SRDA3.3 Series Datasheet by Littelfuse Inc.

View All Related Products | Download PDF Datasheet
% Littelfuse’ ExpimscApnlmd \ Answusmllumd CI®CI
1
©2013 Littelfuse, Inc.
Specifi cations are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Diodes)
Revision: June 14, 2013
Lightning Surge Protection- SRDA3.3 Series
SRDA3.3
SRDA3.3 Series
Description
Applications
The SRDA3.3 integrates low capacitance rail-to-rail diodes
with an additional zener diode to protect I/O pins against
ESD and lightning induced surge events. This device can
safely absorb up to 35A per IEC61000-4-5 (tp=8/20s)
without performance degradation and a minimum
±30kV ESD per IEC61000-4-2 international standard. Its
low loading capacitance makes it ideal for high-speed
interfaceprotection.
Features
• Lightning protection,
IEC61000-4-5, 35A
(8/20µs)
• EFT, IEC61000-4-4, 50A
(5/50ns)
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
Low clamping voltage
• Low leakage current
• SOIC-8 surface mount
package (JEDEC MS-012)
Functional Block Diagram
Pinout
Note: Pinout diagrams above shown as device footprint on circuit board.
SOIC-8 (Top View)
1
2
3
54
6
7
8
I/O 1
I/O 2
I/O 3
I/O 4
Ref 1
Ref 1
Ref 2
Ref 2
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
14
58
SRDA3.3-4
T1/E1/T3/E3 Interface Protection
T1/E1/T3/E3
Transceiver
R Tip
R Ring
T Tip
T Ring
SRDA3.3 Series 8pF 35A Diode Array
Tertiary (IC Side)
Protection:
- T1/E1/T3/E3
- HDSL/SDSL
- Ethernet
• RS232, RS485
Video Line Protection
• Security Cameras
• Storage DVRs
• Network Equipment
• Instrumentation, Medical
Equipment
I/O 1
I/O 3
I/O 2
I/O 4 Ref 2
Ref 1
% Litleltuse“ ExpemxaADnllzd \ Anxwux Damn
©2013 Littelfuse, Inc.
Specifi cations are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
2
TVS Diode Arrays (SPA® Diodes)
Revision: June 14, 2013
Lightning Surge Protection- SRDA3.3 Series
SRDA3.3 Series
SP4040
Absolute Maximum Ratings
Electrical Characteristics (TOP = 25°C)
Thermal Information
Parameter Rating Units
SOIC Package 170 °C/W
Operating Temperature Range -40 to 125 °C
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)
260 °C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specifi cation is not implied.
1 Parameter is guaranteed by design and/or device characterization.
Normalized Capacitance vs. Bias Voltage
Symbol Parameter Value Units
Ppk Peak Pulse Power (8/20µs) 600 W
Ipp Peak Pulse Current (8/20µs) 35 A
Top Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Stand-Off Voltage V
RWM I
T ≤1µA - - 3.3 V
Reverse Breakdown Voltage V
BR I
T =2uA 3.5 - - V
Snap Back Voltage V
SB I
T=50mA 2.9 - - V
Reverse Leakage Current I
R V
R = 3.3V - - 1 µA
Clamping Voltage, Line-Ground1 V
C I
PP = 1A, t
p =8/20 µs - 5.7 - V
Clamping Voltage, Line-Ground1 V
C I
PP = 10A, t
p =8/20 µs - 10.1 - V
Clamping Voltage, Line-Ground1 V
C I
PP = 30A, t
p =8/20 µs - 17.7 - V
Dynamic Resistance, Line-Ground1 R
DYN ( VC2-VC1)/(IPP2-IPP1) - 0.5 - Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact Discharge) ±30 - - kV
IEC61000-4-2 (Air Discharge) ±30 - - kV
Diode Capacitance1
C
I/O-I/O Reverse Bias=0V - 4.0 - pF
C
I/O-GND Reverse Bias=0V - 8.0 - pF
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration-tp(µS)
Peak Pulse Power-Ppk (kW)
Non-Repetitive Peak Pulse Power vs. Pulse Time
Bias Voltage (V)
Normalized Capacitance (pF)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
3.3
% Littelfuse’ Wampum \ Answusmllumd
3
©2013 Littelfuse, Inc.
Specifi cations are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Diodes)
Revision: June 14, 2013
Lightning Surge Protection- SRDA3.3 Series
SRDA3.3
SRDA3.3 Series
Clamp Voltage V
C
(V)
20
1
0
2
4
6
8
10
12
14
16
18
10 20 30 35
I
PP
Peak Pulse Current- (A)
5
15 25
Clamping Voltage vs. IPP
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (s)
Percent of I
PP
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zone
L
to
T
P
Refl ow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Refl ow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold fl ash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte fi nish VDI 11-13.
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature-TA (oC)
% of Rated Power or IPP
—> 000000 333E
©2013 Littelfuse, Inc.
Specifi cations are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
4
TVS Diode Arrays (SPA® Diodes)
Revision: June 14, 2013
Lightning Surge Protection- SRDA3.3 Series
SRDA3.3 Series
Package Dimensions Mechanical Drawings and Recommended Solder Pad Outline
Package SOIC
Pins 8
JEDEC MS-012
Millimetres Inches
Min Max Min Max
A1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 1.65 0.050 0.065
B0.31 0.51 0.012 0.020
c0.17 0.25 0.007 0.010
D4.80 5.00 0.189 0.197
E5.80 6.20 0.228 0.244
E1 3.80 4.00 0.150 0.157
e1.27 BSC 0.050 BSC
L0.40 1.27 0.016 0.050
o
Recommended
Soldering Pad Outline
(Reference Only)
F
L
Embossed Carrier Tape & Reel Specifi cation — SOIC Package
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F5.4 5.6 0.213 0.22
P2 1.95 2.05 0.077 0.081
D1.5 1.6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161
10P0 40.0 +/- 0.20 1.574 +/- 0.008
W11.9 12.1 0.468 0.476
P7.9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t0.30 +/- 0.05 0.012 +/- 0.002
User Feeding Direction
Pin 1 Location
Ordering Information
Part Number Package Marking Min. Order Qty.
SRDA3.3-4BTG SOIC-8 SRDA3.3 2500
Part Numbering System
SRDA 3.3 B TG
TVS Diode Arrays
(SPA Diodes)
Voltage
Package
B = SOIC-8
T= Tape & Reel
G= Green
4
Channel
4= 4 Channels
®
Part Marking System
Marking
F
L
SRDA-3.3
CYYWW
Date code
Pin1

Products related to this Datasheet

TVS DIODE 3.3V 17.7V 8SOIC
TVS DIODE 3.3V 17.7V 8SOIC
TVS DIODE 3.3V 17.7V 8SOIC