Properties of Solders Datasheet by Multicore

View All Related Products | Download PDF Datasheet
PROPERTIES OF SOLDERS Rumus a m: m: a: l w 5" u. ll v ‘ 54.3: ,; .»: as to E 5: w-Mma‘u 10: [HI mum» .‘1- .c 1 o: m; M}: 'uimlu
PROPERTIES OF SOLDERS
This data sheet lists the most popular solders
supplied as solid or flux-cored wire, bar, stick or
cream. We are always pleased to receive enquiries
for alternative specifications.
TIN/LEAD ALLOYS
From the following diagram, it can be seen that
most tin/lead solders have a plastic range, i.e. on
heating they are pasty between the solid and liquid
states. The solders are solid at 183°C (361°F).
According to the alloy composition they have
different plastic ranges. 60/40 tin/lead alloy for
example becomes liquid at 188°C (370°F) and
therefore has a plastic range of 5°C (9°F), 40/60
tin/lead has a plastic range of 51°C (92°F).
For applications such as wave soldering of
electronic assemblies, the requirement for a solder
with a relatively low melting point in conjunction
with a short freezing range leads to the choice of
63/37 or 60/40 Sn/Pb alloy. Although 63/37 is the
eutectic alloy, 60/40 is often used in practice as the
slightly higher 5°C freezing range of 60/40 is of no
practical significance and 60/40 is a little cheaper
than 63/37. Under conditions of slow cooling,
60/40 may give duller joints than 63/37 but this is a
purely cosmetic effect.
Lowering the tin content increases the pasty
range and raises the liquidus temperature whilst of
course reducing the cost of the alloy. Wetting
properties tend to fall off with the reduced tin
content.
As far as obtaining a low melting point is
concerned, there is no advantage in using a higher
tin content than 63/37, since the higher tin content
alloys have higher melting points and cost more.
ERSIN MULTICORE SAVBIT ALLOY
l SAVES Copper and Iron-plated Soldering
Iron Bits
l SAVES failure of soldered joints as Savbit
prevents erosion of copper wires and copper
plating
l SAVES costs and improves reliability
Ersin Multicore Savbit Solder is produced
especially to overcome the problem of ordinary
tin/lead solders dissolving copper. It is an alloy to
which a precise amount of copper has been added
so that no further copper absorption should take
place during soldering.
The breakage time of 0.067mm copper wire in
various solders as a function of temperature is
shown below.
Savbit solder has been used by leading electronics
manufacturers throughout the world for over forty
years. Savbit was originally used to increase the
life of copper soldering iron bits. Soldering speed
and efficiency are increased by keeping the iron in
good condition. Iron-plated bits having a longer life
than plain copper tips are now commonly used but
they also fail eventually (usually by cracking of the
plating) and then erode rapidly unless Savbit solder
is used.
It has also been proved that the use of Savbit
alloy can improve the strength and reliability of
soldered joints very considerably. This is because
ordinary tin/lead alloys can erode thin copper wires
(as used for leads of electronic components) and
thin copper films (as used on printed circuit
boards.) This erosion is between 50 and 100 times
slower at normal soldering temperatures when
Savbit alloy is used.
Savbit solder with Ersin 362 flux has special
M.O.D. approval DTD 900/4535. At high soldering
temperatures (above 350°C) Multicore HMP alloy
gives the best strength.
HMP SOLDER
The presence of 1.5% silver substantially improves
strength and wetting power compared to 5/95
Sn/Pb solder.
Applications
Making nearby soldered joints: A useful
application of a high melting point alloy is the
soldering of joints close to each other in such a
way that the first joint is not re-melted while the
later joint, or joints, are being made. The first joint
is made with HMP alloy (296-301°C) and the
further joints are made with successively lower
melting point alloys, for example - 60/40 tin/lead
alloy (183-188°C) and good control of soldering
temperatures.
Service at high temperatures: The maximum
safe service temperature for any solder alloy
subjected to stress is about 40°C below the solidus
melting temperature, HMP alloy can therefore be
relied upon in service up to about 255°C compared
with about 145°C for the common tin/lead alloys.
HMP alloy is consequently particularly suitable for
soldering electric motors, car radiators, high
temperature lamps and other products which are
likely to meet relatively high temperatures during
their working life.
If HMP is used to solder tin/lead coated
components, the resulting soldered joint will be a
new alloy with a lower melting point than HMP
alloy. This will depend on the thickness and
composition of the coating. The coating itself could
therefore be HMP alloy if necessary.
Service at very low temperatures: Tin/Lead
alloys containing more than 20% of tin become
brittle at temperatures below about -70°C. The
HMP alloy containing 5% of tin remains ductile
(non-brittle) down to below -200°C. Multicore HMP
alloy is also recommended therefore for service in
extremely cold conditions.
Creep strength of HMP alloy: From information
supplied, it is clear that an outstanding feature is its
very great improvement in resistance to creep by
comparison with the tin/lead solders, both at
normal and at elevated temperatures. At 150°C for
example, a 50/50 tin/lead solder will fail under a
load of 0.7 N mm-2 in approximately 10 hours. The
following results were obtained with HMP alloy at
the same temperature.
Load (N mm-2) Time to failure
3.4 150 hours
1.7 about 1 year
0.7 no creep
96S TIN/SILVER SOLDER
Multicore 96S alloy is the pure tin/silver eutectic
alloy; like pure tin, it is bright, hardly tarnishes, is
lead-free and non-toxic, but unlike pure tin it is
relatively strong.
It has higher electrical conductivity than other soft
solders and a melting point approximately 40°C
higher than either 60/40, 63/37 or LMP alloys. For
one or more of these reasons it finds uses, despite
its higher cost, in the form of ERSIN Multicore
Solder Wire usually in Electronics applications. The
alloy itself is however used more extensively for
non-electrical applications in the form of Multicore
ARAX Acid-cored Solder, particularly for soldering
stainless steel.
96S has better wetting power on stainless steel
than other solders. Note the silver in 96S does not
suppress absorption of silver from silver plated
surfaces or metallisations into the solder, so 96S is
not suitable for soldering to such surfaces.
Sn62 SOLDERS
Applications
Soldering silver-plated surfaces: The presence
of the 2% silver in Sn62 alloys suppresses
absorption of silver from silver-plated surfaces into
the solder. A good joint is thus obtained. If an
ordinary tin/lead alloy is used on silver-plated
surfaces, the silver can be lifted from the surface
and dissolved into the solder so that a good joint is
unlikely. The attachment of terminations in the
manufacture of silver ceramic capacitors is a
typical application.
95A, 97Cu AND 99C SOLDERS
Applications
Lead-free plumbing solders: 97Cu and 99C are
lead-free (non toxic) plumbing solders with superior
wetting and capillary filling characteristics.
Lead-free high temperature solder: 95A is a high
melting point solder suitable for general purpose
soldering where a lead-free alloy is require
63EN 63 ba1ance EN 29453 and J-STD-OOB ‘ 50EN 50 ba1ance EN 29453 and J-STD-OOB ‘ 40EN 40 ba1ance EN 29453 and J-STD-OOB ‘ 30EN 30 ba1ance EN 29453 and J-STD-OOB ‘ 15/85 15 ba1ance B3219 1 1 990 ba1ance EN 29453 ‘ HMP 5 ba1ance EN 29453 1 953 | 96.3 1 barance 1 - 1 - 1 EN 29453 and J-er-oos 1 20380 QOEN 40EN 45EN Memng Recommended 5mm; qumdus (:C) (”C Sn63 mark on wnrte 183 183 243 Hrgn quahty work requrnng low memng pornlade EDEN Red on WMe 183 188 248 Sav1 Green on wnne 183 215 275 50EN mark on wnrte 183 212 272 45EN mark on wnrte 183 224 284 40EN Green on wnne 183 234 294 30EN mark on wnrte 183 255 315 Fuses‘ motorsr radiators and 1amps 20/81) Purp1e on wrnte 183 275 335 Lamps 15/85 Orange on Mm 227 288 348 Lamps Sn62 Red on Me 179 179 239 Pamculany useM when so1denng ceramics or other sdver— Pure Trn Red on green 232 232 292 Used when a |ead~free so1der IS redmved HMP mue on wnrte 296 301 361 Specral Hrgn Me1ung Porn1so1der. 954 mark on wnrte 236 243 303 Hrgn memng 1ead-1ree alloy 965 mark on wnrte 221 221 281 Brrgnt s1rong, non-10m lead~free so1der
NOMINAL COMPOSITIONS AND SPECIFICATIONS
Alloy Tin Lead Antimony Copper Silver Specification
Pure Tin 100 - - - - EN 29453 and J-STD-006
63EN 63 balance - --EN 29453 and J-STD-006
60EN 60 balance - --EN 29453 and J-STD-006
50EN 50 balance - --EN 29453 and J-STD-006
45EN 45 balance - --EN 29453 and J-STD-006
40EN 40 balance - --EN 29453 and J-STD-006
35EN 35 balance - --EN 29453 and J-STD-006
30EN 30 balance - --EN 29453 and J-STD-006
20/80 20 balance - --BS219
15/85 15 balance - --BS219
Sn63 63 balance - --EN 29453 and J-STD-006
Sn60 60 balance - --EN 29453 and J-STD-006
Sn50 50 balance - --EN 29453 and J-STD-006
Sn40 40 balance - --EN 29453 and J-STD-006
95A 95 balance - --EN 29453 and J-STD-006
97Cu 97 balance - --EN 29453
99C 99.3 balance - --EN 29453
Sav1 50 balance - --EN 29453
HMP 5balance - --EN 29453
Sn62 62 balance - --EN 29453 and J-STD-006
96S 96.3 balance - --EN 29453 and J-STD-006
TENSILE STRENGTHS, DENSITY AND ELECTRICAL CONDUCTIVITY
Ultimate Tensile Strength Density
(g cc-1)
Ersin Multicore Solder
(N mm-2) (tons in-2) 11.1
Electrical conductivity
(% IACS)
HMP 36 2.3 7.2 8.0
95A 31 2.0 7.3 10.8
Pure Tin 12 0.8 10.2 13.9
15/85 49 3.2 7.5 8.5
96S 54 3.5 10.0 13.9
20/80 51 3.3 9.7 8.7
30EN 49 3.2 9.3 9.3
40EN 47 3.1 9.1 10.1
45EN 47 3.1 8.9 10.5
Sav1 55 3.5 8.9 10.9
Sn50 45 2.9 8.9 10.9
50EN 47 3.1 8.5 10.9
Sn60 48 3.1 8.5 11.5
60EN 48 3.1 8.4 11.5
Sn63 67 4.3 8.5 11.9
Sn62 90 5.9 11.5
The UTS listed above refers to the bulk solder. The values give a guide to the relative strengths at room temperature of identical
joints made with different solder alloys, but should not be used to calculate absolute joint strengths, which depend primarily on the
conditions of test; thanks are due to the International Tin Research Institute for their co-operation in arriving at values all determined
under the same conditions, viz specimens freshly cast at 50°C above liquidus, unmachined, tested at 20°C at 1/16in. per minute
strain rate. 1N mm-2 = 145 psi = 0.102 kg mm-2 = 0.065 tons in-2.
COLOUR CODES FOR WIRE, TEMPERATURES AND USES
Melting RecommendedAlloy Multicore Solidus
(°C) Liquidus (°C) Uses
Sn63 Black on white 183 183 243 High quality work requiring low melting point alloy.
60EN Red on white 183 188 248
Sav1 Green on white 183 215 275
50EN Black on white 183 212 272
45EN Black on white 183 224 284
40EN Green on white 183 234 294
Hand soldering radio, telephone and electrical equipment;
batteries.
30EN Black on white 183 255 315 Fuses, motors, radiators and lamps.
20/80 Purple on white 183 275 335 Lamps.
15/85 Orange on white 227 288 348 Lamps.
Sn62 Red on blue 179 179 239 Particularly useful when soldering ceramics or other silver-
coated surfaces.
Pure Tin Red on green 232 232 292 Used when a lead-free solder is required.
HMP Blue on white 296 301 361 Special High Melting Point solder.
95A Black on white 236 243 303 High melting lead-free alloy.
96S Black on white 221 221 281 Bright, strong, non-toxic lead-free solder
These data are based on information believed to be reliable and are offered in good faith, but MULTICORE MAKES NO WARRANTIES EITHER EXPRESS OF IMPLIED AS TO THEIR ACCURACY AND ASSUMES NO LIABILITIES ARISING OUT OF THEIR
USE BY OTHERS as conditions and methods of use of the products are beyond MULTICORE’S control. The prospective user should determine the suitability of the product before using it on a commercial scale. MULTICORE warrants only that the product
will conform to its physical descriptions. MULTICORE MAKES NO OTHER WARRANTIES EXPRESS OR IMPLIED AND EXPRESSLY DISCLAIMS ANY IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL
MULTICORE BE RESPONSIBLE FOR SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER THE CLAIM IS IN CONTRACT, NEGLIGENCE OR OTHERWISE.
MULTICORE SOLDERS
MSL Ref.: 747 08/00

Products related to this Datasheet

96S ARAX 4C 1.6MM 0.5KG AM
HMP 366 3% .022DIA. 23AWG
63/37 400 2% .015DIA 27AWG
63/37 CRYSL 502 2% .032DIA 20AWG
97SC 400 2% .032DIA 20AWG
60/40 370 3% .024DIA 22AWG
HMP 366 3% .028DIA 21AWG
63/37 HYDRO-X 2% .022DIA 23AWG
97SC 400 2% .048DIA 16AWG
97SC 400 2% .022DIA 23AWG
97SC C511 2% .032DIA 20AWG
60/40 370 3% .015DIA 27AWG
HMP 366 3% .050DIA 16AWG
60/40 370 3% .032DIA 20AWG
97SC C511 2% .022DIA 22AWG 24SWG
60/40 370 3% .064DIA. 14AWG
63/37 400 2% .022DIA 23AWG
97SC C511 2% .015DIA 27AWG
63/37 CRYSL 502 3% .032DIA 20AWG
97SC HYDRO-X 2% .064DIA 14AWG
97SC C511 2% .064DIA 14AWG
97SC 400 2% .064DIA 14AWG
63/37 HYDRO-X 2% .032DIA 20AWG
63/37 CRYSL 502 3% .064DIA 14AWG
63/37 400 2% .064DIA 14AWG
97SC 400 2% 0.38 DIA
63/37 400 2% .048DIA 16AWG
63/37 CRYSL 502 2% .022DIA 23AWG
63/37 WS200 SOLDER PASTE 75GM
63/37 370 3% .032DIA 20AWG