MCx0402,0603,0805,1206 AT-Precision Datasheet by Vishay Beyschlag/Draloric/BC Components

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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com Vishay Beyschlag
Revision: 21-Feb-17 1Document Number: 28785
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Precision Thin Film Chip Resistors
Automotive-grade MC AT precision thin film chip resistors
are the perfect choice for most fields of modern
precision electronics where reliability and stability is of major
concern. Typical applications include automotive,
telecommunication, industrial, medical equipment,
precision test, and measuring equipment.
FEATURES
Rated dissipation P70 up to 0.4 W for size 1206
AEC-Q200 qualified
Approved to EN 140401-801
Superior temperature cycling robustness
Advanced sulfur resistance verified according
to ASTM B 809
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Telecommunication
Industrial equipment
Medical equipment
Note
(1) Please refer to APPLICATION INFORMATION below.
TECHNICAL SPECIFICATIONS
DESCRIPTION MCS 0402 AT MCT 0603 AT MCU 0805 AT MCA 1206 AT
Imperial size 0402 0603 0805 1206
Metric size code RR1005M RR1608M RR2012M RR3216M
Resistance range 47 to 221 k47 to 511 k47 to 1 M47 to 1 M
Resistance tolerance ± 0.1 %
Temperature coefficient ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Rated dissipation P70 (1) 0.100 W 0.125 W 0.200 W 0.400 W
Operating voltage, Umax. ACRMS/DC 50 V 75 V 150 V 200 V
Permissible film temperature,
F max. (1) 155 °C
Operating temperature range -55 °C to 155 °C
Permissible voltage against ambient
(insulation):
1 min; Uins 75 V 100 V 200 V 300 V
Failure rate: FITobserved 0.1 x 10-9/h
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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
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Revision: 21-Feb-17 2Document Number: 28785
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APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
Note
The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to
different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the
circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please
consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for
information on the general nature of thermal resistance.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE STANDARD POWER
Rated dissipation, P70
MCS 0402 AT 0.063 W 0.100 W
MCT 0603 AT 0.100 W 0.125 W
MCU 0805 AT 0.125 W 0.200 W
MCA 1206 AT 0.250 W 0.400 W
Operating temperature range -55 °C to 125 °C -55 °C to 155 °C
Permissible film temperature,
F max. 125 °C 155 °C
Max. resistance change at P70
for resistance range, |R/R| after:
MCS 0402 AT 47 to 221 k47 to 221 k
MCT 0603 AT 47 to 511 k47 to 511 k
MCU 0805 AT 47 to 1 M47 to 1 M
MCA 1206 AT 47 to 1 M47 to 1 M
1000 h 0.1 % 0.2 %
8000 h 0.2 % 0.4 %
225 000 h 0.6 % -
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
MCS 0402 AT
± 25 ppm/K
± 0.1 %
47 to 221 k
E24; E192± 15 ppm/K 47 to 100 k
± 10 ppm/K 47 to 10 k
MCT 0603 AT
± 25 ppm/K
± 0.1 %
47 to 511 k
E24; E192± 15 ppm/K 47 to 221 k
± 10 ppm/K 47 to 22.1 k
MCU 0805 AT
± 25 ppm/K
± 0.1 %
47 to 1 M
E24; E192± 15 ppm/K 47 to 332 k
± 10 ppm/K 47 to 33.2 k
MCA 1206 AT
± 25 ppm/K
± 0.1 %
47 to 1 M
E24; E192± 15 ppm/K 47 to 511 k
± 10 ppm/K 47 to 43.2 k
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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com Vishay Beyschlag
Revision: 21-Feb-17 3Document Number: 28785
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Note
Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION.
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING
STYLE WIDTH PITCH PACKAGING
DIMENSIONS
MCS 0402 AT
E1 1000
Paper tape acc.
IEC 60286-3,
Type 1a
8 mm
2 mm Ø 180 mm/7"E5 5000
E0 10 000
MCT 0603 AT
P1 1000
4 mm
Ø 180 mm/7"
P5 5000
PW 20 000 Ø 330 mm/13"
MCU 0805 AT
P1 1000
Ø 180 mm/7"
P5 5000
PW 20 000 Ø 330 mm/13"
MCA 1206 AT
P1 1000
Ø 180 mm/7"
P5 5000
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MCT0603MD4641BPW00
TYPE/SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING
MCS0402
MCT0603
MCU0805
MCA1206
M = AT
(Automotive)
F = ± 10 ppm/K
E = ± 15 ppm/K
D = ± 25 ppm/K
3 digit value
1 digit multiplier
Multiplier
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
B = ± 0.1 % E1
E5
E0
P1
P5
PW
Product Description: MCT 0603-25 0.1 % AT PW 4K64
MCT 0603 -25 0.1 % AT PW 4K64
TYPE SIZE TCR TOLERANCE VERSION PACKAGING RESISTANCE
MCS
MCT
MCU
MCA
0402
0603
0805
1206
± 10 ppm/K
± 15 ppm/K
± 25 ppm/K
± 0.1 % AT =
Automotive
E1
E5
E0
P1
P5
PW
4K64 = 4.64 k
CT0603MD4M41BPW006
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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com Vishay Beyschlag
Revision: 21-Feb-17 4Document Number: 28785
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (Al2O3) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure matte tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with
potential risk of early field failures (feasible for R 10 ).
Only accepted products are laid directly into the paper tape
in accordance with IEC 60286-3 Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant; the pure matte tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
The Global Automotive Declarable Substance List
(GADSL) (3)
The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series. The detail
specification refers to the climatic categories 55/125/56,
which relates to the “standard operation mode” of this
datasheet.
Conformity is attested by the use of the CECC logo ( )
as the mark of conformity on the package label.
Vishay Beyschlag has achieved Approval of
Manufacturer” in accordance with IECQ 03-1. The release
certificate for “Technology Approval Schedule” in
accordance with CECC 240001 based on IECQ 03-3-1 is
granted for the Vishay Beyschlag manufacturing process.
The resistors are qualified according to AEC-Q200.
RELATED PRODUCTS
For more information about products with higher operation
temperature please refer to the professional datasheet
(www.vishay.com/doc?28760).
Chip resistor arrays may be used in sensing applications
or precision amplifiers where close matching
between multiple resistors is necessary. Please refer to the
ACAS AT - Precision datasheet (www.vishay.com/doc?28770).
MC AT Precision is also available with gold termination for
conductive gluing. Please refer to the datasheet
(www.vishay.com/doc?28877).
For high power and high temperature applications
MCW 0406 AT wide terminal thin film chip resistors offer
extremely high power ratings in compact 0406 case size and
extraordinary temperature cycling robustness.
Please refer to the datasheets for
precision (www.vishay.com/doc?28847) and
professional (www.vishay.com/doc?28796) specification.
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
VISHAY. — MCT 0503 AT _ MCU cans AI _ MCA Qua AT mmfilmcmg®wshay£om www \shay com/do 91000
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com Vishay Beyschlag
Revision: 21-Feb-17 5Document Number: 28785
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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FUNCTIONAL PERFORMANCE
Derating - Standard Operation
Derating - Power Operation
Current noise A1 in accordance with IEC 60195
Current Noise
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
0.1
0.2
W
Power Dissipation
°C
100 150-50 50 70
ϑ
Ambient Temperature
amb
0
P
0.3
0
0.1
0.2
0.3
0.4
0.5
W
Power Dissipation
P
°C
100 150-50 50 70
ϑ
Ambient Temperature
amb
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
0
Resistance Value
Current Noise
A
1
0.01
1 M
Ω
0.1
1
µV/V
R
10
100 k
Ω
10 k
Ω
1 k
Ω
10
Ω
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
100
Ω
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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
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Revision: 21-Feb-17 6Document Number: 28785
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The components are approved under the IECQ-CECC
quality assessment system for electronic components.
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER (2)
Stability for product types:
MCS 0402 AT 47 to 221 k
MCT 0603 AT 47 to 511 k
MCU 0805 AT 47 to 1 M
MCA 1206 AT 47 to 1 M
4.5 - Resistance ± 0.1 % R
4.8 - Temperature
coefficient
At (20 / -55 / 20) °C and
(20 / 155 / 20) °C ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
4.25.1 -
Endurance at 70 °C:
Standard operation mode
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.1 % R + 0.02 )
± (0.2 % R + 0.02 )
Endurance at 70 °C:
Power operation mode
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.2 % R + 0.02 )
± (0.4 % R + 0.05 )
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
± (0.15 % R + 0.02 )
± (0.3 % R + 0.02 )
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R + 0.02 )
4.37 67 (Cy)
Damp heat,
steady state,
accelerated
Standard operation mode
(85 ± 2) °C
(85 ± 5) % RH
U = ;
U 0.3 x Umax.; 1000 h
± (0.5 % R + 0.05 )
P70 x R
P70 x R
0.1 x P70 x R
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4.23 Climatic sequence:
Standard operation mode
± (0.25 % R + 0.02 )
4.23.2 2 (Bb) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; 90 % RH;
1 cycle
4.23.4 1 (Ab) Cold -55 °C; 2 h
4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 24 h; 90 % RH;
5 cycles
4.23.7 - DC load U = Umax.; 1 min
-1 (Aa)
Storage at low
temperature -55 °C; 2 h ± (0.05 % R + 0.01 )
4.19 14 (Na)
Rapid change of
temperature
30 min at -55 °C and
30 min at 155 °C;
1000 cycles
± (0.25 % R + 0.02 )
Extended rapid change
of temperature
30 min at -40 °C;
30 min at 125 °C (3);
MCS 0402 AT: 3000 cycles
MCT 0603 AT: 2000 cycles
MCU 0805 AT: 1500 cycles
MCA 1206 AT: 1000 cycles
± (0.25 % R + 0.05 );
( 50 % of initial shear force)
4.13 - Short time overload:
Standard operation mode
U = 2.5 x or
U = 2 × Umax.;
whichever is the less severe;
5 s
± (0.05 % R + 0.01 )
4.27 -
Single pulse high
voltage overload:
Standard operation mode
Severity no. 4:
U = 10 x or
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (0.25 % R + 0.05)
4.39 -
Periodic electric
overload:
Standard operation mode
U = or
U = 2 x Umax.
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 0.05)
4.38 - Electro static discharge
(human body model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402 AT: 500 V
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
± (0.5 % R + 0.05)
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER (2)
Stability for product types:
MCS 0402 AT 47 to 221 k
MCT 0603 AT 47 to 511 k
MCU 0805 AT 47 to 1 M
MCA 1206 AT 47 to 1 M
P70 x R
P70 x R
P70 x R
15 x P70 x R
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Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their
respective test conditions.
(3) Tested on a 4-layer printed circuit board with SAC micro alloy.
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 7.5 h
± (0.05 % R + 0.01)
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (95 % covered);
no visible damage
4.18 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.05 % R + 0.01)
4.29 45 (XA) Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2 No visible damage
4.32 21 (Ue3) Shear (adhesion)
MCS 0402 AT and
MCT 0603 AT; 9 N No visible damage
MCU 0805 AT and
MCA 1206 AT; 45 N
4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times
± (0.05 % R + 0.01)
no visible damage;
no open circuit in bent position
4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5 (1),
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER (2)
Stability for product types:
MCS 0402 AT 47 to 221 k
MCT 0603 AT 47 to 511 k
MCU 0805 AT 47 to 1 M
MCA 1206 AT 47 to 1 M
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DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351.
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE H
(mm)
L
(mm)
W
(mm)
WT
(mm)
Tt
(mm)
Tb
(mm)
MASS
(mg)
MCS 0402 AT 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6
MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9
MCU 0805 AT 0.52 ± 0.1 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6
MCA 1206 AT 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 AT - - - - 0.35 0.55 0.55 1.45
MCT 0603 AT 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 AT 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MCA 1206 AT 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
Tb
Tt
L
H
W WT
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Revision: 01-Jan-2019 1Document Number: 91000
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