Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSB04-171706 HEAT SINK, BGA, 17 X 17 X 6 MM Same Sky (Formerly CUI Devices)	1,692 In Stock	1 : $1.25000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.236" (6.00mm)	2.5W @ 75°C	13.10°C/W @ 200 LFM	29.73°C/W	Aluminum Alloy	Black Anodized
HSB31-212105 HEAT SINK, BGA, 21 X 21 X 5 MM Same Sky (Formerly CUI Devices)	1,554 In Stock	1 : $1.31000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.197" (5.00mm)	3.0W @ 75°C	9.90°C/W @ 200 LFM	25.33°C/W	Aluminum Alloy	Black Anodized
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM Same Sky (Formerly CUI Devices)	2,275 In Stock	1 : $1.35000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices)	3,397 In Stock	1 : $1.58000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
HSB06-181810 HEAT SINK, BGA, 18 X 18 X 10 MM Same Sky (Formerly CUI Devices)	745 In Stock	1 : $1.61000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.709" (18.00mm)	0.709" (18.00mm)	-	0.394" (10.00mm)	3.2W @ 75°C	18.80°C/W @ 200 LFM	23.68°C/W	Aluminum Alloy	Black Anodized
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM Same Sky (Formerly CUI Devices)	1,927 In Stock	1 : $2.01000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy	Black Anodized
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 Same Sky (Formerly CUI Devices)	1,151 In Stock	1 : $2.20000 Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy	Black Anodized
HSB23-232325 HEAT SINK, BGA, 23 X 23 X 25 MM Same Sky (Formerly CUI Devices)	345 In Stock	1 : $2.32000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.984" (25.00mm)	6.13W @ 75°C	3.80°C/W @ 200 LFM	12.23°C/W	Aluminum Alloy	Black Anodized
HSB15-404010 HEAT SINK, BGA, 40 X 40 X 10 MM Same Sky (Formerly CUI Devices)	722 In Stock	1 : $2.45000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	6.3W @ 75°C	3.90°C/W @ 200 LFM	11.84°C/W	Aluminum Alloy	Black Anodized
HSB14-353518 HEAT SINK, BGA, 35 X 35 X 18 MM Same Sky (Formerly CUI Devices)	442 In Stock	1 : $2.54000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.709" (18.00mm)	8.4W @ 75°C	3.60°C/W @ 200 LFM	8.97°C/W	Aluminum Alloy	Black Anodized
HSB35-272725 HEAT SINK, BGA, 27 X 27 X 25 MM, Same Sky (Formerly CUI Devices)	289 In Stock	1 : $2.86000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.984" (25.00mm)	8.6W @ 75°C	2.90°C/W @ 200 LFM	8.74°C/W	Aluminum Alloy	Black Anodized
HSB20-353525 HEAT SINK, BGA, 35 X 35 X 25 MM Same Sky (Formerly CUI Devices)	441 In Stock	1 : $3.18000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.984" (25.00mm)	11.3W @ 75°C	2.70°C/W @ 200 LFM	6.65°C/W	Aluminum Alloy	Black Anodized
HSB21-454515 HEAT SINK, BGA, 45 X 45 X 15 MM Same Sky (Formerly CUI Devices)	259 In Stock	1 : $3.41000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.772" (45.00mm)	1.772" (45.00mm)	-	0.591" (15.00mm)	9.9W @ 75°C	2.80°C/W @ 200 LFM	7.56°C/W	Aluminum Alloy	Black Anodized
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM Same Sky (Formerly CUI Devices)	784 In Stock	1 : $3.55000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.709" (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy	Black Anodized
HSB30-373710 HEATSINK BGA 6.6W ALUM Same Sky (Formerly CUI Devices)	1,182 In Stock	1 : $3.70000 Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.472" (37.39mm)	1.472" (37.39mm)	-	0.394" (10.00mm)	6.6W @ 75°C	4.20°C/W @ 200 LFM	15.10°C/W	Aluminum Alloy	Black Anodized
HSB41-303014P HEAT SINK, BGA, 30 X 30 X 10 MM, Same Sky (Formerly CUI Devices)	207 In Stock	1 : $3.73000 Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.551" (14.00mm)	5.9W @ 75°C	4.30°C/W @ 200 LFM	12.63°C/W	Aluminum Alloy	Black Anodized
HSB38-707025P HEAT SINK, BGA, 70 X 70 X 25 MM, Same Sky (Formerly CUI Devices)	275 In Stock	1 : $11.97000 Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	2.756" (70.00mm)	2.756" (70.00mm)	-	0.984" (25.00mm)	21.7W @ 75°C	1.20°C/W @ 200 LFM	3.45°C/W	Aluminum Alloy	Black Anodized
HSB26-343408 HEAT SINK, BGA, 33.5 X 33.5 X 8 Same Sky (Formerly CUI Devices)	1,159 In Stock	1 : $1.93000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.319" (33.50mm)	1.319" (33.50mm)	-	0.315" (8.00mm)	4.94W @ 75°C	5.30°C/W @ 200 LFM	15.19°C/W	Aluminum Alloy	Black Anodized
HSB13-303014 HEAT SINK, BGA, 30.7 X 30.7 X 14 Same Sky (Formerly CUI Devices)	703 In Stock	1 : $2.11000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.209" (30.70mm)	1.209" (30.70mm)	-	0.551" (14.00mm)	6.1W @ 75°C	4.70°C/W @ 200 LFM	12.36°C/W	Aluminum Alloy	Black Anodized
HSB27-434316 HEAT SINK, BGA, 43.1 X 43.1 X 16 Same Sky (Formerly CUI Devices)	625 In Stock	1 : $4.27000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.697" (43.10mm)	1.697" (43.10mm)	-	0.650" (16.51mm)	8.98W @ 75°C	2.80°C/W @ 200 LFM	8.35°C/W	Aluminum Alloy	Black Anodized
HSB34-282811 HEAT SINK, BGA, 28 X 28 X 11.2 M Same Sky (Formerly CUI Devices)	473 In Stock	1 : $1.74000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.102" (28.00mm)	1.102" (28.00mm)	-	0.441" (11.20mm)	5.0W @ 75°C	5.10°C/W @ 200 LFM	15.05°C/W	Aluminum Alloy	Black Anodized
HSB32-232318 HEAT SINK, BGA, 23 X 23 X 18 MM, Same Sky (Formerly CUI Devices)	445 In Stock	1 : $2.02000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	5.9W @ 75°C	4.40°C/W @ 200 LFM	12.67°C/W	Aluminum Alloy	Black Anodized
HSB33-272710 HEAT SINK, BGA, 27 X 27 X 10 MM, Same Sky (Formerly CUI Devices)	836 In Stock	1 : $2.13000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.394" (10.00mm)	4.4W @ 75°C	5.30°C/W @ 200 LFM	17.22°C/W	Aluminum Alloy	Black Anodized
HSB36-353510 HEAT SINK, BGA, 35 X 35 X 10 MM, Same Sky (Formerly CUI Devices)	337 In Stock	1 : $2.84000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.394" (10.00mm)	5.9W @ 75°C	4.30°C/W @ 200 LFM	12.72°C/W	Aluminum Alloy	Black Anodized
HSB39-252509P HEAT SINK, BGA, 25 X 25 X 9 MM, Same Sky (Formerly CUI Devices)	242 In Stock	1 : $3.73000 Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.354" (9.00mm)	4.3W @ 75°C	6.30°C/W @ 200 LFM	17.53°C/W	Aluminum Alloy	Black Anodized

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Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.

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