.
Reference Only
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
GHz Noise Suppression Chip Ferrite Bead BLM18H□□□□SZ1D
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead BLM18H_SZ Series for Automotive Electronics
based on AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex.) BL M 18 HG 601 S Z 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (6)Performance
(2)Type (7)Category(for Automotive Electronics)
(3)Dimension (L×) (8)Numbers of Circuit
(4)Characteristics (9)Packaging (D:Taping )
(5)Typical Impedance at 100MHz
3. Rating
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(Under Standard Testing Condition)
(*1) (refer to below comment)
Rated
Current
(mA)
DC Resistance
(Ω max. )
(*1) (refer to below
comment) Remark ESD Rank
1C:1kV
at 100MHz at 1GHz at
85°C at
125°C Initial
Values
Values
After
Testing
Typical
BLM18HE601SZ1D 600±25% 300 min. 600 800(*2) 600(*2) 0.25 0.30 For
Large
Current
1C
BLM18HE102SZ1D 1000±25% 500 min. 1000 600(*2) 500(*2) 0.35 0.40
BLM18HE152SZ1D 1500±25% 750 min. 1500 500(*2) 400(*2) 0.50 0.55
BLM18HG471SZ1D 470±25% 400 min. 600 200 0.85 0.95
For
general
use
BLM18HG601SZ1D 600±25% 450 min. 700 200 1.0 1.1
BLM18HG102SZ1D 1000±25% 750 min. 1000 100 1.6 1.7
BLM18HD471SZ1D 470±25% 700 min. 1000 100 1.2 1.3
For
high
speed
signal line
BLM18HD601SZ1D 600±25% 850 min. 1200 100 1.5 1.6
BLM18HD102SZ1D 1000±25% 1100 min. 1700 50 1.8 1.9
BLM18HB121SZ1D 120±25% 500±40%. 200 0.5 0.6
BLM18HB221SZ1D 220±25% 1100±40%. 100 0.8 0.9
BLM18HB331SZ1D 330±25% 1600±40%. 50 1.2 1.3
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(*1)Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
(Note) As for the Rated current marked with (*2),
Rated Current is derated as right figure
depending on the operating temperature.
Reference Onl Spec. No. JENF243AV9123A701 wr—w \I‘U W \ I E Tab‘e A 0,85%HH
Spec. No. JENF243A-9123A-01 P.2/8
MURATA MFG.CO., LTD.
Reference Only
4. Style and Dimensions
Equivalent Circuit
(in mm) Unit Mass (Typical value) 0.005g
5. Marking
No marking.
6. Specifications
6-1. Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance
(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
No.
AEC-Q200 Murata Specification / Deviation
Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance Meet item 3.
4 Temperature Cyclin
g
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
5 Destructive
Physical Analysis Per EIA469
No electrical tests No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current. Meet Table A after testing.
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table A after testing.
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions No defects
12 Resistance to
Solvents Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Condition F
1500g(14.7N)/0.5ms/Half sine
Meet Table A after testing.
: Electrode
1.6±0.15 0.8±0.15
0.4±0.2
0.0.15
Resistance element becomes
dominant at high frequencies.
()
8950. N0. JENF243AV9123A701 minmes
Spec. No. JENF243A-9123A-01 P.3/8
MURATA MFG.CO., LTD.
Reference Only
φ
1.5
1.1max.
Direction of feed
4.0±0.1 4.0±0.1
1.85±0.1
2.0±0.05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.05±0.1
No.
AEC-Q200 Murata Specification / Deviation
Stress Test Method
14 Vibration 5g's(0.049N) for 20 minutes
,
12cycles each of 3
orientations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance
to Soldering Heat Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002 Meet Table A after testing.
ESD Rank:Meet Item 3. (Rating)
18 Solderability
Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization
Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
7. Specification of Packaging
7-1. Appearance and Dimensions (8mm-wide paper tape)
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
Reference Onl Spec. No. JENF243AV9123A701 % 0000 XXX
Spec. No. JENF243A-9123A-01 P.4/8
MURATA MFG.CO., LTD.
Reference Only
7-2. Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3. Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2) , Quantity , etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
7-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer
Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
Top tape
Bottom tape Base tape
165 to 180 degree F
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
W
D
Label
H
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Spec. No. JENF243A-9123A-01 P.5/8
MURATA MFG.CO., LTD.
Reference Only
8. Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product
may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropreate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment
(4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment (8)Transportation equipment (trains, ships, etc.)
(9)Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements to the applications listed in the above
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
Soldering a b c
Flow 0.8 2.5 0.7
Reflow 0.7 2.0 0.7
(in mm)
9-2. Soldering conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
a
b
Chip Ferrite Bead
Solder Resist
Pattern
c
Reference Onl Spec. No. JENF243AV9123A701
Spec. No. JENF243A-9123A-01 P.6/8
MURATA MFG.CO., LTD.
Reference Only
Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C, 60s min.
Heating 250°C, 4s~6s 265°C±3°C, 5s max.
Cycle of flow 2 times 2 times
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C~180°C, 90s±30s
Heating above 220°C, 30s~60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
9-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ferrite material due to the thermal shock.
Limit Profile
Standard Profile
90s±30s
230
260℃
245±3
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250
265℃±3
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
Sgec. N0. JENF243AV9123A701 ATE/g“ 10000 k ) Doom SHE“ m “ A > D is valrd when stress ‘5 added vertically m the perforatio If a Cullmg Drsc ‘5 used swess er be diagonal Io Ihe PCB, (3) Mounting Componems Near Screw Holes When a componem is mcumed hear a screw ho‘e, it may be a the tightemng or the screw. Mount Ihe ccmpcnem in a pesrheh [Ell-’Dj] Screw Hu‘e Rem 9-6. Mounting density Add speciar anention to radiating heal of products when mcunh The excesswe heal by other producls may cause delerioration MUHATA MFG.CO.,
Spec. No. JENF243A-9123A-01 P.7/8
MURATA MFG.CO., LTD.
Reference Only
9-4. Solder Volume
Solder shall be used not to be exceeded as shown below.
1/3TtT (T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways direction
(Length:a<b) to the mechanical stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Perforation
Slit
A
B
C
D
Screw Hole Recommended
Sgec. N0. JENF243A79123A701
Spec. No. JENF243A-9123A-01 P.8/8
MURATA MFG.CO., LTD.
Reference Only
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
9-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power : 20W/l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3)Cleaner
1.Cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5)Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress such as bending or twisting to the substrate when
cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the Product.
Bending Twisting
9-11. Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10 . ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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