AFBR-59R5LZ Datasheet by Foxconn OE Technologies Singapore Pte. LTD

View All Related Products | Download PDF Datasheet
AVBGO vscnuoLoaxss
Description
Avago Technologies’ AFBR-59R5LZ optical transceiver
supports high-speed serial links over multimode optical
fiber at signaling rates up to 4.25 GBd. Compliant with
the Small Form Factor (SFF) Multi Source Agreement
(MSA) 2x5/2x10 mechanical specifications for LC Duplex
transceivers, ANSI Fibre Channel FC-PI and IEEE 802.3 for
gigabit applications the part is electrically interoperable
with 2x5 and 2x6 conformant devices. The AFBR-59R5LZ
is dimensionally compliant with the SFF MSA form factor
with the exception of two additional pins for communi-
cating with the diagnostic interface.
As an enhancement to the conventional SFF 2x5 interface
defined in the SFF MSA (Multi-Source Agreement), the
AFBR-59R5LZ is compliant to SFF-8472 (digital diagnostic
interface for optical transceivers). Using the 2-wire serial
interface defined in the SFF-8472 MSA, the AFBR-59R5LZ
provides real time temperature, supply voltage, laser bias
current, laser average output power and received average
input power.
This information is in addition to conventional SFP/GBIC
base data. The digital diagnostic interface also adds the
ability to disable the transmitter (TX_DISABLE), moni-
tor for Transmitter Faults (TX_FAULT) and monitor for
Receiver Signal Detect (Sig_Det). This 2x7 package also
includes one dedicated ‘hard’ pin for TX_FAULT.
Application
Fibre Channel and iSCSI HBA Cards
Related Products
AFBR-57R5APZ: 850 nm +3.3 V LC SFP for
4.25/2.125/1.0625 GBd Fibre Channel
AFBR-59R5LZ
Digital Diagnostic 2x7 SFF 850 nm 4.25/2.125/1.0625 GBd,
RoHS-Compliant Optical Transceiver
Data Sheet
Features
Fully RoHS Compliant
Diagnostic Features Per SFF-8472 “Diagnostic
Monitoring Interface for Optical Transceivers
Real time monitoring of:
- Transmitted Optical Power
- Received Optical Power
- Laser Bias Current
- Temperature
- Supply Voltage
Wide Temp and supply voltage operation
(-10°C to 85°C) (3.3 +/- 10%)
Transceiver Specifications per SFF 2x5 Multi-Source
Agreement and SFF-8472 (revision 9.3)
- 4.25 GBd Fibre Channel operation
for FC-PI 400-M5-SN-I and 400-M6-SN-I
- 2.125 GBd Fibre Channel operation
for FC-PI 200-M5-SN-1 and 200-M6-SN-I
- 1.0625 GBd Fibre Channel operation
for FC-PI 100-M5-SN-I and 100-M6-SN-I
Link Lengths at 4.25 Gbd:
- 150 m with 50 um MMF, 70 m with 62.5 um MMF
Link Lengths at 2.125 Gbd
- 300m with 50um MMF, 150m with 65.5um MMF
Link Lengths at 1.0625 GBd:
- 500 m with 50 µm MMF, 300 m with 62.5 µm MMF
LC Duplex optical connector interface conforming
to ANSI TIA/EIA604-10 (FOCIS 10A)
850nm Vertical Cavity Surface Emitting Laser
(VCSEL) Source Technology
IEC 60825-1 Class 1/CDRH Class 1 laser eye safe
Compatible with Gigabit Ethernet
Patent - www.avagotech.com/patents
______________________________________
2
Figure 1. Transceiver Functional Diagram
Digital Diagnostic Interface and Serial Identification
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conven-
tional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diagnostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diag-
nostic information provides the opportunity for Predic-
tive Failure Identification, Compliance Prediction, Fault
Isolation and Component Monitoring.
The I2C accessible memory page address 0xB0 is used
internally by SFP for the test and diagnostic purposes
and it is reserved.
Predictive Failure Identification
The predictive failure feature allows a host to identify
potential link problems before system performance is
impacted. Prior identification of link problems enables
a host to service an application via “fail over to a redun-
dant link or replace a suspect device, maintaining system
uptime in the process. For applications where ultra-high
system uptime is required, a digital SFF provides a means
to monitor two real-time laser metrics associated with
observing laser degradation and predicting failure: aver-
age laser bias current (Tx_Bias) and average laser optical
power (Tx_Power).
Compliance Prediction:
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-59R5LZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received
optical power is also available to assess compliance of
a cable plant and remote transmitter. When operating
out of requirements, the link cannot guarantee error free
transmission.
Fault Isolation
The fault isolation feature allows a host to quickly pin-
point the location of a link failure, minimizing system
downtime. For optical links, the ability to identify a fault
at a local device, remote device or cable plant is crucial
to speeding service of an installation. AFBR-59R5LZ real-
time monitors of Tx_Bias, Tx_Power, Vcc, Temp and Rx
average power can be used to assess local transceiver
current operating conditions. In addition, status flags Tx
Disable and Rx Signal Detect are mirrored in memory and
available via the two-wire serial interface.
LIGHT FROM FIBER
LIGHT TO FIBER
PHOTO-DETECTOR
RECEIVER
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RD- (RECEIVE DATA)
Rx SIGNAL DETECT
VCSEL
TRANSMITTER
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TD- (TRANSMIT DATA)
TX_FAULT
ELECTRICAL INTERFACE
MOD-DEF2 (SDA)
MOD-DEF1 (SCL)
MOD-DEF0
CONTROLLER & MEMORY
OPTICAL INTERFACE
3
Component Monitoring
The AFBR-59R5LZ real-time monitors of Tx_Bias, Tx_Pow-
er, Vcc, Temp and Rx Average Power may potentially be
used as a debugging aid for system installation and de-
sign, and transceiver parametric evaluation for factory or
field qualification. For example, temperature per module
can be observed in high-density applications to facilitate
thermal evaluation of blades and systems.
Transmitter Section
The transmitter section contains 850nm VCSEL (Vertical
Cavity Surface Emitting Laser) light source, located at the
optical interface which mates with the LC optical con-
nector. The VCSEL is driven by a custom IC which uses
the incoming differential (PECL compatible) high speed
logic signal to modulate laser diode driver current. This
Tx laser driver circuit regulates optical output power at a
constant level provided the incoming data pattern is dc
balanced (8B/10B code, for example).
Transmit Disable (Tx_Disable)
The AFBR-59R5LZ accepts a TTL transmit disable control
signal input which shuts down the transmitter. A high
signal implements this function while a low signal allows
normal transceiver operation. In the event of a fault (e.g.
eye safety circuit activated), cycling this control signal
resets the module as depicted in Figure 5. An internal
pull down resistor enables the laser if the line is not con-
nected on the host board. Host systems should allow
a 10ms interval between successive assertions of this
control signal. Tx_Disable can be asserted via the two-
wire serial interface (address A2h, byte 110, bit 6) and
monitored (address A2h, byte 110, bit 7).
The contents of A2h, byte 110 bit 6 are logic Or’d with the
TX_DISABLE pin to control the transmit output.
Eye Safety Circuit
The AFBR-59R5LZ provides Class 1 (single fault tolerant)
eye safety by design and has been tested for compliance
with the requirements listed in Table 1. The eye safety
circuit continuously monitors optical output power levels
and will disable the transmitter upon detecting an un-
safe condition beyond the scope of Class 1 certification.
Such unsafe conditions can be due to inputs from the
host board (Vcc fluctuation, unbalanced code) or a fault
within the transceiver.
Receiver Section
The receiver section contains a PIN photodiode and cus-
tom transimpedance preamplifier, located at the optical
interface which mates with the LC optical connector. The
output is fed to a custom IC that provides post-amplifica-
tion and quantization.
Signal Detect (Sig_Det)
The post-amplification IC also includes the transition
detection circuitry which monitors the ac level of incom-
ing optical signals and provides a TTL status signal to the
host. An adequate optical input results in high signal
detect output while a low signal detect output indicates
an unusable optical input. The signal detect thresholds
are set so that a low output indicates a definite optical
fault has occurred. Signal Detect can be monitored via
the two-wire serial (address A2h, byte 110, bit 1).
4
Functional Data I/O
The AFBR-59R5LZ interfaces with the host circuit board
through fourteen I/O pins (2x7) identified by function
in Table 2. These pins are sized for the use in boards be-
tween 0.062 in. and 0.100 in. thick. The board layout for
this interface is depicted in Figure 7.
The AFBR-59R5LZ transmit and receive interfaces are
PECL compatible. To simplify board requirements,
transmitter bias resistors and ac coupling capacitors are
incorporated into the transceiver module and so are not
required on the host board. The Tx_Disable and Signal
Detect lines require TTL lines on the host board if they
are to be utilized. The transceiver will operate normally if
these lines are not connected on the host board.
Figure 2 depicts the recommended interface circuit to
link the AFBR-59R5LZ to the supporting physical layer
ICs. Timing for MSA compliant control signals imple-
mented in the transceiver are listed on Page 12 and
diagramed in Figure 5.
PCB Assembly Process Compatibility
The AFBR-59R5LZ is compatible with industry standard
wave solder and aqueous wash processes as detailed on
Page 13. The transceiver is shipped with a process plug
to keep out impinging liquids, but is not intended to be
immersed. After assembly, the process plug should be
kept in place as a dust plug when the transceiver is not
in use.
Caution
There are no user serviceable parts nor maintenance
requirements for the AFBR-59R5LZ. All mechanical
adjustments are made at the factory before shipping.
Tampering with, modifying, misusing or improperly han-
dling the AFBR-59R5LZ will void the product warranty.
It may also result in improper operation and possibly
overstress the laser source. Performance degradation
or device failure may result. Connection of the AFBR-
59R5LZ to a light source not compliant to IEEE 802.3 or
ANSI FC-PI specifications, operating above the maximum
operating conditions or in a manner inconsistent with its
design and function may result in exposure to hazardous
light radiation and may constitute an act of modifying or
manufacturing a laser product.
Persons performing such an act are required by law to
re-certify and re-identify the laser product under the
provisions of U.S. 21 CFR (Subchapter J) and the TUV.
Ordering Information
Please contact your local field sales engineer or one of
Avago Technologies franchised distributors for ordering
information. For technical information, please visit Ava-
go Technologies WEB page at www.avagotech.com or
contact Avago Technologies Customer Response Center
at 1-800-235-0312. For information related to SFF Com-
mittee documentation visit www.sffcommittee.org
E3
5
Table 1. Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge (ESD)
to the Electrical Pins
MIL-STD-883C
Method 3015.4
Class 1 (> 2000 Volts)
Electrostatic Discharge (ESD)
to the Duplex LC Receptacle
Variation of IEC 61000-4-2 Typically withstands at least 15 kV without dam-
age when the duplex LC connector receptacle is
contacted by a Human Body Model probe.
Fulfills Live Traffic ESD testing up to 8 kV with
less than 1 errored second.
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
System margins are dependent on customer
board and chassis design.
Immunity Variation of IEC 61000-4-3 Typically shows no measurable effect from a 10
V/m field swept from 10 MHz to 1 GHz applied
to the transceiver without a chassis enclosure
Laser Eye Safety and
Equipment Type Testing
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per Paragraphs
1002.10 and 1002.12.
(IEC) EN60825-1: 2007
(IEC) EN60825-2: 2004+A1
(IEC) EN60950-1: 2006+A11
CDRH certification #9720151-57
TUV file #R72102088.01
Component Recognition Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment
UL File # E173874
Must comply with UL1950 or CUL 1950.
RoHS Compliance Less than 1000ppm of cadmium, lead, mercury,
hexavalent chromium, polybrominated biphe-
nyls, and polybrominated biphenyl ethers
Regulatory Compliance
The AFBR-59R5LZ complies with all applicable laws and
regulations as detailed in Table 1. Certification level
is dependent on the overall configuration of the host
equipment. The transceiver performance is offered as a
figure of merit to assist the designer.
Electrostatic Discharge (ESD)
The AFBR-59R5LZ is compatible with ESD levels found
in typical manufacturing and operating environments
as described in Table 1. In the normal handling and op-
eration of optical transceivers, ESD is of concern in two
circumstances.
The first case is during handling of the transceiver prior
to soldering onto the host board. To protect the device,
it’s important to use normal ESD handling precautions.
These include using grounded wrist straps, workbenches
and floor mats wherever the transceiver is handled.
The second case to consider is static discharges to the
exterior of the host equipment chassis after assembly.
If the optical interface is exposed to the exterior of host
equipment cabinet, the transceiver may be subject to
system level ESD requirements.
Electromagnetic Interference (EMI)
Equipment incorporating gigabit transceivers is typically
subject to regulation by the FCC in the United States, TUV
and CENELEC EN55022 (CISPR 22) in the European Union
and VCCI in Japan. The AFBR-59R5LZ’s compliance to
these standards is detailed in Table 1. The metal housing
and shielded design of the AFBR-59R5LZ minimize the
EMI challenge facing the equipment designer.
Flammability
The AFBR-59R5LZ optical transceiver is made of metal
and high strength, heat resistant, chemical resistant and
UL 94V-0 flame retardant plastic.
EMI Immunity
Due to its shielded design, the EMI immunity of the
AFBR-59R5LZ exceeds typical industry standards.
BAUART
GEPRUFT
TYPE
APPROVED
TUV
Rheinland
Product Safety
¨
¨
III—IF ‘IHF ‘IHF ‘IHF ‘IHF
6
Figure 2. Typical Application Configuration
Figure 3. Recommended Power Supply Filter
LASER DRIVER
RX_SD
SCL
SDA
Tx_FAULT
Tx_DISABLE
TD+
Tx FAULT
Tx DIS
TD Ð
RD+
RX_SD
SDA
SCL
VCC,R
GND
50
50
4.7 k to 10 k
PROTOCOL IC
VCC ,T
GND
VCC ,R
1 H
1 H
10 F 0.1 F
0.1 F
10 F 0.1 F
3.3 V
3.3 V
SERDES IC
GND,T
0.01 F
0.01 F
POST AMPLIFIER
100
4.7 k to 10 k
100
6.8 k
0.01 F
VCC ,R
0.01 F
4.7 k to 10 k
VCC ,R
RD-
GND
1 µH
1 µH
0.1 µF
VCCR
SFF MODULE
10 µF
VCCT
0.1 µF 10 µF
3.3 V
HOST BOARD
0.1 µF
NOTE: INDUCTORS MUST HAVE LESS THAN 1 W SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFF MODULE.
000.00. m [U E H , '00.... a
7
Figure 4. Module pin configuration.
6
7
8
9
10
5
4
3
2
1
TOP VIEW
B
D
A
C
Table 2. Pin Description
Pin Name Function/Description Notes
1 VEER Receiver Signal Ground 7
2 VCCR Receiver Power Supply: +3.3V 5
3 SD TTL Signal Detect: Active High 3
4 RD- Received Data Out Bar 4
5 RD+ Received Data Out 4
6 VCCT Transmitter Power Supply: +3.3V 5
7 VEET Transmitter Signal Ground 7
8 TX_DISABLE TTL Transmitter Disable: Active High,
(Open = Enabled)
1
9 TD+ Transmitter Data In 6
10 TD- Transmitter Data In Bar 6
ASDA Serial Interface Data I/O (Mod-def2) 2
B SCL Serial Interface Clock Input (Mod-def1) 2
C NC
D TX_FAULT Transmitter Fault Indication - High Indicates a
fault condition
8
Notes:
1. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is pulled down with 6.8 kW internal to the transceiver.
Low (0 – 0.8 V) or Open: Transmitter Enabled
Between (0.8 V and 2.0 V): Undefined
High (2.0 – VCC max): Transmitter Disabled
The TX_DISABLE pin state is logic Or’d with the contents of EEPROM address A2h, byte 110 bit 6 (soft disable control bit) to control the trans-
mit output.
2. The signals SDA and SCL designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kW resistor on the host board.
SCL is the serial clock line of two wire serial interface. SDA is the serial data line of two wire serial interface
3. Signal Detect is a normally high LVTTL output. When high it indicates the received optical power is adequate for normal operation. When
Low, it indicates the received optical power is insufficient to guarantee error free operation. In the low state, the output will be pulled to <
0.8 V.
4. RD-/+ designate the differential receiver outputs. They are ac coupled 100 W differential lines which should be terminated with 100 W differ-
ential at the host SerDes input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these
lines will be between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated.
5. VCCR and VCCT are the receiver and transmitter power supplies. They are defined at the transceiver pins.
6. TD-/+ designate the differential transmitter inputs. They are ac coupled differential lines with 100 W differential termination inside the mod-
ule. The ac coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400
mV (200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended)
be used for best EMI performance.
7. Transmitter and Receiver Ground are common internally on the transceiver PCB. They are electrically connected to signal ground within the
transceiver.
8. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7k – 10kW resistor on the host board. When high, this output
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.
8
Table 3. Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Unit Notes
Storage Temperature TS-40 +100 °C 1, 2
Case Operating Temperature TC-40 +100 °C 1, 2
Aqueous Wash Pressure 110 psi
Maximum Wave or Flow Soldering Temperature TF+260 °C 4
Relative Humidity, non condensing RH 5 95 % 1
Supply Voltage VCCT, R -0.5 3.8 V 1, 2, 3
Voltage to any pin -0.5 3.8 V
Low Speed Input Voltage VIN -0.5 VCC + 0.5 V 1
Table 4. Recommended Operating Conditions
Parameter Symbol Minimum Maximum Unit Notes
Case Operating Temperature TC-10 +85 °C 5, 6
Supply Voltage VCCT, R 2.97 3.63 V 6, 7
Data Rate 1.0625 4.25 Gb/s 6
Table 5. Transceiver Electrical Characteristics
(TC = -10°C to +85C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Maximum Unit Notes
AC Electrical Characteristics
Power Supply Noise Rejection (Peak-to-Peak) PSNR 100 mV 6
DC Electrical Characteristics
Module Supply Current ICC 210 mA TX + RX
Power Dissipation PDISS 765 mW
Low Speed Outputs:
Signal Detect [SD], SDA VOH
VOL
2.0 VCCT, R + 0.3
0.8
V
V
Low Speed Inputs:
Transmitter Disable [TX_DIS], SCL, SDA VIH
VIL
2.00 VCC
0.8
V
V
7
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a
short period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur over an extended period of time.
3. The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur.
4. Maximum wave or flow soldering temperature should not be applied for more than 10 seconds.
5. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.
6. Filter per SFF specification is required on host board to remove 10 Hz to 4 MHz content.
7. SCL and SDA are to be pulled up externally with a 4.7 k – 10 kW resistor on the host board to 3.3 V.
9
Table 6. Transmitter and Receiver Electrical Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Maximum Unit Notes
High Speed Data Input:
Transmitter Differential Input Voltage (TD +/-)
VI400 2400 mV 1
High Speed Data Output:
Receiver Differential Output Voltage (RD +/-)
VO600 1600 mV 2
Receiver Contributed Total Jitter
(4.25 Gb/s)
TJ 0.26 UI 4
62 ps
Receiver Contributed Total Jitter
(2.125 Gb/s)
TJ 0.262 UI 4
123 ps
Receiver Contributed Total Jitter
(1.0625 Gb/s)
TJ 0.218 UI 4
205 ps
Receiver Electrical Output Rise & Fall Times
(20-80%)
tr, tf 50 150 ps 5
Notes:
1. Internally ac coupled and terminated (100 Ohm differential).
2. Internally ac coupled but requires an external load termination (100 Ohm differential).
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern
4. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter
(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed
RJ is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ
remain within their specified FC-PI maximum limits with the worst case specified component jitter input.
5. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.
10
Table 7. Transmitter Optical Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Maximum Unit Notes
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 4.25 Gb/s
OMA 247 µW 8
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 2.125 Gb/s
OMA 196 µW 3
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 1.0625 Gb/s
OMA 156 µW 4
Average Optical Output Power Pout -9.0 dBm 1, 2
Center Wavelength lC830 860 nm
Spectral Width - rms s,rms 0.85 nm
Optical Rise/Fall Time tr, tf 90 ps 7
RIN 12 (OMA) RIN -118 dB/Hz
Transmitter Contributed Total Jitter (4.25 Gb/s) TJ 0.25 UI 6
60 ps
Transmitter Contributed Total Jitter (2.125 Gb/s) TJ 0.254 UI 6
120 ps
Transmitter Contributed Total Jitter (1.0625 Gb/s) TJ 0.267 UI 6
251 ps
Pout TX_DISABLE Asserted POFF -35 dBm
Notes:
1. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power max.
2. Into 50/125 µm (0.2 NA) and 62.5/125 µm (0.275 NA)multimode optical fiber.
3. An OMA of 196 is approximately equal to an average power of –9 dBm assuming an Extinction Ratio of 9 dB.
4. An OMA of 156 is approximately equal to an average power of –10 dBm assuming an Extinction Ratio of 9 dB.
5. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern.
6. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter
(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ
is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ re-
main within their specified FC-PI maximum limits with the worst case specified component jitter input.
7. Measured 20-80%.
8. An OMA of 247 µW is approximately equal to an average power of –8 dBm,avg assuming an Extinction Ratio of 9 dB.
11
Table 8. Receiver Optical Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Maximum Unit Notes
Input Optical Power [Overdrive] PIN 0 dBm, avg
Input Optical Modulation Amplitude (p-p)
4.25 Gb/s
OMA 61 µW, OMA 6, 7
Input Optical Modulation Amplitude (p-p)
2.125 Gb/s
OMA 49 µW, OMA 1, 6
Input Optical Modulation Amplitude (p-p)
1.0625 Gb/s
OMA 31 µW, OMA 2, 6
Stressed receiver sensitivity (OMA)
4.25 Gb/s
138 µW, OMA 50/125 µm fiber, 8
148 µW, OMA 62.5/125 µm fiber, 8
Stressed receiver sensitivity (OMA)
2.125 Gb/s
96 µW, OMA 50/125 µm fiber, 3
109 µW, OMA 62.5/125 µm fiber, 3
Stressed receiver sensitivity (OMA)
1.0625 Gb/s
55 µW, OMA 50/125 µm fiber, 4
67 µW, OMA 62.5/125 µm fiber, 4
Return Loss 12 dB
Signal Detect - Deassert PD27.5 uW, OMA
-30 -17.5 dBm, avg 5
Signal Detect - Assert PA31 uW, OMA
-17.0 dBm, avg 5
Loss of Signal Hysteresis PA - PD0.5 dB
Notes:
1. 50/125 µm. An OMA of 49 is approximately equal to an average power of –15 dBm with an Extinction Ratio of 9dB.
2. 50/125 µm. An OMA of 31 is approximately equal to an average power of –17 dBm with an Extinction Ratio of 9 dB.
3. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver
DCD component min (at TX) is 40 ps.
4. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver
DCD component min (at TX) is 80 ps.
5. These average power values are specified with an Extinction Ratio of 9 dB. The signal detect circuitry responds to valid 8B/10B encoded peak
to peak input optical power, not average power.
6. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.
7. 50/125um. An OMA of 61 µW is approximately equal to an average power of –14 dBm with an Extinction Ratio of 9 dB.
8. 4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.67 dB for 50 µm fiber and 2.14 dB for 62.5 µm fiber. Stressed receiver DCD
component min (at TX) is 20 ps.
12
Table 9. Transceiver Soft Diagnostic Timing Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
Hardware TX_DISABLE Assert Time t_off 10 µs 1
Hardware TX_DISABLE Negate Time t_on 1 ms 2
Time to initialize, including reset of
TX_FAULT
t_init 300 ms 3
Hardware TX_DISABLE to Reset t_reset 10 µs 4
Hardware Signal_Detect Deassert Time t_SD_off 100 µs 5
Hardware Signal_Detect Assert Time t_SD_on 100 µs 6
Software TX_DISABLE Assert Time t_off_soft 100 ms 7
Software TX_DISABLE Negate Time t_on_soft 100 ms 8
Software Tx_FAULT Assert Time t_fault_soft 100 ms 9
Software Signal_Detect DeAssert Time t_SD_off_soft 100 ms 10
Software Signal_Detect Assert Time t_SD_on_soft 100 ms 11
Analog parameter data ready t_data 1000 ms 12
Serial bus hardware ready t_serial 300 ms 13
Write Cycle Time t_write 10 ms 14
Serial ID Clock Rate f_serial_clock 400 kHz
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
5. Time from loss of optical signal to Signal Detect De-Assertion.
6. Time from valid optical signal to Signal Detect Assertion.
7. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
8. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
9. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
10. Time for two-wire interface de-assertion of Signal Detect (A2h, byte 110, bit 1) from loss of optical signal.
11. Time for two-wire interface assertion of Signal Detect (A2h, byte 110, bit 1) from presence of valid optical signal.
12. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
13. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
14. Time from stop bit to completion of a 1-8 byte write command. The I2C bus must be silent during Write Cycle Time.
13
Table 10. PCB Assembly Process Compatibility
Parameter Symbol Minimum Typical Maximum Unit Notes
Hand Lead Soldering
Temperature/Time
TSOLD/tSOLD + 260/10 °C/sec
Wave Soldering and
Aqueous Wash
TSOLD/tSOLD + 260/10 °C/sec
Aqueous Wash Pressure 110 psi
Table 11. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
(TC = -10 °C to +85 °C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Min Units Notes
Transceiver (Internal)
Temperature Accuracy
TINT ± 3.0 °C Temperature is measured internal to the transceiver and does
not reflect case temperature.
Valid from = -10°C to +70 °C internal transceiver temperature.
Transceiver (Internal)
Supply Voltage Accuracy
VINT ± 0.1 V Supply voltage is measured internal to the transceiver and
can, with less accuracy, be correlated to voltage at the SFF Vcc
pin. Valid over 3.3 V ± 10%.
Transmitter Laser DC
Bias Current Accuracy
IBIAS ± 10 % IBIAS is better than ± 10% of the nominal value.
Transmitted Optical Output Power
Accuracy (AVG - average power)
PT± 3.0 dB Coupled into 50/125 µm multimode fiber.
Valid from 100 µW,avg to 500 µW, avg.
Received Optical Input Power
Accuracy (Average power))
PR± 3.0 dB Coupled from 50/125 µm multimode fiber.
Valid from 31 µW,OMA to 500 µW,OMA.
1;?
14
Figure 5. Transceiver Timing Diagrams (Tx_FAULT as reported by A2h Byte 110 Bit 2)
Tx_FAULT
VCC > 2.97 V
t_init
Tx_DISABLE
TRANSMITTED SIGNAL
t_init
Tx_FAULT
VCC > 2.97 V
Tx_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED
t_off
Tx_FAULT
Tx_DISABLE
TRANSMITTED SIGNAL
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
t_on
Tx_FAULT
OCCURANCE OF FAULT
t_fault
Tx_DISABLE
TRANSMITTED SIGNAL
Tx_FAULT
OCCURANCE OF FAULT
Tx_DISABLE
TRANSMITTED SIGNAL
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
t_reset t_init*
* CANNOT READ INPUT...
Tx_FAULT
OCCURANCE OF FAULT
t_fault
Tx_DISABLE
TRANSMITTED SIGNAL
t-fault: TX DISABLE ASSERTED THEN NEGATED,
TX SIGNAL NOT RECOVERED
t_init*
t_reset
* SFP SHALL CLEAR Tx_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
t_SD_on
OPTICAL SIGNAL
SD
t_SD_off
NO OPTICAL
SIGNAL
t_SD_off & t_SD_on
15
Table 12. EEPROM Serial ID Memory Contents – Conventional SFF Memory (Address A0h)
Byte #
Decimal
Data
Hex Notes
Byte #
Decimal
Data
Hex Notes
0 02 SFF physical device (soldered device) 37 00 Hex Byte of Vendor OUI 4
1 04 Serial ID function supported 38 17 Hex Byte of Vendor OUI 4
2 07 LC optical connector 39 6A Hex Byte of Vendor OUI 4
3 00 40 41 A - Vendor Part Number ASCII character
4 00 41 46 “F” - Vendor Part Number ASCII character
5 00 42 42 “B” - Vendor Part Number ASCII character
6 00 43 52 “R” - Vendor Part Number ASCII character
7 20 Intermediate distance (per FC-PI) 44 2D “-” - Vendor Part Number ASCII character
8 40 Shortwave laser w/o OFC (open fiber control) 45 35 “5” - Vendor Part Number ASCII character
9 0C Multi-mode 50 µm and 62.5 µm optical media 46 39 “9” - Vendor Part Number ASCII character
10 15 100, 200 & 400 MBytes/sec FC-PI speed 147 52 “R” - Vendor Part Number ASCII character
11 01 Compatible with 8B/10B encoded data 48 35 “5” - Vendor Part Number ASCII character
12 2B 4300 MBit/sec nominal bit rate (4.25 Gbit/s) 49 -- “*” - Vendor Part Number ASCII character 9
13 00 50 4C “L - Vendor Part Number ASCII character
14 00 51 5A “Z” - Vendor Part Number ASCII character
15 00 52 20 “ - Vendor Part Number ASCII character
16 0F 150m of 50/125 µm fiber @ 4.25GBit/sec 253 20 “ - Vendor Part Number ASCII character
17 07 70m of 62.5/125um fiber @ 4.25GBit/sec 354 20 “ - Vendor Part Number ASCII character
18 00 55 20 “ - Vendor Part Number ASCII character
19 00 56 20 “ - Vendor Part Number ASCII character
20 41 A” - Vendor Name ASCII character 57 20 “ - Vendor Part Number ASCII character
21 56 V - Vendor Name ASCII character 58 20 “ - Vendor Part Number ASCII character
22 41 A” - Vendor Name ASCII character 59 20 “ - Vendor Part Number ASCII character
23 47 “G” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength 5
24 4F “O” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength 5
25 20 “ - Vendor Name ASCII character 62 00
26 20 “ - Vendor Name ASCII character 63 Checksum for Bytes 0-62 6
27 20 “ - Vendor Name ASCII character 64 00
28 20 “ - Vendor Name ASCII character 65 1C Hardware SFF TX_DISABLE, TX_FAULT & Sig-
Det
29 20 “ - Vendor Name ASCII character 66 00
30 20 “ - Vendor Name ASCII character 67 00
31 20 “ - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters 7
32 20 “ - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters 8
33 20 “ - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Avg Pwr
34 20 “ - Vendor Name ASCII character 93 F0 A/W, Soft TX_DISABLE, TX_FAULT & “RX_LOS”
(signal detect)
35 20 “ - Vendor Name ASCII character 94 01 SFF-8472 Compliance to revision 9.3
36 00 95 Checksum for Bytes 64-94 6
96 - 255 00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a serial
bit rate of 4.25 GBit/sec.
2. Link distance with 50/125um cable at 1.0625 Gbit/sec is 500m. Link distance at 2.125 Gbit/sec is 300m.
3. Link distance with 62.5/125um cable at 1.0625 Gbit/sec is 300m. Link distance with 62.5/125um cable at 2.125 Gbit/sec is 150m.
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074i) and stored prior to product shipment.
7. Addresses 68-83 specify the AFBR-59R5LZ ASCII serial number and will vary on a per unit basis.
8. Addresses 84-91 specify the AFBR-59R5LZ ASCII date code and will vary on a per date code basis.
9. For AFBR-59R5LZ, address 49-51 contains “L, “Z”, “ (Hex 4C 5A and 20). For AFBR-59R5ALZ, address 49-51 contains A”, “L, “Z” (Hex 41 4C 5A).
16
Table 13. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte #
Decimal Notes
Byte #
Decimal Notes
Byte #
Decimal Notes
0 Temp H Alarm MSB126 Tx Pwr L Alarm MSB4104 Real Time Rx Pwr, MSB5
1 Temp H Alarm LSB127 Tx Pwr L Alarm LSB4105 Real Time Rx Pwr, LSB5
2 Temp L Alarm MSB128 Tx Pwr H Warning MSB4106 Reserved
3 Temp L Alarm LSB129 Tx Pwr H Warning LSB4107 Reserved
4 Temp H Warning MSB130 Tx Pwr L Warning MSB4108 Reserved
5 Temp H Warning LSB131 Tx Pwr L Warning LSB4109 Reserved
6 Temp L Warning MSB132 Rx Pwr H Alarm MSB5110 Status/Control - See Table 14
7 Temp L Warning LSB133 Rx Pwr H Alarm LSB5111 Reserved
8 VCC H Alarm MSB234 Rx Pwr L Alarm MSB5112 Flag Bits - See Table 15
9 VCC H Alarm LSB235 Rx Pwr L Alarm LSB5113 Flag Bits - See Table 15
10 VCC L Alarm MSB236 Rx Pwr H Warning MSB5114 Reserved
11 VCC L Alarm LSB237 Rx Pwr H Warning LSB5115 Reserved
12 VCC H Warning MSB238 Rx Pwr L Warning MSB5116 Flag Bits - See Table 15
13 VCC H Warning LSB239 Rx Pwr L Warning LSB5117 Flag Bits - See Table 15
14 VCC L Warning MSB240-55 Reserved 118 Reserved
15 VCC L Warning LSB256-94 External Calibration Constants6119 Reserved
16 Tx Bias H Alarm MSB395 Checksum for Bytes 0-947120-127 Reserved
17 Tx Bias H Alarm LSB396 Real Time Temperature MSB1128-247 Customer Writeable8
18 Tx Bias L Alarm MSB397 Real Time Temperature LSB1248-254 Vendor Specific
19 Tx Bias L Alarm LSB398 Real Time VCC MSB2
20 Tx Bias H Warning MSB399 Real Time VCC LSB2
21 Tx Bias H Warning LSB3100 Real Time Tx Bias MSB3
22 Tx Bias L Warning MSB3101 Real Time Tx Bias LSB3
23 Tx Bias L Warning LSB3102 Real Time Tx Power MSB4
24 Tx Pwr H Alarm MSB4103 Real Time Tx Power LSB4
25 Tx Pwr H Alarm LSB4
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256 degrees C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 uV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 uA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.
5. Received average power (RX Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.
6. Bytes 56-94 are not intended for use with AFBR-59R5LZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
8. Bytes 128-247 are write enabled (customer writeable) .
17
Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Bit # Status/Control Name Description Notes
7 TX_ DISABLE State Digital state of SFF TX_ DISABLE Input Pin (1 = TX_DISABLE asserted) 1
6Soft TX_ DISABLE Read/write bit for changing digital state of SFF TX_DISABLE function11, 2
5 reserved
4 reserved
3 reserved
2 TX_FAULT State Digital state of the laser fault function (1 = Laser Fault Detected) 1
1 Signal Detect State Digital state of the SFF Sig_Det Output Pin (1 = Signal Detect DeAsserted) 1, 4
0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) 1
Notes:
1. The response time for soft commands of the AFBR-59R5LZ is 100msec as specified by the MSA SFF-8472
2. Bit 6 is logic OR’d with the SFF TX_DISABLE input pin 8 either asserted will disable the SFF transmitter.
3. AFBR-59R5LZ meets the MSA SFF-8472 data ready timing of 1000 msec.
4. The logic level of the register “Signal Detect State is inverse to the “Signal Detect HW pin.
Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)
Byte Bit Flag Bit Name Description
112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold.
6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold.
5 VCC High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold.
4 VCC Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold.
3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold.
2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold.
1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold.
0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold.
113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold.
6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold.
0-5 reserved
116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold.
6Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold.
5 VCC High Warning Set when transceiver internal supply voltage exceeds high warning threshold.
4 VCC Low Warning Set when transceiver internal supply voltage exceeds low warning threshold.
3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold.
2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold.
1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold.
0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold.
117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold.
6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold.
0-5 reserved
museum A .II mmucmm -mooouoo
18
Figure 6. Mechanical Drawing - AFBR-59R5LZ
14.20
±0.10
0.559
±0.004
13 ±0.10
0.512 ±0.004
14.23
0.56
15
10.16
0.40
678
PLUG
C A 1 2 3 4
D
10
9
AREA FOR
PROCESS
B
0.40
±0.002
0.040
1.02
±0.05
(X2)
10.16
0.46
±0.05
(X14)
0.018
±0.002
5
0.115
2.92 MIN
0.38
9.65
0.37
9.35
1.78
(12X)
0.07
13.59
1.92
0.54
MAX
13.35
0.53
TX fault
RD+
RD-
SD
VccR
VeeR
SDA
Rate select
VccT
VeeT
Tx-Disable
TD+
TD-
SCL
TC position
6.25
±0.05
0.246
±0.002
3.390 [.350] EF y—lmo W MM Lzua] ,w . m (m “magma“ m mm W m <3 ¢0="" 0063="" a="" w”="" 3’="" 93="" 00w)="" a="" ”wnw="" [055mm="" 39="" $¢000®a="" %="" «9="" www¢¢w=""> ” 133m [525] In 1:50 [ADO] 2.01 [0791 $®eaaeeee$ m W x W «awewwwew 1 R: RE: mu “1m NH DH ”5&4“; «weeeewewa g 7* 8 a \ \ 22g 5 5 [WW W innni man man a 2 29 [115} [12“] [07¢] 1 ms was uEsEmEE we nznamnmusu [mm mm: LAVOLH’ FDR we SPF mmszavzn 2 THE HATEHED AREAS ARE KEEPVOUT AREAS REERVED FOR Hauswa summons. ND MErAL TRAEES u: GROUND :oMNEmoN w KEEF'OUY AREA 3 20 Pm: MuuuLE 9111mm Fm NUDULE REDUIRES mm «a FEB HOLES D HOLES FOR MOUNTWE STUDS MUST BE “ED Tfl EHASSIS GROUND. D HOLES FOR Houswc LEADS MusT BE T‘ED m S‘GNAL GRouND AVQGO vzcuuoLooxss
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-3624EN
AV02-0109EN - May 13, 2015
Figure 8. Board Layout
Figure 7. Assembly Drawing
12.00
REF MA X
0.47
15.75
-
0.75
0.00
0.62
-
0.03
0.00
SECTION A-A
Top of PCB
10.16 ±0.10
0.400 ±0.004
1.00 0.00
+
0.15
0.039 0.000
+
0.006
±0.10
0.560
±0.004
14.22
15.24
MIN PITCH
0.600
A
A

Products related to this Datasheet

TXRX OPT SFF 4/2/1GBD 2X7