ISSI's 4 Gb DRAM offers long lifecycle support and world-class quality in a 96-ball BGA package

Image of ISSI's DDR4 DRAM ISSI's 4 Gb DDR4 device is organized as 256 Mb x 16, packaged in a 96-ball BGA, and operates at 1.2 V. ISSI's DDR4 provides the low power, high bandwidth, high performance, and high reliability needed for leading edge networking, automotive, and industrial systems. This is the first DDR4 DRAM from ISSI and adds to ISSI's extensive selection of DRAMs. ISSI is offering the DDR4 with the long lifecycle product support required by customer applications in automotive, industrial, communications, and other market segments.

  • Standard voltage: VDD = VDDQ = 1.2 V, VPP = 2.5 V
  • Data integrity
    • Auto self-refresh (ASR) by DRAM built-in TS
    • Auto-refresh and self-refresh modes
  • DRAM access bandwidth
    • Separated IO gating structures by Bank Group
    • Self-refresh abort
    • Fine granularity refresh
  • Reliability and error handling
    • Command/address parity
    • Data bus write CRC
    • MPR readout
    • Boundary scan (x16)
  • Power saving and efficiency
    • POD with VDDQ termination
    • Command/address latency (CAL)
    • Maximum power saving
    • Low-power auto self-refresh (LPASR)
  • Signal synchronization
    • Write leveling via MR settings
    • Read leveling via MPR
  • Signal integrity
    • Internal VREFDQ training
    • Read preamble training
    • Gear down mode
    • Per DRAM addressability
    • Configurable DS for system compatibility
    • Configurable on-die termination
    • Data bus inversion (DBI)
    • ZQ calibration for DS/ODT impedance accuracy via external ZQ pad (240 ohms ±1%)
  • Operating temperature ranges
    • Commercial (Tc = 0°C to +95°C)
    • Industrial (Tc = -40°C to +95°C)
    • Automotive, A1 (Tc = -40°C to +95°C)
    • Automotive, A2 (Tc = -40°C to +105°C)
    • Automotive, A3 (Tc = -40°C to +125°C)
  • Automotive
    • Infotainment
    • Telematics
    • Driver information systems
  • Industrial
    • Human machine interface (HMI)
    • Embedded computing
  • Telecom/networking
    • SDN and NFV
    • Access and aggregation nodes
    • Switches and routers
    • Packet optical transport
    • Network storage (PON OLT, DSLAM, CMTS, and wireless)


ImageManufacturer Part NumberDescriptionOperating TemperatureAvailable QuantityView Details
4G DDR4 256MX16 BGA(96)IS43QR16256B-083RBL4G DDR4 256MX16 BGA(96)0°C ~ 95°C (TC)362 - ImmediateView Details
4G DDR4 256MX16 BGA(96)IS43QR16256B-083RBLI4G DDR4 256MX16 BGA(96)-40°C ~ 95°C (TC)469 - ImmediateView Details
Published: 2019-08-14