CUI Devices Heat Sinks

Results: 188
Series
-HSBHSEHSS
Packaging
BagBoxBulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
-BGAHalf Brick DC/DC ConverterTO-218TO-218, TO-220TO-220TO-252 (DPak)TO-263 (D²Pak)
Attachment Method
-Adhesive (Not Included)Bolt OnBolt On and Board MountsBolt On and PC PinClipClip and Board MountsClip and PC PinPC PinPush PinThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
RectangularRectangular, Angled FinsRectangular, FinsSquareSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.211" (5.35mm)0.279" (7.10mm)0.303" (7.70mm)0.315" (8.00mm)0.335" (8.50mm)0.375" (9.53mm)0.394" (10.00mm)0.441" (11.20mm)0.472" (12.00mm)0.500" (12.70mm)0.512" (13.00mm)0.520" (13.20mm)
Width
0.250" (6.35mm)0.335" (8.50mm)0.375" (9.53mm)0.394" (10.00mm)0.472" (12.00mm)0.500" (12.70mm)0.504" (12.80mm)0.512" (13.00mm)0.520" (13.21mm)0.551" (14.00mm)0.625" (16.00mm)0.650" (16.50mm)
Fin Height
0.157" (4.00mm)0.177" (4.50mm)0.197" (5.00mm)0.211" (5.35mm)0.236" (6.00mm)0.256" (6.50mm)0.275" (7.00mm)0.295" (7.50mm)0.303" (7.70mm)0.315" (8.00mm)0.335" (8.50mm)0.354" (9.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C1.93W @ 75°C1.94W @ 75°C1.95W @ 75°C2.0W @ 75°C2.1W @ 75°C2.3W @ 75°C2.4W @ 75°C2.47W @ 75°C2.5W @ 75°C2.6W @ 75°C2.7W @ 75°C
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM1.40°C/W @ 200 LFM2.01°C/W @ 200 LFM2.10°C/W @ 200 LFM2.24°C/W @ 200 LFM2.29°C/W @ 200 LFM2.31°C/W @ 200 LFM2.38°C/W @ 200 LFM2.45°C/W @ 200 LFM2.50°C/W @ 200 LFM2.57°C/W @ 200 LFM2.60°C/W @ 200 LFM
Thermal Resistance @ Natural
3.45°C/W4.49°C/W4.70°C/W4.74°C/W4.85°C/W4.97°C/W5.47°C/W5.66°C/W5.77°C/W5.86°C/W6.25°C/W6.41°C/W
Material
AluminumAluminum AlloyCopperCopper Alloy
Material Finish
Black AnodizedBlue AnodizedClean FinishedTin
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Media
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
6,579
In Stock
1 : $1.70000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-06
HSS-B20-NP-06
HEATSINK TO-220 2.9W ALUMINUM
CUI Devices
1,067
In Stock
1 : $0.57000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.375" (9.52mm)
2.9W @ 75°C
7.51°C/W @ 200 LFM
26.32°C/W
Aluminum
Black Anodized
HSS-B20-NP-04
HSS-B20-NP-04
HEATSINK TO-220 6.5W ALUMINUM
CUI Devices
5,579
In Stock
1 : $0.71000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
1.750" (44.45mm)
-
0.370" (9.40mm)
6.5W @ 75°C
3.76°C/W @ 200 LFM
11.54°C/W
Aluminum
Black Anodized
HSS-B20-NPR-02
HSS-B20-NPR-02
HEATSINK TO-220 5.1W ALUMINUM
CUI Devices
2,825
In Stock
1 : $0.72000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
0.500" (12.70mm)
1.000" (25.40mm)
-
1.180" (29.97mm)
5.1W @ 75°C
4.20°C/W @ 200 LFM
14.71°C/W
Aluminum
Black Anodized
HSE-B2111-038
HSE-B2111-038
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
14,287
In Stock
1 : $0.90000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.625" (16.00mm)
-
0.354" (9.00mm)
3.8W @ 75°C
6.12°C/W @ 200 LFM
19.74°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
5,581
In Stock
1 : $1.05000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-12
HSS-B20-NP-12
HEATSINK TO-220 6.8W ALUMINUM
CUI Devices
1,928
In Stock
1 : $1.07000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
0.700" (17.80mm)
-
0.850" (21.60mm)
6.8W @ 75°C
3.47°C/W @ 200 LFM
14.33°C/W
Aluminum
Black Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,564
In Stock
1 : $1.15000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
4,030
In Stock
1 : $1.15000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSB03-141406
HSB03-141406
HEAT SINK, BGA, 14 X 14 X 6 MM
CUI Devices
2,986
In Stock
1 : $1.16000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.236" (6.00mm)
2.1W @ 75°C
15.80°C/W @ 200 LFM
35.98°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,824
In Stock
1 : $1.27000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB07-202009
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
CUI Devices
1,766
In Stock
1 : $1.32000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
3.1W @ 75°C
8.60°C/W @ 200 LFM
24.08°C/W
Aluminum Alloy
Black Anodized
HSE04-251265-1
HSE04-251265-2
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
1,462
In Stock
1 : $1.37000
Bag
Bag
Active
Top Mount
TO-218, TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.472" (12.00mm)
-
0.256" (6.50mm)
2.47W @ 75°C
16.60°C/W @ 200 LFM
30.38°C/W
Aluminum Alloy
Black Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,226
In Stock
1 : $1.40000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Aluminum Alloy
Black Anodized
HSB03-121218
HSB03-121218
HEAT SINK, BGA, 12 X 12 X 18 MM
CUI Devices
1,994
In Stock
1 : $1.43000
Tray
Tray
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.472" (12.00mm)
0.472" (12.00mm)
-
0.709" (18.00mm)
3.1W @ 75°C
9.60°C/W @ 200 LFM
24.01°C/W
Aluminum Alloy
Black Anodized
HSB09-212115
HSB09-212115
HEAT SINK, BGA, 21 X 21 X 15 MM
CUI Devices
1,388
In Stock
1 : $1.46000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.591" (15.00mm)
4.3W @ 75°C
6.00°C/W @ 200 LFM
17.39°C/W
Aluminum Alloy
Black Anodized
HSE-B254-04H
HSE-B254-04H
HEAT SINK, EXTRUSION, TO-220/TO-
CUI Devices
1,047
In Stock
1 : $1.59000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
0.650" (16.50mm)
-
0.630" (16.00mm)
4.7W @ 75°C
4.93°C/W @ 200 LFM
15.96°C/W
Aluminum Alloy
Black Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,820
In Stock
1 : $1.60000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
HSE-BX-035H-0x
HSE-B20254-035H-01
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
361
In Stock
1 : $1.65000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.378" (35.00mm)
-
0.500" (12.70mm)
5.2W @ 75°C
4.42°C/W @ 200 LFM
14.42°C/W
Aluminum Alloy
Black Anodized
HSB15-404010
HSB15-404010
HEAT SINK, BGA, 40 X 40 X 10 MM
CUI Devices
501
In Stock
1 : $1.74000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.394" (10.00mm)
6.3W @ 75°C
3.90°C/W @ 200 LFM
11.84°C/W
Aluminum Alloy
Black Anodized
HSE-BX-040H
HSE-B20254-040H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
3,575
In Stock
1 : $1.76000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
1.260" (32.00mm)
-
0.551" (14.00mm)
5.7W @ 75°C
7.74°C/W @ 200 LFM
13.16°C/W
Aluminum Alloy
Black Anodized
HSS01-B20-CP
HSS01-B20-CP
HEAT SINK, STAMPING, TO-220, 49.
CUI Devices
1,060
In Stock
1 : $1.77000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular
1.941" (49.31mm)
1.900" (48.26mm)
-
0.950" (24.13mm)
9.9W @ 75°C
3.70°C/W @ 200 LFM
7.59°C/W
Aluminum Alloy
Black Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
750
In Stock
1 : $1.79000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.319" (33.50mm)
1.319" (33.50mm)
-
0.315" (8.00mm)
4.94W @ 75°C
5.30°C/W @ 200 LFM
15.19°C/W
Aluminum Alloy
Black Anodized
HSB14-353518
HSB14-353518
HEAT SINK, BGA, 35 X 35 X 18 MM
CUI Devices
791
In Stock
1 : $1.82000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.709" (18.00mm)
8.4W @ 75°C
3.60°C/W @ 200 LFM
8.97°C/W
Aluminum Alloy
Black Anodized
HSE-BX-04H-01
HSE-B250-04H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
2,216
In Stock
1 : $1.84000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.378" (35.00mm)
-
1.000" (25.40mm)
8.0W @ 75°C
3.26°C/W @ 200 LFM
13.60°C/W
Aluminum Alloy
Black Anodized
Showing
of 188

CUI Devices Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.