CX2520DB32000D0WZRC1 Specification Datasheet by Kyocera International Inc. Electronic Components

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Sgecifications Deswgn Depanmem
KYOCERA Crystal Device Corporation
KBS-5079G
Specifications
Drawing No. UKY1C-H1-15838-00[31] 1/11
Issued Date. Jul,15,2015
TO: Digi-Key
NoteIn case of specification change, KYOCERA Part Number also will be changed.
Product Name Quartz Crystal
Product Model CX2520DB
Frequency 32000kHz
Customer Part Number -
Customer Specification Number -
KYOCERA Part Number CX2520DB32000D0WZRC1
Remarks Pb-FreeRoHS CompliantMSL 1
Customer Acceptance
Accept Signature Approved Date
Department
Person in charge
Seller Manufacturer
KYOCERA Crystal Device Corporation
(Sales Division) Crystal Units Division
6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 5850, Higashine-Koh, Higashine-Shi, Yamagata
612-8501 Japan 999-3701 Japan
TEL. No. 075-604-3500 TEL. No. 0237-43-5611
FAX. No. 075-604-3501 FAX. No. 0237-43-5615
Design Department Quality Assurance Approved by Checked by Issued by
KYOCERA Crystal Device Corporation
Field Application Engineering Section
Crystal Units Division
T. Noritake
K. Yamazaki
T. Nitoube
Y. K i k u c h i
Drawing No. UKY1C-H1-15838-00[31] 2/11
KYOCERA Crystal Device Corporation
KBS-5079G
Revision History
Rev.No. Description of revise Date Approved by Checked by Issued by
1 First Edition Jul,15,2015 K. Yamazaki T. Nitoube Y. Kikuchi
CX2520DB32000DOWZRC1
Drawing No. UKY1C-H1-15838-00[31] 3/11
KYOCERA Crystal Device Corporation
KBS-5079G
1. APPLICATION
This specification sheet is applied to quartz crystal “CX2520DB32000D0WZRC1”
2. KYOCERA PART NUMBER
CX2520DB32000D0WZRC1
3. RATINGS
Items SYMB. Rating Unit Remarks
Operating Temperature Topr -25 to +75 °C
Storage Temperature range Tstg -40 to +85 °C
4. CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Items Electrical Specification Test Condition Remarks
SYMB. Min Typ. Max Unit
Mode of Vibration Fundamental
Nominal Frequency F0 32 MHz
Nominal
Temperature
TNOM +25 °C
Load Capacitance CL 8.0 pF
Frequency
Tolerance
df/F
-40.0 +40.0 PPM
+25±3°C
Frequency
Temperature
characteristics
df/F -25 to +75°C
Frequency Aging
Rate
1
s
t
year +25±3°C
Equivalent Series
Resistance
ESR 50
Shunt
Capacitance
C0 3.0 pF
Drive Level Pd 0.01 100 μW
Insulation
Resistance
IR 500 M 100V(DC)
Drawing No. UKY1C-H1-15838-00[31] 4/11
KYOCERA Crystal Device Corporation
KBS-5079G
5. Measurement Condition
5.1 Frequency measurement
Measuring instrument : IEC PI-Network Test Fixture
Load Capacitance : 8.0pF
Drive Level : 10μW
5.2 Equivalent series resistance (ESR) measurement
Measuring instrument : IEC PI-Network Test Fixture
Load Capacitance : Series
Drive Level : 10μW
2 4 0.501005 2002010 { i MARKING {4*056101 440561010 UNIT : mrn Nominal Frequency Move the number of maximum indication beams of the frequency to five digits, and omit less than kHz. Identification [K] mark is surely 1Pin direction. Date Code Year‘ - 'LAST 1 DIGIT of YEAR AND WEEK (Ex)Jan,01, 2015 a 501 Manufacturing Location Y ~Japan(Yamagara) Z Japan(ShigaYohkaichi) T~~Ti1ai|and >Z
Drawing No. UKY1C-H1-15838-00[31] 5/11
KYOCERA Crystal Device Corporation
KBS-5079G
6. APPEARANCES, PHYSICAL DIMENSION
OUTLINE DIMENSION (not to scale)
MARKING
1 Nominal Frequency Move the number of maximum indication beams of the
frequency to five digitsand omit less than kHz
2 Identification [K] mark is surely 1Pin direction.
3 Date Code YearLAST 1 DIGIT of YEAR AND WEEK
(Ex)Jan,01, 2015 501
4 Manufacturing Location
YJapan(Yamagata)
ZJapan(Shiga Yohkaichi)
TThailand
The font of marking is reference.
PIN
NO.
PIN Layout
#1 HOT
#2 GND
#3 HOT
#4 GND
UNIT mm
0.50±0.05
3
2.00±0.10
2.50±0.10
4R0.1
5
40.66±0.1
40.5
6
±0.10
C 0.20
4-0.20
2
32000
K501 Y
4
#1
#3
#4
#2
#3 HOT
#1
1
80.115
#2 GND #1 HOT
#4 GND
#4 #3
#2
GND
(NC)
GND
(Top View)
(Side View)
(Bottom View)
TOP VIEW
(Connection)
1.0 0.3 >< 1.0="" x’ew="" unit="" :="" mm="" kyocera="" crystal="" device="" corporation="" kbs-5079g="">
Drawing No. UKY1C-H1-15838-00[31] 6/11
KYOCERA Crystal Device Corporation
KBS-5079G
7. RECOMMENDED LAND PATTERN (not to scale)
UNIT mm
1.0 1.0
0.3
1.2 1.20.5
1.7
1.3
8,0102 ”9odoeooofi VOO OOOOJ ’O O H 0 VO" '0 OV ‘ VD DI? ID ----- DD 5 B-aDireclion (The direcfion shall be seen lrom the map cover lape side) D ..... D 160mm or more O 1uu~200mm 400~5mmm “Specification 1 Malenal of me mmer nape l5 emer polystyrene mAiPEF (ESD). 2 Malenal oflhe malapels Weslqusm, a The seal lape shall ml ooverlhe Wet males and hm pmudelmm me mmer tape, 4 Tensile snengmatmlape lONormore 5 The Rofmemmaraleam mvllyls UZRMAX a The allgnmenl between mmasallhe may and spmel hole shall be 0.05mm orlees, 7 Thememamnshalbemecxedmmempmerlapeedeassmmmas a Peellnglomeofmverlape 0.1 on 1.0M. 9. The manner“ wll fall out naturally when saver tape Is rammed and sel upsne down, $ng ; : KYOCERA Crystal Device Corporation
Drawing No. UKY1C-H1-15838-00[31] 7/11
KYOCERA Crystal Device Corporation
KBS-5079G
8. TAPING&REEL
8-1.Dimensions
8-2.Leader and trailer tape
8-3.DirectionThe direction shall be seen from the top cover tape side
8-4.Specification
1. Material of the carrier tape is either polystyrene or APET (ESD).
2. Material of the cover tape is polyester (ESD).
3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape.
4. Tensile strength of carrier tape: 10N or more.
5. The R of the corner of each cavity is 0.2RMAX.
6. The alignment between centers of the cavity and sprocket hole shall be 0.05mm or less.
7. The orientation shall be checked from the top cover tape side as shown in 8-3.
8. Peeling force of cover tape: 0.1 to 1.0N.
9. The component will fall out naturally when cover tape is removed and set upside down.
0.1
0
4.0±0.1 φ1.5±
φ1.05±0.05 2.0±0.05 Unreeling direction
8.0±0.
2
1.75±0.1
3.5±0.05
2.85±0.10
2.7±0.05
2.35±0.1
4.0±0.1
2.2±0.05
0.2±0.0
5
0.6±0.0
5
Leader
Empty compartment
Empty compartment Component
END START
160mm or more 100200mm
400560mm
Unreeling direction
12345
K123 Y
12345
K123 Y
12345
K123 Y
12345
K123 Y
165°180° Cover tape
Career tape
0180 Reel (3,000 pcs Max.) Symbol A B Dimension (0180 10/73 «>60 +1/0 (913 Symbol E w Dimension 2.010 5 911 2.0 0330 Reel (12,000 pm Max.) Symbol A B Dimension (033012 0 (010011 0 (913 Symbol E w Dimension 2.010 5 9.510 5 2.2 KYOCERA Cwsial Device Cor
Drawing No. UKY1C-H1-15838-00[31] 8/11
KYOCERA Crystal Device Corporation
KBS-5079G
8-5.Reel Specification
φ180 Reel (3,000 pcs Max.)
Symbol A B C D
Dimension φ180 +0/-3 φ60 +1/-0 φ13±0.2 φ21±0.8
Symbol E W t
Dimension 2.0±0.5 9±1 2.0±0.5
(Unit : mm)
φ330 Reel (12,000 pcs Max.)
Symbol A B C D
Dimension φ330±2.0 φ100±1.0 φ13±0.2 φ21±0.8
Symbol E W t
Dimension 2.0±0.5 9.5±0.5 2.2±0.1
(Unit : mm)
A
C
D
E
B
Wt
Drawing No. UKY1C-H1-15838-00[31] 9/11
KYOCERA Crystal Device Corporation
KBS-5079G
9.Enviromental requirements
After conducting the following tests, component needs to meet below conditions.
Frequency: Fluctuation within +/-10 x 10-6
CI: Fluctuation within +/-20% or 5 whichever is larger
9.1 Resistance to Shock Test condition
3 times natural drop from 100cm onto hard wooden board.
9.2 Resistance to Vibration Test condition
frequency 10 - 55 - 10 Hz
Amplitude 1.5mm
Cycle time 15 minutes
Direction X,Y,Z (3direction),2h each.
9.3 Resistance to Heat Test condition
The quartz crystal unit shall be stored at a
temperature of +85±2°C for 500h and subjected to
room temperature for 1h before measurement.
9.4 Resistance to Cold Test condition
The quartz crystal unit shall be stored at a
temperature of -40±2°C for 500h and subjected to
room temperature for 1h before measurement.
9.5 Thermal Shock Test condition
The quartz crystal unit shall be subjected to 500 temperature
cycles shown in table belowThen it shall be subjected
to room temperature for 1h before mesurement.
Cycle -40±C30min.)→ +25±2°C5min.
+85±2°C30min.)→ +25±2°C5min.
309 25m -200 9 5.150 5 F100 so u 4%— u an mu ‘50 m: 250 300 35a nmelseeJ Va? Ta Drama KYOCERA Crystal Device Corporation
Drawing No. UKY1C-H1-15838-00[31] 10/11
KYOCERA Crystal Device Corporation
KBS-5079G
9.6 Resistance to Moisture Test condition
The quartz crystal unit shall be stored at a
temperature of +60±2°C with relative humidity of
90% to 95% for 240 h. Then it shall be subjected
to room temperature for 1h before measurement.
9.7 Soldering condition 1. Type of solder
Material lead free solder paste
Melting point +220±5°C
2. Reflow temp.profile
Frequency shift : ±2ppm
3. Hand Soldering +350°C 3 sec max
4. Reflow Times 2 times in below Reflow temp. profile
Reflow temp.profile
9.8 Bending Strength
Solder this product in center of the circuit board (40
mm
×100
mm),
and add deflection of 3mm.
Test board : t1.6mm
Temp [°C] Time[sec]
Preheating +150 to +180 150 (typ.)
Peak +260±5 10 (max.)
To t al 300 (max.)
20
PUSH
board 10
1.6
R5
R230
Product
press jig
UNIT : mm
45
45
Drawing No. UKY1C-H1-15838-00[31] 11/11
KYOCERA Crystal Device Corporation
KBS-5079G
10. Cautions for use
1Soldering upon mounting
There is a possibility to influence product characteristics when Solder paste or conductive glue comes in
contact with product lid or surface.
2When using mounting machine
Please minimize the shock when using mounting machine to avoid any excess stress to the product.
3Conformity of a circuit
We strongly recommend to make sure that Negative resistance (Gain) of IC is designed to be 5 times the
ESR (Equivalent Series Resistance) of crystal unit.
11. Storage conditions
Please store product in below conditions, and use within 6 months.
Temperature +18 to +30°C, and Humidity of 20 to 70 % in the packaging condition.
12. Manufacturing location
Kyocera Crystal Device Corporation / Japan(Yamagata)
Kyocera Crystal Device Corporation Shiga Yohkaichi Plant / Japan(Shiga)
Kyocera Crystal Device (Thailand) Co., Ltd / Thailand(Lamphun)
13. Quality Assurance
To be guaranteed by Kyocera Crystal Device Quality Assurance Division
14. Quality guarantee
In case when Kyocera Crystal Device Corporation rooted failure occurred within 1year after its delivery,
substitute product will be arranged based on discussion. Quality guarantee of product after 1year of its delivery is
waivered.
15. Others
In case of any questions or opinions regarding the Specification, please have it in written manner
within 45 days after issued date.

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