SM2T Datasheet by STMicroelectronics

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SM2T
TRANSIL™
REV. 3
K
A
STmite
(JEDEC DO-216AA)
January 2005
FEATURES
High Peak pulse power:
200 W (10/1000 µs )
1000 W ( 8/20 µs)
Stand-off voltage range 5 to 24V
Unidirectional types
Low clamping factor VCL/VBR
Fast response time
1.0mm overall component height
DESCRIPTION
The SM2T series are Transil diodes designed spe-
cifically for portable equipment and miniaturized
electronics devices subject to ESD transient over-
voltages.
Fully compatible with pick and place equipment
and inspectable soldering joints.
Table 2: Absolute Ratings (Tamb = 25°C)
Table 3: Thermal Resistances
Symbol Parameter Value Unit
PPP Peak pulse power dissipation (see note 1) Tj initial = Tamb 200 W
P Power dissipation on infinite heatsink Tamb = 100°C 2.5 W
IFSM Non repetitive surge peak forward current tp = 10 ms
Tj initial = Tamb 25 A
Tstg
Tj
Storage temperature range
Maximum junction temperature
-65 to 175
150 °C
TLMaximum lead temperature for soldering during 10 s. 260 °C
Note 1: 10/1000µs pulse waveform.
Symbol Parameter Value Unit
Rth(j-t) Junction to tab 20 °C/W
Rth(j-a) Junction to ambient on PCB with recommended pad layout 250 °C/W
Table 1: Order Codes
Part Number Marking
SM2T6V8A MUA
SM2T14A MUE
SM2T18A MUG
SM2T27A MUJ
SM2T
2/6
Table 4: Electrical Characteristics (Tamb = 25°C)
Note 1: 10/1000µs pulse waveform.
Symbol Parameter
VRM Stand-off voltage
VBR Breakdown voltage
VCL Clamping voltage
IRM Leakage current @ VRM
IPP Peak pulse current
αT Voltage temperature coefficient
VFForward voltage drop
Types
IRM @ VRM VBR @ IRVCL @ IPP αTC
max min max
note1
max typ
@ 0V
µAVVmAVA
10-4C pF
SM2T6V8A 50 5 6.4 10 9.2 19.6 5.7 1600
SM2T14A 1 12 13.3 1 19.9 9 8.3 650
SM2T18A 1 16 17.1 1 26 7 8.8 500
SM2T27A 1 24 25.7 1 28.9 4.6 9.6 350
I
IF
VF
VVCL VBR
VRM
IPP
IRM
V
SM2T
3/6
Figure 1: Peak pulse power versus exponential
pulse duration
Figure 2: Relative variation of peak pulse
power versus initial junction temperature
Figure 3: Average power dissipation versus
ambient temperature
Figure 4: Variation of thermal impedance
junction to ambient versus pulse duration
Figure 5: Thermal resistance junction to
ambient versus copper surface under tab
Figure 6: Reverse leakage current versus
junction temperature (typical values)
1.E+01
1.E+02
1.E+03
1.E+04
0.01 0.10 1.00 10.00
P (W)
PP
t (ms)
p
T initial = 25°C
j
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150 175
%
T (°C)
j
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 25 50 75 100 125 150
Printed circuit board FR4, recommended pad layout
T (°C)
AMB
P(W)
T=
AMB Ttab
0.1
1.0
10.0
100.0
1000.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
S=2cm²
S=0.135cm²
Z/R
th(j-c) th(j-c)
t (s)
p
0
50
100
150
200
250
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
S(cm²)
R (°C/W)
th(j-a)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 25 50 75 100 125 150
T (°C)
j
I (nA)
R
V=V
RRM
SM2T
4/6
Figure 7: Clamping voltage versus peak pulse
current (maximum values)
Figure 8: Junction capacitance versus reverse
voltage applied (typical values)
Fig. 9: Forward voltage drop versus forward
current (typical values)
0.1
1.0
10.0
100.0
0 5 10 15 20 25 30 35 40 45
V (V)
CL
I (A)
PP
10/1000µs
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
8/20µs
T initial = 25°C
j
10
100
1000
10000
1 10 100
V (V)
R
C(pF)
F=1MHz
V =30mV
T =25°C
OSC RMS
j
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
I (A)
FM
V (V)
FM
T = 150°C
j
T = 25°C
j
SM2T
5/6
Figure 10: STmite Package Mechanical Data
Figure 11: STmite Foot Print Dimensions
(in millimeters)
C
L2
L
A1
R1
R
0° to 6°
b
H
b2
D
L3
A
E
2.67
2.54
0.762
1.27
0.635
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.85 1.00 1.15 0.033 0.039 0.045
A1 0.10 0.004
b 0.40 0.65 0.016 0.025
b2 0.70 1.00 0.027 0.039
c 0.10 0.25 0.004 0.010
D 1.75 1.90 2.05 0.069 0.007 0.081
E 1.75 1.90 2.05 0.069 0.007 0.081
H 3.60 3.75 3.90 0.142 0.148 0.154
L 0.50 0.63 0.80 0.020 0.025 0.031
L2 1.20 1.35 1.50 0.047 0.053 0.059
L3 0.50
ref
0.019
ref
R 0.07 0.003
R1 0.07 0.003
Table 5: Ordering Information
Part Number Marking Package Weight Base qty Delivery mode
SM2T6V8A MUA
STmite 15.5 mg 12000 Tape & reel
SM2T14A MUE
SM2T18A MUG
SM2T27A MUJ
Table 6: Revision History
Date Revision Description of Changes
April-2002 1A Last update.
Aug-2004 2 STmite package dimensions update.
14-Jan-2005 3 Minor layout update. No content change.
SM2T
6/6
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by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
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