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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
28-516-11
28-516-11
CONN IC DIP SOCKET ZIF 28POS GLD
Aries Electronics
4
In Stock
1 : $24.29000
Bulk
Bulk
ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
40-516-11
40-516-11
CONN IC DIP SOCKET ZIF 40POS GLD
Aries Electronics
8
In Stock
1 : $30.63000
Bulk
Bulk
ActiveDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
24-516-11
24-516-11
CONN IC DIP SOCKET ZIF 24POS GLD
Aries Electronics
0
In Stock
15 : $20.54133
Bulk
Bulk
ActiveDIP, ZIF (ZIP)24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
CONN IC DIP SOCKET ZIF 24POS GLD
24-516-11S
CONN IC DIP SOCKET ZIF 24POS GLD
Aries Electronics
0
In Stock
15 : $20.54133
Bulk
Bulk
ActiveDIP, ZIF (ZIP)24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
CONN IC DIP SOCKET ZIF 24POS GLD
24-516-11M
CONN IC DIP SOCKET ZIF 24POS GLD
Aries Electronics
0
In Stock
13 : $20.54154
Bulk
Bulk
ActiveDIP, ZIF (ZIP)24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
CONN IC DIP SOCKET ZIF 28POS GLD
28-516-11S
CONN IC DIP SOCKET ZIF 28POS GLD
Aries Electronics
0
In Stock
13 : $22.08385
Bulk
Bulk
ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
CONN IC DIP SOCKET ZIF 40POS GLD
40-516-11S
CONN IC DIP SOCKET ZIF 40POS GLD
Aries Electronics
3
In Stock
1 : $30.63000
Bulk
Bulk
ActiveDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
40-516-10
40-516-10
CONN IC DIP SOCKET ZIF 40POS TIN
Aries Electronics
0
In Stock
Obsolete
Bulk
ObsoleteDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
24-516-10
24-516-10
CONN IC DIP SOCKET ZIF 24POS TIN
Aries Electronics
0
In Stock
Obsolete
Bulk
ObsoleteDIP, ZIF (ZIP)24 (2 x 12)0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
28-516-10
28-516-10
CONN IC DIP SOCKET ZIF 28POS TIN
Aries Electronics
0
In Stock
Obsolete
Bulk
ObsoleteDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
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Sockets for ICs, Transistors


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.