SP0504S Series Datasheet by Littelfuse Inc.

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944 Litteltuse” —CI®:I
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/04/19
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Description
Applications
The SP0504S integrates low capacitance rail-to-rail diodes
with an integrated proprietary avalanche breakdown diode
that protects applications against ESD, EFT and low surge
events. This component is rated for the maximum IEC
61000-4-2 ESD (level 4) contact and air discharge events.
Their very low off-state capacitance also makes them ideal
for protecting high speed signal pins such as HDMI, DVI,
USB2.0, and IEEE 1394.
Features
RoHS compliant and
lead-free
• Low off-state capacitance
of 0.85 pF (TYP) per I/O
ESD rating of ±12kV
contact discharge,
±15kV air discharge,
(IEC 61000-4-2)
EFT protection, IEC
61000-4-4, 40A
(5/50ns)
Low leakage current of
0.5μA (MAX) at 5V
• Small packaging options
saves board space
Lightning, 4.5A (8/20μs
as defined in IEC 61000-
4-5 2nd edition)
• AEC-Q101 qualified
• Computer Peripherals
• Mobile Phones
• PDAs
• Digital Cameras
• Network Hardware/Ports
Test Equipment
• Medical Equipment
• Automotive Network
Functional Block Diagram
I/O2
I/O1 GND I/O3
VCC I/O4
Pinout
I/O 1
I/O 2
SOT23-6
V
CC
I/O 3
I/O 4
GND
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
RJ-45
Connector
Ethernet PHY
J1
J8
GND
NC
Tx-
Rx+
Rx-
Tx+
SP0504S
A single 4 channel SP0504S component can be used to
protect four of the data lines in a HDMI/DVI interface. Two
(2) SP0504S components provide protection for the main
data lines. Low voltage ASIC HDMI/DVI drivers can also be
protected with the SP0504S, the +VCC pins on the SP0504S
can be substituted with a suitable bypass capacitor or in
some backdrive applications the +VCC of the SP0504S can be
floated or NC.
SP0504S Series 0.85pF Diode Array
Additional Information
Datasheet Samples
Resources
% Litteltuse” ExnevhxeADnlled \ Anxwuxflehvevrd
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/04/19
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Parameter Symbol Test Conditions Min Ty p Max Units
Reverse Standoff Voltage VRWM IR = 1µA - - 6.0 V
Reverse Leakage Current ILEAK VR=5V - - 0.5 µA
Breakdown Voltage VBR IR=1mA 6.3 8 8.8 V
Clamp Voltage1VC
IPP=1A, tp=8/20µs, I/O to
GND - 9.5 11. 0 V
IPP=2A, tp=8/20µs, I/O to
GND - 10.6 13.0 V
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact) ±12 - - kV
IEC 61000-4-2 (Air) ±15 - - kV
Diode Capacitance1CI/O-GND
Reverse Bias=0V, f=1MHz 0.95 1.1 1.25 pF
Reverse Bias=1.65V,
f=1MHz 0.7 0.85 1.0 pF
Diode Capacitance1CI/O-I/O Reverse Bias=0V, f=1MHz - 0.5 - pF
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at
these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 4.5 A
TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Note: 1. Parameter is guaranteed by design and/or component characterization.
2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
% Litteltuse” ExpemxeADnllld \ Anxwusbelwend
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/04/19
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Capacitance vs. Bias VoltageInsertion Loss (S21) I/O to GND
-20
-15
-10
-5
0
1.E+06 1.E+07 1.E+08 1.E+09 1.E+10
Fr
equency [Hz]
Insertion Loss [dB]
0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1.50
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
0.50
I/O Capacitance (pF)
I/O DC Bias (V)
V
CC
= 5V
VCC = 3.3V
VCC = Float
Capacitance vs. Frequency
0
2E-13
4E-13
6E-13
8E-13
1E-12
1.2E-12
1.4E-12
1.6E-12
1.8E-12
2E-12
1.E+06 1.E+07 1.E+08 1.E+09
Fr
equency [Hz]
Capacitance [F]
IEC 61000 -4-2 -8 kV Contact ESD Clamping VoltageIEC 61000 -4-2 +8 kV Contact ESD Clamping Voltage
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© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/04/19
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
rehea
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Compund
Flammability UL Recognized compund meeting
flammability rating V-0
Ordering Information
Part Number Package Min. Order Qty.
SP0504SHTG SOT23-6 3000
Part Numbering System
Part Marking System
SP0504S TG
Series Package
H = SOT23-6
T= Tape & Reel
G= Green
H
TVS Diode Arrays
(SPA® Diodes)
E*4
E*4
Product Series
E = SP0504S series
Assembly Site
(varies)
Number of Channels
% Litteltuse” ExpemxeADnllld \ Anxwusbelwend iHiJ ‘ :mj LYRHM
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/04/19
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP0504S Series
Package Dimensions — SOT23-6
O
P
R
M
Recommended Solder Pad Layout
Package SOT23
Pins 6
JEDEC MO-178AB
Millimeters Inches Notes
Min Max Min Max
A0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b0.350 0.500 0.0138 0.0196 -
C0.080 0.220 0.0031 0.009 -
D2.800 3.000 0.11 0.118 3
E2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e0.95 Ref 0.0374 ref -
e1 1.9 Ref 0.0748 Ref -
L0.30 0.600 0.012 0.023 4,5
N6 6 6
a0º 8º 0º 8º -
M2.590 0.102 -
O0.690 .027 TYP -
P0.990 .039 TYP -
R0.950 0.038 -
Notes:
1. Dimensioning and tolerancing Per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Foot length L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICA
TIONS.
2.0mm
4.0mm
C
L
1.75mm
1.5mm
DIA. HOLE
8mm
4.0mm
8.4mm
180mm
14.4mm
13mm
60mm
ACCESS HOLE
COVER TAPE
USER DIRECTION OF FEED PIN 1
SOT-23 (8mm POCKET PITCH)
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.

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