NL17SZ74 Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2011
July, 2019 Rev. 12
1Publication Order Number:
NL17SZ74/D
NL17SZ74
Single D Flip Flop
The NL17SZ74 is a high performance, full function Edge
triggered D Flip Flop, with all the features of a standard logic device
such as the 74LCX74.
Features
Designed for 1.65 V to 5.5 V VCC Operation
2.7 ns tPD at VCC = 5 V (typ)
Inputs/Outputs Overvoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 24 mA at 3.0 V
Available in US8, UDFN8 and UQFN8 Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
Q
PR
7
5
D2
CP 1
CLR
6
Q
3
VCC = 8, GND = 4
PIN ASSIGNMENT
Pin SM8/US8 UDFN8
UQFN8,
1.4x1.2
UQFN8,
1.6x1.6
1 CP CP VCC PR
2 D D CP CLR
3 Q Q D Q
4 GND GND Q GND
5 Q Q GND Q
6 CLR CLR Q D
7 PR PR CLR CP
8 VCC VCC PR VCC
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
X, XX = Specific Device Code
M = Date Code*
G= PbFree Package
UQFN8, 1.4x1.2
MQ2 SUFFIX
CASE 523AS
XM
1
18
XX MG
1
UQFN8, 1.6x1.6
MQ1 SUFFIX
CASE 523AN
UDFN8, 1.45x1.0
MU3 SUFFIX
CASE 517BZ
X M
1
X M
1
UDFN8, 1.95x1.0
MU1 SUFFIX
CASE 517CA
US8
US SUFFIX
CASE 493
XX M
G
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2
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage 0.5 to +6.5 V
VIN DC Input Voltage 0.5 to +6.5 V
VOUT DC Output Voltage (NLV) ActiveMode (High or Low State)
TriState Mode (Note 1)
PowerDown Mode (VCC = 0 V)
0.5 to VCC + 0.5
0.5 to +7.0
0.5 to +7.0
V
DC Output Voltage ActiveMode (High or Low State)
TriState Mode (Note 1)
PowerDown Mode (VCC = 0 V)
0.5 to VCC + 0.5
0.5 to +6.5
0.5 to +6.5
V
IIK DC Input Diode Current VIN < GND 50 mA
IOK DC Output Diode Current VOUT < GND 50 mA
IOUT DC Output Source/Sink Current ±50 mA
ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±100 mA
TSTG Storage Temperature Range 65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 secs 260 °C
TJJunction Temperature Under Bias +150 °C
qJA Thermal Resistance (Note 2) US8
UQFN8
UDFN8
250
208
111
°C/W
PDPower Dissipation in Still Air US8
UDFN8
UDFN8
250
1127
601
mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
VESD ESD Withstand Voltage (Note 3) Human Body Model
Charged Device Model
2000
1000
V
ILatchup Latchup Performance (Note 4) $100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tristated.
2. Measured with minimum pad spacing on an FR4 board, using 10mmby1inch, 2 ounce copper trace no air flow.
3. HBM tested to ANSI/ESDA/JEDEC JS0012017. CDM tested to EIA/JESD22C101F. JEDEC recommends that ESD qualification to
EIA/JESD22A115A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
VCC Positive DC Supply Voltage 1.65 5.5 V
VIN DC Input Voltage 0 5.5 V
VOUT DC Output Voltage ActiveMode (High or Low State)
TriState Mode (Note 1)
PowerDown Mode (VCC = 0 V)
0
0
0
VCC
5.5
5.5
TAOperating Temperature Range 55 +125 °C
Input Rise and Fall Time VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition
VCC
(V)
TA = 255C555C 3 TA 3 1255C
Units
Min Typ Max Min Max
VIH HighLevel Input
Voltage
1.65 to 1.95 0.65 VCC 0.65 VCC V
2.3 to 5.5 0.70 VCC 0.70 VCC
VIL LowLevel Input
Voltage
1.65 to 1.95 0.35 VCC 0.35 VCC V
2.3 to 5.5 0.30 VCC 0.30 VCC
VOH HighLevel Output
Voltage
VIN = VIH or VIL
IOH = 100 mA
IOH = 4 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.4
2.1
2.4
2.7
2.5
4.0
VCC 0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
VOL LowLevel Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
IIN Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 ±0.1 ±1.0 mA
IOFF Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0 1.0 10 mA
ICC Quiescent Supply
Current
VIN = VCC or GND 5.5 1.0 10 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
axwmum ropagatlon e y. CP m G or 0 Propagation Delay. PR or CER I0 0 a. 0 Semp Tm. D Io CP Recover Twme FR, CIR 101015 2.5102 3.3103 5.0105 3.3103 5.0105 101015 2.5102 3.3103 5.0105 3.3103 5.0105 101015 2.5102 3.3103 5.0105 3.3103 5.0105 101015 2.5102 3.3103 5.0105 3.3103 5.0105 101015 2.5102 3.3103 5.0105 3.3103 5.0105 101015 2.5102 3.3103 5.0105 3.3103 5.0105 101015 2.5102 3.3103 5.0105 3.3103 5.0105 c :50 0F. c :150F
NL17SZ74
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4
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol Parameter VCC (V) Test Conditions
TA = 25°C TA = 55 to 125°C
Units
Min Typ Max Min Max
fMAX Maximum Clock
Frequency
(50% Duty Cycle)
(Waveform 1)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
75 75 MHz
2.5 ± 0.2 150 150
3.3 ± 0.3 200 200
5.0 ± 0.5 250 250
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
175 175
5.0 ± 0.5 200 200
tPLH,
tPHL
Propagation Delay,
CP to Q or Q
(Waveform 1)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
6.5 12.5 13 ns
2.5 ± 0.2 3.8 7.5 8.0
3.3 ± 0.3 2.8 6.5 7.0
5.0 ± 0.5 2.2 4.5 5.0
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
3.4 7.0 7.5
5.0 ± 0.5 2.6 5.0 5.5
tPLH,
tPHL
Propagation Delay,
PR or CLR to Q or Q
(Waveform 2)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
6.5 14 14.5 ns
2.5 ± 0.2 3.8 9.0 9.5
3.3 ± 0.3 2.8 6.5 7.0
5.0 ± 0.5 2.2 5.0 5.5
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
3.4 7.0 7.5
5.0 ± 0.5 2.6 5.0 5.5
tSSetup Time, D to CP
(Waveform 1)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
6.5 6.5 ns
2.5 ± 0.2 3.5 3.5
3.3 ± 0.3 2.0 2.0
5.0 ± 0.5 1.5 1.5
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
2.0 2.0
5.0 ± 0.5 1.5 1.5
tHHold Time, D to CP
(Waveform 1)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
0.5 0.5 ns
2.5 ± 0.2 0.5 0.5
3.3 ± 0.3 0.5 0.5
5.0 ± 0.5 0.5 0.5
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
0.5 0.5
5.0 ± 0.5 0.5 0.5
tWPulse Width,
CP, CLR, PR
(Waveform 3)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
6.0 6.0 ns
2.5 ± 0.2 4.0 4.0
3.3 ± 0.3 3.0 3.0
5.0 ± 0.5 2.0 2.0
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
3.0 3.0
5.0 ± 0.5 2.0 2.0
tREC Recover Time
PR; CLR to CP
(Waveform 3)
1.8 ± 0.15 CL = 15 pF
RD = 1 MW
S1 = Open
8.0 8.0 ns
2.5 ± 0.2 4.5 4.5
3.3 ± 0.3 3.0 3.0
5.0 ± 0.5 3.0 3.0
3.3 ± 0.3 CL = 50 pF,
RD = 500 W, S1 = Open
3.0 3.0
5.0 ± 0.5 3.0 3.0
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC /2 (per flipflop). CPD is used to determine the
noload dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
DUT RT RL cL mcmdes probe and fig capamla RT IS 20UT of pulse generator nyp. f: 1 MHZ Figure 2. Test III—H—~
NL17SZ74
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5
CAPACITIVE CHARACTERISTICS (tR = tF = 3.0 ns)
Symbol Parameter Condition Typical Units
CIN Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF
COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF
CPD Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VIN = 0 V or VCC
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC
9
11
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the noload dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
Figure 2. Test Circuit
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
R1
OUTPUT
RT
2 x VCC
DUT
GND
OPEN
CL*
RL
Test Switch
Position
CL, pF RL, WR1, W
tPLH / tPHL Open See AC Characteristics Table
tPLZ / tPZL 2 x VCC 50 500 500
tPHZ / tPZH GND 50 500 500
X = Don’t Care
tr = 3 ns
tPZH tPHZ
tPZL tPLZ
Vmo
Vmo
Vmi
Figure 3. Switching Waveforms
90%
10%
90%
10%
INPUT
OUTPUT
OUTPUT
~0 V
INPUT
OUTPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
VOH
VOL
Vmo
Vmo
Vmi
tPHL tPLH
tPLH tPHL
Vmo
Vmo
Vmi Vmi
VCC
GND
VOL
VOH
VOH VY
VOL + VY
~VCC
NL17SZ74
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6
Figure 4. Setup, Hold and Recovery Time Waveforms
Vmi
Vmi
VC C
GND
CP
tSU tH
Vmi
D
tW
1/fMAX
Vmi
Vmi
Vmi
Vmi
tWtREC
PR/PR
CLR/CLR
VC C
GND
VC C
GND
90%
10%
90%
10%
tr = 3 ns
tf = 3 ns
VCC, V Vmi, V
Vmo, V
VY
, V
tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ
1.65 to 1.95 VCC/2 (VOH VOL)/2 VCC/2 0.15
2.3 to 2.7 VCC/2 (VOH VOL)/2 VCC/2 0.15
3.0 to 3.6 VCC/2 (VOH VOL)/2 VCC/2 0.3
4.5 to 5.5 VCC/2 (VOH VOL)/2 VCC/2 0.3
DEVICE ORDERING INFORMATION
Device Packages Marking
Pin 1 Orientation
(See below) Shipping
NL17SZ74USG US8 MH TBD 3000 / Tape & Reel
NLV17SZ74USG* US8 MH TBD 3000 / Tape & Reel
NL17SZ74MQ1TCG
(In Development)
UQFN8, 1.6 x 1.6, 0.5P AA Q4 3000 / Tape & Reel
NLV17SZ74MQ1TCG*
(In Development)
UQFN8, 1.6 x 1.6, 0.5P AA Q4 3000 / Tape & Reel
NL17SZ74MU1TCG
(In Development)
UDFN8, 1.95 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel
NL17SZ74MU3TCG
(In Development)
UDFN8, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel
NL17SZ74MQ2TCG
(In Development)
UQFN8, 1.4 x 1.2, 0.5P TBD TBD 3000 / Tape & Reel
NL17SZ74
(In Development)
SM8 TBD TBD 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
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7
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 49302
ISSUE B
DIM
A
MIN MAX MIN MAX
INCHES
1.90 2.10 0.075 0.083
MILLIMETERS
B2.20 2.40 0.087 0.094
C0.60 0.90 0.024 0.035
D0.17 0.25 0.007 0.010
F0.20 0.35 0.008 0.014
G0.50 BSC 0.020 BSC
H0.40 REF 0.016 REF
J0.10 0.18 0.004 0.007
K0.00 0.10 0.000 0.004
L3.00 3.20 0.118 0.126
M0 6 0 6
N5 10 5 10
P0.23 0.34 0.010 0.013
R0.23 0.33 0.009 0.013
S0.37 0.47 0.015 0.019
U0.60 0.80 0.024 0.031
V0.12 BSC 0.005 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.00760.0203 MM.
(300800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
LB
A
PG
41
58
C
K
D
SEATING
J
S
R
U
DETAIL E
V
F
H
N
R 0.10 TYP
M
Y
X
T
DETAIL E
T
M
0.10 (0.004) XY
T0.10 (0.004)
____
____
PLANE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒmm
inchesǓ
SCALE 8:1
3.8
0.015
0.50
0.0197
1.0
0.0394
0.30
0.012
1.8
0.07
/ D W SIDE VIEW Ejrwy '- ,ULJ‘LJ U, W667 EBB: QUE: BOTTOM VIEW www.cnsemi.com
NL17SZ74
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8
PACKAGE DIMENSIONS
UDFN8, 1.45x1, 0.35P
CASE 517BZ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.45 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
14
58
e/2
DIMENSIONS: MILLIMETERS
0.22
7X
0.48 8X
1.18
0.53
PITCH
0.35
1
PKG
OUTLINE
0.10 B
0.05
AC
CNOTE 3
M
M
same C PLANE £9 00 BOTTOM VIEW u: so so 035 aw : e as L 025 u use RECOMMENDED SOLDERING FOOTPRINT“ a: 'Fer additional mmrmanon on our Pb-Free s1rategy and some detawls, p‘ease down‘oad me ON Semmnuumor Semering Mounhng Techmques Reference Manual, SOLDERRM/D. www.cnsemi.com 9
NL17SZ74
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9
PACKAGE DIMENSIONS
UDFN8, 1.95x1, 0.5P
CASE 517CA
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.95 BSC
E1.00 BSC
e0.50 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
14
58
e/2
DIMENSIONS: MILLIMETERS
0.30
7X
0.49 8X
1.24
0.54
PITCH
0.50
1
PKG
OUTLINE
0.10 B
0.05
AC
CNOTE 3
M
M
E fifUi saw c“ “g? A1 C SEAYING SIDE VIEW Imus Half I nmjgyugj m m EH Bax b 61> moo c A‘ a‘ BOTTOM VIEW 0050 0 MOVE: 'Fer addmon delafls‘ me Mounmg www.cnsemi.com 1D
NL17SZ74
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PACKAGE DIMENSIONS
UQFN8, 1.4x1.2, 0.4P
CASE 523AS
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
CNOTE 3
2X 0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X 0.10 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L2
1
24
8
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.40 BSC
L1 −−− 0.15
E1.20 BSC
e0.40 BSC
L0.20 0.40
DETAIL B
DETAIL A
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.55
7X
DIMENSIONS: MILLIMETERS
1
6
L
0.45
1.61
1.40
0.40
L2 0.30 0.50
0.25
8X
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
8X
M
M
\ 2x , Q SIDE VIEW M H? ”i A1 gig j ZEIUJEl a E FEE LT? 010 c ‘ ‘ 0.05 c 69 , a Raxb )E‘tfl BOTTOM VIEW El
NL17SZ74
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PACKAGE DIMENSIONS
UQFN8, 1.6x1.6, 0.5P
CASE 523AN
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
CNOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
8X
1
35
8
DIM MIN MAX
MILLIMETERS
A0.45 0.60
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.60 BSC
L1 −−− 0.15
E1.60 BSC
e0.50 BSC
L0.35 0.45
L1
DETAIL A
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
b
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.35
7X
DIMENSIONS: MILLIMETERS
1
7
L3
0.25
1.70
1.70
0.50
L3 0.25 0.35
L3
(0.10) (0.15)
8X
0.53
8X
0.53
8X
NL17SZ74/D
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