Adhesives, Epoxies, Greases, Pastes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature
TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	203 In Stock	1 : $9.46000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
65-00-GEL75-0010 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	201 In Stock	1 : $75.73000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
SILV5-THERMAL-PASTE THERMAL PASTE, PACK OF 5 SYRINGE StarTech.com	396 In Stock 55 Factory	1 : $49.99000 Bag	-	Bag	Active	Silicone Compound	1.5 gram Syringe	-22°F ~ 365°F (-30°C ~ 180°C)	-	3.20W/m-K	-	24 Months	-22°F ~ 365°F (-30°C ~ 180°C)
8617A-10ML PREMIUM THERMAL PASTE, 3 W/M.K MG Chemicals	28 In Stock	1 : $20.30000 Box	8617A	Box	Active	Non-Silicone Grease	10 ml Tube	-	-	3.00W/m-K	-	60 Months	50°F ~ 86°F (10°C ~ 30°C)
TC2-10G HEAT SINK COMPOUND - GREY ULTRA Chip Quik Inc.	24 In Stock	1 : $34.90000 Bulk	-	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	4.30W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
TC4-10G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	31 In Stock	1 : $54.31000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
8617A-3ML PREMIUM THERMAL PASTE, 3 W/M.K MG Chemicals	0 In Stock Check Lead Time	1 : $9.65000 Box	8617A	Box	Active	Non-Silicone Grease	3 ml Tube	-58°F ~ 257°F (-50°C ~ 125°C)	-	3.00W/m-K	-	60 Months	50°F ~ 86°F (10°C ~ 30°C)
TH949-1-50G-2JAR SILICONE THERMAL PUTTY (2 PACKS) Penchem Technologies Sdn Bhd	0 Marketplace	Active	TH949-1	Bottle	Active	Silicone Putty	50 gram Jar	-40°F ~ 392°F (-40°C ~ 200°C)	Gray	7.00W/m-K	Low Outgassing	18 Months	-

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Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.