UC3844B, 3845B, 2844B, 2845B Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2013
August, 2013 Rev. 11
1Publication Order Number:
UC3844B/D
UC3844B, UC3845B,
UC2844B, UC2845B
High Performance
Current Mode Controllers
The UC3844B, UC3845B series are high performance fixed frequency
current mode controllers. They are specifically designed for OffLine
and dcdc converter applications offering the designer a costeffective
solution with minimal external components. These integrated circuits
feature an oscillator, a temperature compensated reference, high gain
error amplifier, current sensing comparator, and a high current totem pole
output ideally suited for driving a power MOSFET.
Also included are protective features consisting of input and
reference undervoltage lockouts each with hysteresis, cyclebycycle
current limiting, a latch for single pulse metering, and a flipflop
which blanks the output off every other oscillator cycle, allowing
output deadtimes to be programmed from 50% to 70%.
These devices are available in an 8pin dualinline and surface
mount (SOIC8) plastic package as well as the 14pin plastic surface
mount (SOIC14). The SOIC14 package has separate power and
ground pins for the totem pole output stage.
The UCX844B has UVLO thresholds of 16V (on) and 10V (off), ideally
suited for offline converters. The UCX845B is tailored for lower voltage
applications having UVLO thresholds of 8.5V (on) and 7.6V (off).
Features
Trimmed Oscillator for Precise Frequency Control
Oscillator Frequency Guaranteed at 250 kHz
Current Mode Operation to 500 kHz Output Switching Frequency
Output Deadtime Adjustable from 50% to 70%
Automatic Feed Forward Compensation
Latching PWM for CycleByCycle Current Limiting
Internally Trimmed Reference with Undervoltage Lockout
High Current Totem Pole Output
Undervoltage Lockout with Hysteresis
Low Startup and Operating Current
These Devices are PbFree and are RoHS Compliant
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
Pin numbers in parenthesis are for the D suffix SOIC-14 package.
Output
VC
RT/CT
Vref VCC
Undervoltage
Lockout
GND
5.0V
Reference
Vref
Undervoltage
Lockout
Latching
PWM
Oscillator
Error
Amplifier
5(9)
3(5)
5(8)
6(10)
7(11)
Power
Ground
Current
Sense Input
1(1)
2(3)
4(7)
8(14)
Output/
Compensation
Voltage
Feedback
Input
VCC 7(12)
R
R
Figure 1. Simplified Block Diagram
14
SOIC14
D SUFFIX
CASE 751A
1
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
ORDERING INFORMATION
See general marking information in the device marking
section on page 16 of this data sheet.
DEVICE MARKING INFORMATION
1
8
PDIP8
N SUFFIX
CASE 626
PIN CONNECTIONS
Compensation
NC
Voltage Feedback
NC
Current Sense
NC
RT/CT
Compensation
Voltage Feedback
Current Sense
RT/CT
Vref
Vref
NC
VCC
VC
Output
GND
Power Ground
VCC
Output
GN
D
(Top View)
8
7
6
5
1
2
3
4
1
2
3
4
14
13
12
11
5
6
7
10
9
8
(Top View)
SOIC8
D1 SUFFIX
CASE 751
1
8
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MAXIMUM RATINGS
Rating Symbol Value Unit
Bias and Driver Voltages (Zero Series Impedance, see also Total Device spec) (Note 1) VCC, VC36 V
Total Power Supply and Zener Current (ICC + IZ) 30 mA
Output Current, Source or Sink (Note 2) IO1.0 A
Output Energy (Capacitive Load per Cycle) W 5.0 mJ
Current Sense and Voltage Feedback Inputs Vin 0.3 to + 5.5 V
Error Amp Output Sink Current IO10 mA
Power Dissipation and Thermal Characteristics
D Suffix, Plastic Package, SOIC14 Case 751A
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, JunctiontoAir
D1 Suffix, Plastic Package, SOIC8 Case 751
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, JunctiontoAir
N Suffix, Plastic Package, Case 626
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, JunctiontoAir
PD
RqJA
PD
RqJA
PD
RqJA
862
145
702
178
1.25
100
mW
°C/W
mW
°C/W
W
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature UC3844B, UC3845B
UC2844B, UC2845B
UC3844BV, UC3845BV
TA0 to +70
25 to +85
40 to +105
°C
Storage Temperature Range Tstg 65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The voltage is clamped by a zener diode (see page 9 Under Voltage Lockout section). Therefore this voltage may be exceeded as long as
the total power supply and zener current is not exceeded.
2. Maximum package power dissipation limits must be observed.
3. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per JEDEC Standard
JESD22-A114B, Machine Model Method 200 V per JEDEC Standard JESD22-A115-A
4. This device contains latch-up protection and exceeds 100 mA per JEDEC Standard JESD78
ELECTRICAL CHARACTERISTICS (VCC = 15 V [Note 5], RT = 10 k, CT = 3.3 nF. For typical values TA = 25°C, for min/max values
TA is the operating ambient temperature range that applies [Note 6], unless otherwise noted.)
UC284xB UC384xB, xBV, NCV384xBV
Characteristic Symbol Min Typ Max Min Typ Max Unit
REFERENCE SECTION
Reference Output Voltage (IO = 1.0 mA, TJ = 25°C) Vref 4.95 5.0 5.05 4.9 5.0 5.1 V
Line Regulation (VCC = 12 V to 25 V) Regline 2.0 20 2.0 20 mV
Load Regulation (IO = 1.0 mA to 20 mA) Regload 3.0 25 3.0 25 mV
Temperature Stability TS0.2 − − 0.2 mV/°C
Total Output Variation over Line, Load, & Temperature Vref 4.9 5.1 4.82 5.18 V
Output Noise Voltage (f = 10 Hz to 10 kHz, TJ = 25°C) Vn50 − − 50 mV
Long Term Stability (TA = 125°C for 1000 Hours) S5.0 − − 5.0 mV
Output Short Circuit Current ISC 30 85 180 30 85 180 mA
OSCILLATOR SECTION
Frequency TJ = 25°C
TA = Tlow to Thigh
TJ = 25°C (RT = 6.2 k, CT = 1.0 nF)
fOSC 49
48
225
52
250
55
56
275
49
48
225
52
250
55
56
275
kHz
Frequency Change with Voltage (VCC = 12 V to 25 V) DfOSC/DV0.2 1.0 0.2 1.0 %
Frequency Change w/ Temperature (TA = Tlow to Thigh)DfOSC/DT1.0 − − 0.5 %
Oscillator Voltage Swing (PeaktoPeak) VOSC 1.6 − − 1.6 V
5. Adjust VCC above the Startup threshold before setting to 15 V.
6. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Tlow =0°C for UC3844B, UC3845B Thigh =+70°C for UC3844B, UC3845B
=25°C for UC2844B, UC2845B = + 85°C for UC2844B, UC2845B
=40°C for UC384xBV, NCV384xBV =+105°C for UC3844BV, UC3845BV
= +125°C for NCV384xBV
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UC3844B, UC3845B, UC2844B, UC2845B
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ELECTRICAL CHARACTERISTICS (VCC = 15 V [Note 7], RT = 10 k, CT = 3.3 nF. For typical values TA = 25°C, for min/max values
TA is the operating ambient temperature range that applies [Note 8], unless otherwise noted.)
UC284xB UC384xB, xBV,
NCV384xBV
Characteristic Symbol Min Typ Max Min Typ Max Unit
OSCILLATOR SECTION
Discharge Current (VOSC = 2.0 V) TJ = 25°C
TA = Tlow to Thigh (UC284XB, UC384XB)
(UC384XBV)
Idischg 7.8
7.5
8.3
8.8
8.8
7.8
7.6
7.2
8.3
8.8
8.8
8.8
mA
ERROR AMPLIFIER SECTION
Voltage Feedback Input (VO = 2.5 V) VFB 2.45 2.5 2.55 2.42 2.5 2.58 V
Input Bias Current (VFB = 5.0 V) IIB 0.1 1.0 0.1 2.0 mA
Open Loop Voltage Gain (VO = 2.0 V to 4.0 V) AVOL 65 90 65 90 dB
Unity Gain Bandwidth (TJ = 25°C) BW 0.7 1.0 0.7 1.0 MHz
Power Supply Rejection Ratio (VCC = 12 V to 25 V) PSRR 60 70 60 70 dB
Output Current Sink (VO = 1.1 V, VFB = 2.7 V)
Output Current Source (VO = 5.0 V, VFB = 2.3 V)
ISink
ISource
2.0
0.5
12
1.0
2.0
0.5
12
1.0
mA
Output Voltage Swing
High State (RL = 15 k to ground, VFB = 2.3 V)
Low State (RL = 15 k to Vref, VFB = 2.7 V)
(UC284XB, UC384XB)
(UC384XBV)
VOH
VOL
5.0
6.2
0.8
1.1
5.0
6.2
0.8
0.8
1.1
1.2
V
CURRENT SENSE SECTION
Current Sense Input Voltage Gain (Notes 9 & 10)
(UC284XB, UC384XB)
(UC384XBV)
AV
2.85
3.0
3.15
2.85
2.85
3.0
3.0
3.15
3.25
V/V
Maximum Current Sense Input Threshold (Note 9)
(UC284XB, UC384XB)
(UC384XBV)
Vth
0.9
1.0
1.1
0.9
0.85
1.0
1.0
1.1
1.1
V
Power Supply Rejection Ratio (VCC = 12 V to 25 V) (Note 9) PSRR 70 70 dB
Input Bias Current IIB 2.0 10 2.0 10 mA
Propagation Delay (Current Sense Input to Output) tPLH(In/Out) 150 300 150 300 ns
OUTPUT SECTION
Output Voltage
Low State (ISink = 20 mA)
(ISink = 200 mA, UC284XB, UC384XB)
(ISink = 200 mA, UC384XBV)
High State (ISource = 20 mA, UC284XB, UC384XB)
(ISource = 20 mA, UC384XBV)
(ISource = 200 mA)
VOL
VOH
13
12
0.1
1.6
13.5
13.4
0.4
2.2
13
12.9
12
0.1
1.6
1.6
13.5
13.4
0.4
2.2
2.3
V
Output Voltage with UVLO Activated (VCC = 6.0 V, ISink = 1.0 mA) VOL(UVLO) 0.1 1.1 0.1 1.1 V
Output Voltage Rise Time (CL = 1.0 nF, TJ = 25°C) tr50 150 50 150 ns
Output Voltage Fall Time (CL = 1.0 nF, TJ = 25°C) tf50 150 50 150 ns
UNDERVOLTAGE LOCKOUT SECTION
Startup Threshold UCX844B, BV
UCX845B, BV
Vth 15
7.8
16
8.4
17
9.0
14.5
7.8
16
8.4
17.5
9.0
V
Minimum Operating Voltage After TurnOn UCX844B, BV
UCX845B, BV
VCC(min) 9.0
7.0
10
7.6
11
8.2
8.5
7.0
10
7.6
11.5
8.2
V
7. Adjust VCC above the Startup threshold before setting to 15 V.
8. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Tlow =0°C for UC3844B, UC3845B Thigh =+70°C for UC3844B, UC3845B
=25°C for UC2844B, UC2845B = + 85°C for UC2844B, UC2845B
=40°C for UC384xBV, NCV384xBV = +105°C for UC3844BV, UC3845BV
= +125°C for NCV384xBV
9. This parameter is measured at the latch trip point with VFB = 0 V.
10.Comparator gain is defined as: AV =DV Output/Compensation
DV Current Sense Input
m m m E T o N
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ELECTRICAL CHARACTERISTICS (VCC = 15 V [Note 11], RT = 10 k, CT = 3.3 nF. For typical values TA = 25°C, for min/max
values TA is the operating ambient temperature range that applies [Note 12], unless otherwise noted.)
UC284xB UC384xB, xBV, NCV384xBV
Characteristic Symbol Min Typ Max Min Typ Max Unit
PWM SECTION
Duty Cycle
Maximum (UC284XB, UC384XB)
Maximum (UC384XBV)
Minimum
DC(max)
DC(min)
47
48
50
0
47
46
48
48
50
50
0
%
TOTAL DEVICE
Power Supply Current
Startup (VCC = 6.5 V for UCX845B,
Startup (VCC = 14 V for UCX844B, BV)
Operating (Note 11)
ICC
0.3
12
0.5
17
0.3
12
0.5
17
mA
Power Supply Zener Voltage (ICC = 25 mA) VZ30 36 30 36 V
11. Adjust VCC above the Startup threshold before setting to 15 V.
12.Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Tlow =0°C for UC3844B, UC3845B Thigh =+70°C for UC3844B, UC3845B
=25°C for UC2844B, UC2845B = + 85°C for UC2844B, UC2845B
=40°C for UC384xBV, NCV384xBV = +105°C for UC3844BV, UC3845BV
=+125°C for NCV384xBV
0.8
2.0
5.0
8.0
20
50
80
RT, TIMING RESISTOR (k )
Ω
1.0 M500 k200 k100 k50 k20 k10 k
fOSC, OSCILLATOR FREQUENCY (kHz)
Figure 2. Timing Resistor
versus Oscillator Frequency
Figure 3. Output Deadtime
versus Oscillator Frequency
1.0 M100 k10 k
fOSC, OSCILLATOR FREQUENCY (kHz)
50
% DT, PERCENT OUTPUT DEADTIME
1.CT = 10 nF
2.CT = 5.0 nF
3.CT = 2.0 nF
4.CT = 1.0 nF
5.CT = 500 pF
6.CT = 200 pF
7.CT = 100 pF
55
60
65
70
75
20 k 50 k 200 k 500 k
2
3
7
5
6
NOTE: Output switches at
1/2 the oscillator frequency
VCC = 15 V
TA = 25°C
0.5 ms/DIV
20 mV/DIV
2.55 V
2.5 V
2.45 V
VCC = 15 V
AV = -1.0
TA = 25°C
VCC = 15 V
AV = -1.0
TA = 25°C
1.0 ms/DIV
200 mV/DIV
2.5 V
3.0 V
2.0 V
Figure 4. Error Amp Small Signal
Transient Response
Figure 5. Error Amp Large Signal
Transient Response
1
4
For RTu5KfX1.72
RTCT
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Δ, OUTPUT VOLTAGE CHANGE (2.0 mV/DIV)
O
V
-20
AVOL, OPEN LOOP VOLTAGE GAIN (dB)
10 M10
f, FREQUENCY (Hz)
Gain
Phase
0
30
60
90
120
150
180
100 1.0 k 10 k 100 k 1.0 M
0
20
40
60
80
100
, EXCESS PHASE (DEGREES)
φ
0
VO, ERROR AMP OUTPUT VOLTAGE (VO)
0
, CURRENT SENSE INPUT THRESHOLD (V
)
Vth
0.2
0.4
0.6
0.8
1.0
1.2
2.0 4.0 6.0 8.0
TA = -55°C
VCC = 15 V
RL 0.1 W
Figure 6. Error Amp Open Loop Gain and
Phase versus Frequency
Figure 7. Current Sense Input Threshold
versus Error Amp Output Voltage
Figure 8. Reference Voltage Change
versus Source Current
Figure 9. Reference Short Circuit Current
versus Temperature
, REFERENCE VOLTAGE CHANGE (mV)
-16
0
Iref, REFERENCE SOURCE CURRENT (mA)
20 40 60 80 100 120
ref
V
-12
-8.0
-4.0
0
, REFERENCE SHORT CIRCUIT CURRENT (mA)
SC
I
50
-55
TA, AMBIENT TEMPERATURE (°C)
-25 0 25 50 75 100 125
70
90
110
Δ
-20
-24
TA = 125°C
VCC = 15 V
VO = 2.0 V to 4.0 V
RL = 100 k
TA = 25°C
VCC = 15 V
TA = 25°C
Δ, OUTPUT VOLTAGE CHANGE (2.0 mV/DIV)
O
2.0 ms/DIV
V
2.0 ms/DIV
VCC = 12 V to 25 V
TA = 25°C
VCC = 15 V
IO = 1.0 mA to 20 mA
TA = 25°C
Figure 10. Reference Load Regulation Figure 11. Reference Line Regulation
VCC = 15 V
TA = 125°C
TA = 25°C
TA = -55°C
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Sink Saturation
(Load to VCC)
RT = 10 k
CT = 3.3 nF
VFB = 0 V
ISense = 0 V
TA = 25°C
, SUPPLY CURRENT (mA)
CC
I
00
VCC, SUPPLY VOLTAGE (V)
10 20 30 40
5
10
15
20
25
UCX845B
UCX844B
Figure 12. Output Saturation Voltage
versus Load Current
Figure 13. Output Waveform
TA = 25°C
TA = -55°C
VCC VCC = 15 V
80 ms Pulsed Load
120 Hz Rate
TA = -55°C
TA = 25°C
0
V
sat,
O
UTPUT
S
ATURATI
O
N V
O
LTA
G
E
(
V
)
8000
IO, OUTPUT LOAD CURRENT (mA)
200 400 600
1.0
2.0
3.0
-2.0
-1.0
0
Source Saturation
(Load to Ground)
GND
50 ns/DIV
90
%
10
%
VCC = 15 V
CL = 1.0 nF
TA = 25°C
100 ns/DIV
VCC = 30 V
CL = 15 pF
TA = 25°C
, SUPPLY CURRENT
100 mA/DIV 20 V/DIV
I, OUTPUT VOLTAGEV
CC O
Figure 14. Output Cross Conduction Figure 15. Supply Current versus Supply Voltage
PIN FUNCTION DESCRIPTION
Pin
Function Description
8Pin 14Pin
1 1 Compensation This pin is the Error Amplifier output and is made available for loop compensation.
2 3 Voltage
Feedback
This is the inverting input of the Error Amplifier. It is normally connected to the switching power
supply output through a resistor divider.
3 5 Current Sense A voltage proportional to inductor current is connected to this input. The PWM uses this
information to terminate the output switch conduction.
4 7 RT/CTThe Oscillator frequency and maximum Output duty cycle are programmed by connecting resistor
RT to Vref and capacitor CT to ground. Oscillator operation to 1.0 kHz is possible.
5 GND This pin is the combined control circuitry and power ground.
6 10 Output This output directly drives the gate of a power MOSFET. Peak currents up to 1.0 A are sourced
and sunk by this pin. The output switches at onehalf the oscillator frequency.
7 12 VCC This pin is the positive supply of the control IC.
8 14 Vref This is the reference output. It provides charging current for capacitor CT through resistor RT
.
8Power
Ground
This pin is a separate power ground return that is connected back to the power source. It is used
to reduce the effects of switching transient noise on the control circuitry.
11 VCThe Output high state (VOH) is set by the voltage applied to this pin. With a separate power source
connection, it can reduce the effects of switching transient noise on the control circuitry.
9 GND This pin is the control circuitry ground return and is connected back to the powersource ground.
2,4,6,13 NC No connection. These pins are not internally connected.
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OPERATING DESCRIPTION
The UC3844B, UC3845B series are high performance,
fixed frequency, current mode controllers. They are
specifically designed for OffLine and DCDC converter
applications offering the designer a costeffective solution
with minimal external components. A representative block
diagram is shown in Figure 16.
Oscillator
The oscillator frequency is programmed by the values
selected for the timing components RT and CT. Capacitor CT
is charged from the 5.0 V reference through resistor RT to
approximately 2.8 V and discharged to 1.2 V by an internal
current sink. During the discharge of CT, the oscillator
generates an internal blanking pulse that holds the center
input of the NOR gate high. This causes the Output to be in
a low state, thus producing a controlled amount of output
deadtime. An internal flipflop has been incorporated in the
UCX844/5B which blanks the output off every other clock
cycle by holding one of the inputs of the NOR gate high. This
in combination with the CT discharge period yields output
deadtimes programmable from 50% to 70%. Figure 2 shows
RT versus Oscillator Frequency and Figure 3, Output
Deadtime versus Frequency, both for given values of CT.
Note that many values of RT and CT will give the same
oscillator frequency but only one combination will yield a
specific output deadtime at a given frequency. The oscillator
thresholds are temperature compensated to within ±6%
at 50 kHz. Also, because of industry trends moving the
UC384X into higher and higher frequency applications, the
UC384XB is guaranteed to within ±10% at 250 kHz.
In many noisesensitive applications it may be desirable
to frequencylock the converter to an external system clock.
This can be accomplished by applying a clock signal to the
circuit shown in Figure 18. For reliable locking, the
freerunning oscillator frequency should be set about 10%
less than the clock frequency. A method for multiunit
synchronization is shown in Figure 19. By tailoring the
clock waveform, accurate Output duty cycle clamping can
be achieved to realize output deadtimes of greater than 70%.
Error Amplifier
A fully compensated Error Amplifier with access to the
inverting input and output is provided. It features a typical
dc voltage gain of 90 dB, and a unity gain bandwidth of
1.0 MHz with 57 degrees of phase margin (Figure 6). The
noninverting input is internally biased at 2.5 V and is not
pinned out. The converter output voltage is typically divided
down and monitored by the inverting input. The maximum
input bias current is 2.0 mA which can cause an output
voltage error that is equal to the product of the input bias
current and the equivalent input divider source resistance.
The Error Amp Output (Pin 1) is provided for external
loop compensation (Figure 29). The output voltage is offset
by two diode drops (1.4 V) and divided by three before it
connects to the inverting input of the Current Sense
Comparator. This guarantees that no drive pulses appear at
the Output (Pin 6) when Pin 1 is at its lowest state (VOL).
This occurs when the power supply is operating and the load
is removed, or at the beginning of a softstart interval
(Figures 21, 22). The Error Amp minimum feedback
resistance is limited by the amplifiers source current
(0.5 mA) and the required output voltage (VOH) to reach the
comparators 1.0 V clamp level:
Rf(min) 3.0 (1.0 V) + 1.4 V
0.5 mA = 8800 W
Current Sense Comparator and PWM Latch
The UC3844B, UC3845B operate as a current mode
controller, whereby output switch conduction is initiated by
the oscillator and terminated when the peak inductor current
reaches the threshold level established by the Error
Amplifier Output/Compensation (Pin 1). Thus the error
signal controls the peak inductor current on a
cyclebycycle basis. The Current Sense Comparator PWM
Latch configuration used ensures that only a single pulse
appears at the Output during any given oscillator cycle. The
inductor current is converted to a voltage by inserting the
groundreferenced sense resistor RS in series with the
source of output switch Q1. This voltage is monitored by the
Current Sense Input (Pin 3) and compared to a level derived
from the Error Amp Output. The peak inductor current under
normal operating conditions is controlled by the voltage at
Pin 1 where:
Ipk = V(Pin 1) 1.4 V
3 RS
Abnormal operating conditions occur when the power
supply output is overloaded or if output voltage sensing is
lost. Under these conditions, the Current Sense Comparator
threshold will be internally clamped to 1.0 V. Therefore the
maximum peak switch current is:
Ipk(max) = 1.0 V
RS
When designing a high power switching regulator it
becomes desirable to reduce the internal clamp voltage in order
to keep the power dissipation of RS to a reasonable level. A
simple method to adjust this voltage is shown in Figure 20. The
two external diodes are used to compensate the internal diodes,
yielding a constant clamp voltage over temperature. Erratic
operation due to noise pickup can result if there is an excessive
reduction of the Ipk(max) clamp voltage.
A narrow spike on the leading edge of the current
waveform can usually be observed and may cause the power
supply to exhibit an instability when the output is lightly
loaded. This spike is due to the power transformer
interwinding capacitance and output rectifier recovery time.
The addition of an RC filter on the Current Sense Input with
a time constant that approximates the spike duration will
usually eliminate the instability (refer to Figure 24).
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8
Figure 16. Representative Block Diagram
Figure 17. Timing Diagram
Capacitor CT
Latch “Set"
Input
Output/
Compensation
Current Sense
Input
Latch “Reset"
Input
Output
Large RT/Small CTSmall RT/Large CT
+
-
Reference
Regulator
VCC
UVLO
+
-Vref
UVLO
3.6V
36V
S
R
Q
Internal
Bias
+1.0mA
Oscillator
2.5V
R
R
R
2R
Error
Amplifier
Voltage
Feedback
Input
Output/
Compensation Current Sense
Comparator
1.0V
VCC 7(12)
GND 5(9)
VC
7(11)
Output
6(10)
Power Ground
5(8)
Current Sense Input
3(5) RS
Q1
VCC Vin
1(1)
2(3)
4(7)
8(14)
RT
CT
Vref
= Sink Only Positive True Logic
Pin numbers adjacent to terminals are for the 8-pin dual-in-line package.
Pin numbers in parenthesis are for the D suffix SOIC-14 package.
PWM
Latch
(See
Text)
T
UC3844B, UC3845B, UC2844B, UC2845B
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9
Undervoltage Lockout
Two undervoltage lockout comparators have been
incorporated to guarantee that the IC is fully functional
before the output stage is enabled. The positive power
supply terminal (VCC) and the reference output (Vref) are
each monitored by separate comparators. Each has builtin
hysteresis to prevent erratic output behavior as their
respective thresholds are crossed. The VCC comparator
upper and lower thresholds are 16 V/10 V for the UCX844B,
and 8.4 V/7.6 V for the UCX845B. The Vref comparator
upper and lower thresholds are 3.6 V/3.4 V. The large
hysteresis and low startup current of the UCX844B makes
it ideally suited in offline converter applications where
efficient bootstrap startup techniques are required
(Figure 30). The UCX845B is intended for lower voltage
dcdc converter applications. A 36 V Zener is connected as
a shunt regulator from VCC to ground. Its purpose is to
protect the IC from excessive voltage that can occur during
system startup. The minimum operating voltage for the
UCX844B is 11 V and 8.2 V for the UCX845B.
Output
These devices contain a single totem pole output stage that
was specifically designed for direct drive of power
MOSFETs. It is capable of up to ±1.0 A peak drive current
and has a typical rise and fall time of 50 ns with a 1.0 nF load.
Additional internal circuitry has been added to keep the
Output in a sinking mode whenever an undervoltage lockout
is active. This characteristic eliminates the need for an
external pulldown resistor.
The SOIC14 surface mount package provides separate
pins for VC (output supply) and Power Ground. Proper
implementation will significantly reduce the level of
switching transient noise imposed on the control circuitry.
This becomes particularly useful when reducing the Ipk(max)
clamp level. The separate VC supply input allows the
designer added flexibility in tailoring the drive voltage
independent of VCC. A Zener clamp is typically connected
to this input when driving power MOSFETs in systems
where VCC is greater than 20 V. Figure 23 shows proper
power and control ground connections in a currentsensing
power MOSFET application.
Reference
The 5.0 V bandgap reference is trimmed to ±1.0%
tolerance at TJ = 25°C on the UC284XB, and ±2.0% on the
UC384XB. Its primary purpose is to supply charging current
to the oscillator timing capacitor. The reference has
shortcircuit protection and is capable of providing in
excess of 20 mA for powering additional control system
circuitry.
Design Considerations
Do not attempt to construct the converter on
wirewrap or plugin prototype boards. High frequency
circuit layout techniques are imperative to prevent
pulsewidth jitter. This is usually caused by excessive noise
pickup imposed on the Current Sense or Voltage Feedback
inputs. Noise immunity can be improved by lowering circuit
impedances at these points. The printed circuit layout should
contain a ground plane with lowcurrent signal and
highcurrent switch and output grounds returning on
separate paths back to the input filter capacitor. Ceramic
bypass capacitors (0.1 mF) connected directly to VCC, VC,
and Vref may be required depending upon circuit layout.
This provides a low impedance path for filtering the high
frequency noise. All high current loops should be kept as
short as possible using heavy copper runs to minimize
radiated EMI. The Error Amp compensation circuitry and
the converter output voltage divider should be located close
to the IC and as far as possible from the power switch and
other noisegenerating components.
Bias
+
Osc
R
R
R
2R
EA
5(9)
1(1)
2(3)
4(7)
8(14)
RT
CT
Vref
Figure 18. External Clock Synchronization Figure 19. External Duty Cycle Clamp and
MultiUnit Synchronization
0.01
The diode clamp is required if the Sync amplitude is large enough to cause
the bottom side of CT to go more than 300 mV below ground.
External
Sync
Input
47
+
R
R
R
2R
Bias
Osc
EA
5(9)
1(1)
2(3)
4(7)
8(14)
To Additional
UCX84XBs
R
S
Q
8 4
6
5
2
1
C
3
7
RA
RB5.0k
5.0k
5.0k MC1455
f +1.44
(RA)2R
B)C D(max)+RA
RA)2R
B
a ————————f—1 I 7| ; I é , I i I I I + I _________J i VClamQ
UC3844B, UC3845B, UC2844B, UC2845B
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10
If: SENSEFET = MTP10N10M
RS= 200
Figure 20. Adjustable Reduction of Clamp Level Figure 21. SoftStart Circuit
Figure 22. Adjustable Buffered Reduction of
Clamp Level with SoftStart
+
-
5.0V Ref
+
-
S
R
Q
Bias
+
Osc
R
R
R
2R
EA
1.0V
5(9)
7(11)
6(10)
5(8)
3(5) RS
Q1
VCC Vin
1(1)
2(3)
4(7)
8(14)
R1
VClamp
R2
Ipk(max)[VClamp
RS
Where: 0 VClamp 1.0 V
5.0V Ref
+
-
S
R
Q
Bias
+
1.0mA
Osc
R
R
R
2R
EA
1.0V
5(9)
1(1)
2(3)
4(7)
8(14)
C
1.0M
tSoft-Start 3600C in mF
+
-
+
-
S
R
+
R
R
R
2R
Ipk(max)[VClamp
RS
Figure 23. Current Sensing Power MOSFET
5.0V Ref
Q
Bias
Osc
EA
1.0V
5(9)
7(11)
6(10)
5(8)
3(5) RS
Q1
VCC Vin
1(1)
2(3)
4(7)
8(14)
R1
R2
Where: 0 VClamp 1.0 V
MPSA63
+
-
5.0V Ref
+
-
S
R
Q
(11)
(10)
(8)
Comp/Latch
(5) RS
1/4 W
VCC Vin
K
M
DSENSEFET
GS
Power Ground:
To Input Source
Return
Control Circuitry Ground:
To Pin (9)
Virtually lossless current sensing can be achieved with the implementation
of a SENSEFETt power switch. For proper operation during over-current
conditions, a reduction of the Ipk(max) clamp level must be implemented.
Refer to Figures 20 and 22.
VPin5[RSIpkrDS(on)
rDM(on))R
S
Then : VPin5[0.075I
pk
7(12)
7(12)
1.0 mA
Comp/Latch
Comp/Latch
1.0 mA
(12)
T
T
TT
VClamp
VClamp 1.67
ǒR2
R1)1Ǔ+ 0.33x10-3 ǒR1R2
R1)R2Ǔ
VClamp 1.67
ǒR2
R1)1Ǔ
tSoftStart +*Inƪ1*VC
3VClampƫC R1R2
R1)R2
UC3844B, UC3845B, UC2844B, UC2845B
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11
Figure 24. Current Waveform Spike Suppression
+
-
5.0V Ref
+
-
S
R
Q
7(11)
6(10)
5(8)
3(5)
RS
Q1
VCC Vin
C
R
The addition of the RC filter will eliminate
instability caused by the leading edge spike
on the current waveform.
7(12)
Comp/Latch
T
Figure 25. MOSFET Parasitic Oscillations Figure 26. Bipolar Transistor Drive
+
-
S
R
5.0V Ref
Q
7(11)
6(10)
5(8)
3(5) RS
Q1
VCC Vin
Series gate resistor Rg will damp any high frequency
parasitic oscillations caused by the MOSFET input
capacitance and any series wiring inductance in the
gate-source circuit.
6(10)
5(8)
3(5) RS
Q1
Vin
C1
Base Charge
Removal
The totem pole output can furnish negative base current
for enhanced transistor turn-off, with the addition of
capacitor C1.
IB
+
-
0
7(12)
Rg
Comp/Latch
T
+
-
UC3844B, UC3845B, UC2844B, UC2845B
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12
+
R
2R
1.0mA
EA
2(3)
5(9)
2.5V
1(1)
Rf
Cf
Rd
Rp
From VO
Error Amp compensation circuit for stabilizing current mode boost
and flyback topologies operating with continuous inductor current.
Cp
Ri
Figure 27. Isolated MOSFET Drive
Figure 28. Latched Shutdown
Figure 29. Error Amplifier Compensation
+
-
S
R
5.0V Ref
Q
7(11)
6(10)
5(8)
3(5)
RS
Q1
VCC Vin
Isolation
Boundary
VGS Waveforms
+
-
0
50% DC 25% DC
ǒNS
NpǓ
Bias
+
Osc
R
R
R
2R
EA
5(9)
1(1)
2(3)
4(7)
8(14)
The MCR101 SCR must be selected for a holding of < 0.5 mA @ TA(min). The
simple two transistor circuit can be used in place of the SCR as shown. All
resistors are 10 k.
MCR
101
2N
3905
2N
3903
+
R
2R
1.0mA
EA
2(3)
5(9)
2.5V
1(1)
Rf
Cf
Rd
Ri
From VO
Error Amp compensation circuit for stabilizing any current mode topology except
for boost and flyback converters operating with continuous inductor current.
Rf 8.8k
Comp/Latch
7(12)
R
CNSNP
1.0 mA
T
+
-
0
+
-
Ipk = V(Pin1) - 1.4
3 RS
ll,
UC3844B, UC3845B, UC2844B, UC2845B
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13
MUR110
+
-
+
-
S
R
+
R
R
5.0V Ref
Q
Bias
EA
5(9)
7(11)
6(10)
5(8)
3(5) 0.5
MTP
4N50
1(1)
2(3)
4(7)
8(14)
33k
1.0nF
470pF
150k
100
pF
18k
4.7k
Figure 30. 7 W OffLine Flyback Regulator
0.01
100
+
1.0k
115 Vac
4.7WMDA
202
250
56k
4.7k 3300
pF
1N4935 1N4935
++
68
47
1N4937
1N4937
680pF 2.7k
L3
L2
L1
++
++
++
1000
1000
2200
10
10
1000
5.0V/4.0A
5.0V RTN
12V/0.3A
±12V RTN
-12V/0.3A
Primary: 45 Turns #26 AWG
Secondary ±12 V: 9 Turns #30 AWG (2 Strands) Bifiliar Wound
Secondary 5.0 V: 4 Turns (six strands) #26 Hexfiliar Wound
Secondary Feedback: 10 Turns #30 AWG (2 strands) Bifiliar Wound
Core: Ferroxcube EC35-3C8
Bobbin: Ferroxcube EC35PCB1
Gap: 0.10" for a primary inductance of 1.0 mH
MUR110
MBR1635
T1
22
Osc
T1 -
7(12)
Comp/Latch
T
L1
L2, L3
- 15 mH at 5.0 A, Coilcraft Z7156
- 25 mH at 5.0 A, Coilcraft Z7157
1N5819
Test Conditions Results
Line Regulation: 5.0 V
±12 V
Vin = 95 Vac to 130 Vac D = 50 mV or ±0.5%
D = 24 mV or ±0.1%
Load Regulation: 5.0 V
±12 V
Vin = 115 Vac, Iout = 1.0 A to 4.0 A
Vin = 115 Vac, Iout = 100 mA to 300 mA
D = 300 mV or ±3.0%
D = 60 mV or ±0.25%
Output Ripple: 5.0 V
±12 V
Vin = 115 Vac 40 mVpp
80 mVpp
Efficiency Vin = 115 Vac 70%
All outputs are at nominal load currents unless otherwise noted.
L_______ ___________J .
UC3844B, UC3845B, UC2844B, UC2845B
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14
Osc
+
-
Reference
Regulator
+
-
34V
S
R
Q
Internal
Bias
+
0.5mA
Osc
R
R
R
2R
Error
Amplifier
1.0V
7(12)
7(11)
6(10)
5(8)
3(5)
R1
Vin = 15V
1(1)
2(3)
4(7)
8(14)
10k
1.0nF
The capacitor's equivalent series resistance must limit the Drive Output current to 1.0 A. An additional series resistor
may be required when using tantalum or other low ESR capacitors. The converter's output can provide excellent line
and load regulation by connecting the R2/R1 resistor divider as shown.
Figure 31. StepUp Charge Pump Converter
5(9)
PWM
T
Latch
Current Sense
Comparator
2.5V
3.6V
VCC
UVLO
Vref
UVLO
UC3845B +47
1N5819
15 10 1N5819
+47
R2
Connect to
Pin 2 for
closed loop
operation.
ǒR2
R1 )1Ǔ
VO 2 (Vin)
Output Load Regulation
(Open Loop Configuration)
IO (mA) VO (V)
0
2
9
18
36
29.9
28.8
28.3
27.4
24.4
+
-
+
-
S
R
+
R
R
R
2R
5(9)
PWM
T
Latch
Current Sense
Comparator
+47
15 10 1N5819
+47
Reference
Regulator
34V
Q
Internal
Bias
0.5mA
Error
Amplifier
1.0V
7(12)
7(11)
6(10)
5(8)
3(5)
Vin = 15V
1(1)
2(3)
4(7)
8(14)
10k
1.0nF
The capacitor's equivalent series resistance must limit the Drive Output current to 1.0 A.
An additional series resistor may be required when using tantalum or other low ESR capacitors.
Figure 32. VoltageInverting Charge Pump Converter
2.5V
3.6V
VCC
UVLO
Vref
UVLO
UC3845B
VO -Vin
Output Load Regulation
IO (mA) VO (V)
0
2
9
18
32
14.4
13.2
12.5
11.7
10.6
1N5819
+
VO = 2.5
UC3844B, UC3845B, UC2844B, UC2845B
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15
ORDERING INFORMATION
Device Operating Temperature Range Package Shipping
UC384xBDG
TA = 0° to +70°C
SOIC14
(PbFree)
55 Units/Rail
UC384xBDR2G SOIC14
(PbFree)
2500 Tape & Reel
UC384xBD1G SOIC8
(PbFree)
98 Units/Rail
UC384xBD1R2G SOIC8
(PbFree)
2500 Tape & Reel
UC384xBNG PDIP8
(PbFree)
50 Units/Rail
UC284xBDG
TA = 25° to +85°C
SOIC14
(PbFree)
55 Units/Rail
UC284xBDR2G SOIC14
(PbFree)
2500 Tape & Reel
UC284xBD1G SOIC8
(PbFree)
98 Units/Rail
UC284xBD1R2G SOIC8
(PbFree)
2500 Tape & Reel
UC284xBNG PDIP8
(PbFree)
50 Units/Rail
UC384xBVDG
TA = 40° to +105°C
SOIC14
(PbFree)
55 Units/Rail
UC384xBVDR2G SOIC14
(PbFree)
2500 Tape & Reel
UC384xBVD1G SOIC8
(PbFree)
98 Units/Rail
UC384xBVD1R2G SOIC8
(PbFree)
2500 Tape & Reel
UC384xBVNG PDIP8
(PbFree)
50 Units/Rail
NCV3845BVD1R2G* TA = 40° to +125°CSOIC8
(PbFree)
2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
x indicates either a 4 or 5 to define specific device part numbers.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
ILJLJLM ILJLJLJI ILJLJLJI O O O [I'LLF'LLIHLI lr'Lll‘TLfl [FLIJHLI'WI HHHHHHH HHHHHHH HHHHHHH O AWLYWW O AWLVWW O WHHHHHHH WHHHHHHH HHHHHHH sale—a DISUFFIX CASE75I HHHH EHHHH HHHH 354m I I‘W-“W I HHHH |HHHH HHHH hllp://onsemi.com l6
UC3844B, UC3845B, UC2844B, UC2845B
http://onsemi.com
16
MARKING DIAGRAMS
SOIC14
D SUFFIX
CASE 751A
SOIC8
D1 SUFFIX
CASE 751
PDIP8
N SUFFIX
CASE 626
UC384xBVN
AWL
YYWWG
1
8
UC384xBVDG
AWLYWW
1
14
384xB
ALYWV
G
1
8
UC384xBN
AWL
YYWWG
1
8
UC284xBN
AWL
YYWWG
1
8
UC384xBDG
AWLYWW
1
14
UC284xBDG
AWLYWW
1
14
384xB
ALYW
G
1
8
284xB
ALYW
G
1
8
x = 4 or 5
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= PbFree Package
SENSEFET is a trademark of Semiconductor Components Industries, LLC.
0N Semiwndudw" m 7%? if T . HH'IHHJ A an E, aa Nor: a sEAnNG I was SIDE VIEW ILJLJLJI O lr'fil‘ir'fil ON Semxcunduclm and ave lvademavks av Semxcanduclur Campunenls lnduslnes LLC dba ON Semxcanduclar ar \ls suhsxdmnes m xna Umled sxaxas andJm mhev commas ON Semxcunduclar vesewes ma th| to make changes wuhum Yunhev nauaa to any prnduns havem ON Semanduc‘m makes m7 wanamy represenlalmn m guarantee regardmg ma sumahmh/ at W; manuals can any pamcu‘av purpase nnv dues ON Semumnduclm assume any Mammy ansmg mac xna apphcahan m use no any pmduclnv mum and saaamcauy dwsc‘axms any and au Mammy mc‘udmg wmnam hmma‘mn spema‘ cansequenha‘ m \nmdenla‘ damages ON Semxmnduclar dues nn| aanyay any hcense under Ms pa|em thls nar xna
PDIP8
CASE 62605
ISSUE P
DATE 22 APR 2015
SCALE 1:1
14
58
b2
NOTE 8
D
b
L
A1
A
eB
XXXXXXXXX
AWL
YYWWG
E
GENERIC
MARKING DIAGRAM*
XXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A−−−− 0.210
A1 0.015 −−−−
b0.014 0.022
C0.008 0.014
D0.355 0.400
D1 0.005 −−−−
e0.100 BSC
E0.300 0.325
M−−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
E1
M
8X
c
D1
B
A2 0.115 0.195 2.92 4.95
L0.115 0.150 2.92 3.81
°°
H
NOTE 5
e
e/2 A2
NOTE 3
MBMNOTE 6
M
STYLE 1:
PIN 1. AC IN
2. DC + IN
3. DC IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. VCC
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42420B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
PDIP8
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
0N Semiwndudw" m @ HHHH HHHH HHHH HERE 4 FUDGE] !HHH !HHH gHHH EHHH 1 1 } x ‘ 1 (...... a. ............. ... ......M .. SW. CW ........ .. ... 0. SW .. W- .. ...... ...... ...... ...... 0. SW ...... ... .... .. .... ...... ...... .. ... ...... ...... o. ......m... .. ...... .. ...... ...... ... 5...... .. .. ...... ... .. ...... a. s............ ...... ... ...... ...... ...... .....w... .. .. ... ...... ......w... ....-. ... ... ... ...... ...... ...... ...... ...5......... .. ...... ...... o. 5.--.-. .... ...... ... ...... ...... .... ..............
SOIC8 NB
CASE 75107
ISSUE AK
DATE 16 FEB 2011
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
BS
D
H
C
0.10 (0.004)
SCALE 1:1
STYLES ON PAGE 2
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) ZSXS
M
____
XXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= PbFree Package
GENERIC
MARKING DIAGRAM*
1
8
XXXXX
ALYWX
1
8
IC Discrete
XXXXXX
AYWW
G
1
8
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
Discrete
XXXXXX
AYWW
1
8
(PbFree)
XXXXX
ALYWX
G
1
8
IC
(PbFree)
XXXXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= PbFree Package
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42564B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
SOIC8 NB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
ON Semxcunduclm and ave hademavks av Semxcanduclur Campunenls lnduslnes. uc dha ON Semxcanduclar Dr K: suhsxdmnes m xna Umled sxaxas andJm mhev cmm‘nes ON Semxcunduclar vesewes me “gm to make changes wuhum mnna. mouse to any pruduns necem ON Semanduc‘m makes nu wanamy. represenlalmn m guarantee regardmg ma sumahmly at W; manual: can any pamcu‘av purpase nnv dues ON Semumnduclm assume any Mammy snsmg mm xna aapncauan m use M any pmduclnv mum and specmcsl‘y dwsc‘axms any and an Mammy mc‘udmg wxlham hmma‘mn spema‘ cansequemm m \nmdeula‘ damages ON Semxmnduclar dues nn| away any hcense under Ms pa|EM nghls Ivar xna ngms av mhers
SOIC8 NB
CASE 75107
ISSUE AK
DATE 16 FEB 2011
STYLE 4:
PIN 1. ANODE
2. ANODE
3. ANODE
4. ANODE
5. ANODE
6. ANODE
7. ANODE
8. COMMON CATHODE
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. COLLECTOR
4. EMITTER
5. EMITTER
6. BASE
7. BASE
8. EMITTER
STYLE 2:
PIN 1. COLLECTOR, DIE, #1
2. COLLECTOR, #1
3. COLLECTOR, #2
4. COLLECTOR, #2
5. BASE, #2
6. EMITTER, #2
7. BASE, #1
8. EMITTER, #1
STYLE 3:
PIN 1. DRAIN, DIE #1
2. DRAIN, #1
3. DRAIN, #2
4. DRAIN, #2
5. GATE, #2
6. SOURCE, #2
7. GATE, #1
8. SOURCE, #1
STYLE 6:
PIN 1. SOURCE
2. DRAIN
3. DRAIN
4. SOURCE
5. SOURCE
6. GATE
7. GATE
8. SOURCE
STYLE 5:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. DRAIN
5. GATE
6. GATE
7. SOURCE
8. SOURCE
STYLE 7:
PIN 1. INPUT
2. EXTERNAL BYPASS
3. THIRD STAGE SOURCE
4. GROUND
5. DRAIN
6. GATE 3
7. SECOND STAGE Vd
8. FIRST STAGE Vd
STYLE 8:
PIN 1. COLLECTOR, DIE #1
2. BASE, #1
3. BASE, #2
4. COLLECTOR, #2
5. COLLECTOR, #2
6. EMITTER, #2
7. EMITTER, #1
8. COLLECTOR, #1
STYLE 9:
PIN 1. EMITTER, COMMON
2. COLLECTOR, DIE #1
3. COLLECTOR, DIE #2
4. EMITTER, COMMON
5. EMITTER, COMMON
6. BASE, DIE #2
7. BASE, DIE #1
8. EMITTER, COMMON
STYLE 10:
PIN 1. GROUND
2. BIAS 1
3. OUTPUT
4. GROUND
5. GROUND
6. BIAS 2
7. INPUT
8. GROUND
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
STYLE 12:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 14:
PIN 1. NSOURCE
2. NGATE
3. PSOURCE
4. PGATE
5. PDRAIN
6. PDRAIN
7. NDRAIN
8. NDRAIN
STYLE 13:
PIN 1. N.C.
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 15:
PIN 1. ANODE 1
2. ANODE 1
3. ANODE 1
4. ANODE 1
5. CATHODE, COMMON
6. CATHODE, COMMON
7. CATHODE, COMMON
8. CATHODE, COMMON
STYLE 16:
PIN 1. EMITTER, DIE #1
2. BASE, DIE #1
3. EMITTER, DIE #2
4. BASE, DIE #2
5. COLLECTOR, DIE #2
6. COLLECTOR, DIE #2
7. COLLECTOR, DIE #1
8. COLLECTOR, DIE #1
STYLE 17:
PIN 1. VCC
2. V2OUT
3. V1OUT
4. TXE
5. RXE
6. VEE
7. GND
8. ACC
STYLE 18:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
STYLE 19:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. MIRROR 2
7. DRAIN 1
8. MIRROR 1
STYLE 20:
PIN 1. SOURCE (N)
2. GATE (N)
3. SOURCE (P)
4. GATE (P)
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 21:
PIN 1. CATHODE 1
2. CATHODE 2
3. CATHODE 3
4. CATHODE 4
5. CATHODE 5
6. COMMON ANODE
7. COMMON ANODE
8. CATHODE 6
STYLE 22:
PIN 1. I/O LINE 1
2. COMMON CATHODE/VCC
3. COMMON CATHODE/VCC
4. I/O LINE 3
5. COMMON ANODE/GND
6. I/O LINE 4
7. I/O LINE 5
8. COMMON ANODE/GND
STYLE 23:
PIN 1. LINE 1 IN
2. COMMON ANODE/GND
3. COMMON ANODE/GND
4. LINE 2 IN
5. LINE 2 OUT
6. COMMON ANODE/GND
7. COMMON ANODE/GND
8. LINE 1 OUT
STYLE 24:
PIN 1. BASE
2. EMITTER
3. COLLECTOR/ANODE
4. COLLECTOR/ANODE
5. CATHODE
6. CATHODE
7. COLLECTOR/ANODE
8. COLLECTOR/ANODE
STYLE 25:
PIN 1. VIN
2. N/C
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
STYLE 26:
PIN 1. GND
2. dv/dt
3. ENABLE
4. ILIMIT
5. SOURCE
6. SOURCE
7. SOURCE
8. VCC
STYLE 27:
PIN 1. ILIMIT
2. OVLO
3. UVLO
4. INPUT+
5. SOURCE
6. SOURCE
7. SOURCE
8. DRAIN
STYLE 28:
PIN 1. SW_TO_GND
2. DASIC_OFF
3. DASIC_SW_DET
4. GND
5. V_MON
6. VBULK
7. VBULK
8. VIN
STYLE 29:
PIN 1. BASE, DIE #1
2. EMITTER, #1
3. BASE, #2
4. EMITTER, #2
5. COLLECTOR, #2
6. COLLECTOR, #2
7. COLLECTOR, #1
8. COLLECTOR, #1
STYLE 30:
PIN 1. DRAIN 1
2. DRAIN 1
3. GATE 2
4. SOURCE 2
5. SOURCE 1/DRAIN 2
6. SOURCE 1/DRAIN 2
7. SOURCE 1/DRAIN 2
8. GATE 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42564B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
SOIC8 NB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 0N Semiwndudw" SOIc514 NB CASE 751A503 ISSUEL DATE 03 FEB 2016 names I DIMENSIONINGANDTOLERANCING pea Asmamm 1996 2 commune DIMENSION MILLIMETERS 5 DIMENSION a DOES nor INCLUDE DAMBAR A3 PRoTRusIoN ALLOWABLE eaowausm L SHALL as I: I3 mm IN excess 0: AT i MAXIMuM MATERIAL common H 5 , E 4 DIMENSIONSDANDEDO wwuuue O I MOLD eaomuaons i L 5 MAXIMuM MOLD eeomusmmeen SIDE H H H H H H7 DErAILA 57 mLumeea mane: mm mm MAX mm MAX H25®- A L55 L75 555A 0065 AI um 525 new Dom Ail m5 525 aana Dom new” I: 555 me um em n 555 575 am 03M 45’ E 380 ODD DIED 0157 / \ \ e I27Esc DDSDBSC ‘ H 580 620 0223 0240 4' 5’9 I M L 545 I25 ems 0049 M D“ 7” DV 7’ GENERIC SOLDERING FOOTPRINT" MARKING DIAGRAM. kimfi. ux MIIIIIIIIFIIIII i113 xxxxxxxxxe ‘ |:| :l o AWLYWW I:I L E H H H H H H H xxxxx 5 Specific Dex/Ice Code Cl |:I ‘ 27 A 5 Assemny LocaIIcn iPITCH WL 5WaIeILoI ww :WorkWeek G 5 Pb—Fvee Package §§# EDD DIMENSIONS MILLIMEIERS 'Fer addmonal Inlormamn on our Pb-Free s1raIegy and seIaenng delalISL pIease download me ON SemImnducloI SoIdering and Moummg Techmques Reference Manual, SOLDEHRM/D. STYLES ON PAGE 2 firm: inIerrnaILon is geneIIc Please relel m device aaIa sheeI for acIuaI pan marking Pia-Free Inchanr, "G" or mIcrodol “ may or may neI be presem. ON SemIcunduclm and news av n|hers are hademavks aI SemIcanduclur Campanenua lnduslnes. LLC dba ON SemIcanduclar ar Ils suhsIdIarIEs In Ine mnuea sxaxes andJm mhev cmmmes ON SemIcunduclar vesewes Ihe “gm lo make changes wIInqu mnne. nahce In any pruduns hecEIn ON SEmenducmv makes nu wananIy. represenlalmn m guarantee regardmg Ine suIIahINy DI IVS pmducl: {In any pameuIay purpase nnv dues ON SEmIcunduclm assume any Mammy vasIng equI Ine sppIIcshan m use eI any pmduclnv cIrcuI| and speemcany mseIaLm5 any and an Mammy Inemang wInam hmIIa‘Iun spEDIaI cansequenhaI m LneLaenIaI damages ON SemImnduclar dues nnl eenyey any Mcense under Ms paIenI ngma Ivar Ine
SOIC14 NB
CASE 751A03
ISSUE L
DATE 03 FEB 2016
SCALE 1:1
1
14
GENERIC
MARKING DIAGRAM*
XXXXXXXXXG
AWLYWW
1
14
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = PbFree Package
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
STYLES ON PAGE 2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14 8
71
M
0.25 B M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D8.55 8.75 0.337 0.344
E3.80 4.00 0.150 0.157
A1.35 1.75 0.054 0.068
b0.35 0.49 0.014 0.019
L0.40 1.25 0.016 0.049
e1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M0 7 0 7
H5.80 6.20 0.228 0.244
h0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42565B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
SOIC14 NB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
ON Semxcunduclm and ave hademavks av Semxcanduclur Campunenls lnduslnes. uc dha ON Semxcanduclar Dr K: suhsxdmnes m xna Umled sxaxas andJm mhev cmm‘nes ON Semxcunduclar vesewes me “gm to make changes wuhum mnna. mouse to any pruduns necem ON Semanduc‘m makes nu wanamy. represenlalmn m guarantee regardmg ma sumahmly at W; manual: can any pamcu‘av purpase nnv dues ON Semumnduclm assume any Mammy snsmg mm xna aapncauan m use M any pmduclnv mum and specmcsl‘y dwsc‘axms any and an Mammy mc‘udmg wxlham hmma‘mn spema‘ cansequemm m \nmdeula‘ damages ON Semxmnduclar dues nn| away any hcense under Ms pa|EM nghls Ivar xna ngms av n|hers
SOIC14
CASE 751A03
ISSUE L
DATE 03 FEB 2016
STYLE 7:
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
STYLE 5:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 6:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
STYLE 1:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 3:
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
STYLE 2:
CANCELLED
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42565B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
SOIC14 NB
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
a a e lrademavks av Semxcunduclm Cnmvnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www menu cumrsuerguwaxem Mavkmg gm 9 www nnserm cum
www.onsemi.com
1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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