XCede High-Perf Backplane Conn Syst Datasheet by Amphenol ICC (FCI)

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XCEDE® BACKPLANE
CONNECTOR SYSTEM
OVERVIEW
XCede® connector platform is designed to provide
headroom for high-speed, serial data rates demanded
by data centers and service provider networks. The use
of polymers in a resonance-damping shield enables low
crosstalk across a wide frequency range.
XCede® connectors also address requirements for high
linear signal density at the backplane and daughter card
interface. Complementary guide and power modules are
also included in the product range. An organizer can be
used to combine groups of right-angle signal, guide and
power modules establishing an integrated daughter card
connector or monoblock.
The XCede® backplane header system provides ruggedness
and long-term reliability required by today’s systems. The
wide ground contacts feature a stiffness-enhancing rib
and are advanced ahead of the signals for robustness and
signal pin protection.
FEATURES & BENEFITS
High-speed backplane system
Resonance dampening shield aids in reduction of
crosstalk resonances
Two ground vias between differential pairs allow
elongated anti-pads to improve impedance control
Optional short compliant pins permit deeper back-drilling
and dual diameter vias to enhance return loss performance
Intermate electrically and mechanically interchangeable
equivalency as a licensed second source to Amphenol TCS
Daughter card monoblocks combine signal, guide and
power modules to simplify board application
TARGET MARKETS/APPLICATIONS
• Communications
Switches
Networking
Access
Transport
Wireless
• Data
Servers
Storage Systems
• Industry
Medical
Test & Measurement
BACKPLANE CONNECTORS
XCEDE® BACKPLANE CONNECTOR SYSTEM
TECHNICAL INFORMATION
MATERIALS
Contacts: Copper alloy
Platings:
Performance based plating at separable interface
(Telecordia GR-1217 CORE Central Office)
Housings: High temperature thermoplastic, UL94-V0
Wafer organizer: Stainless steel
ELECTRICAL PERFORMANCE
Contact resistance: 10m max. change from initial
reading after environmental exposure
Current rating (with < 30 ºC temperature
rise above ambient):
Signal contact: 1 A/contact
Wide ground contact: 2 A/contact
Power contact: 6 A/blade
Insertion loss performance: see SI Report Reference
Crosstalk performance: see SI Report Reference
MECHANICAL PERFORMANCE
Signal mating force: 0.74 N max. per contact
Signal unmating force: 0.15 N min. per contact
Power mating force: 0.98 N max. per blade
Power unmating force: 0.44 N min. per blade
Press-fit insertion force: 36 N max. per tail
SPECIFICATIONS
• XCEDE® product specification: GS-12-588
• XCEDE® application specification: GS-20-121
• XCEDE® power product specification: GS-12-0989
• XCEDE® power product specification: GS-20-0342
• XCEDE® HD product specification: GS-12-9
• XCEDE® HD application specification: GS-20-34
Telcordia GR-1217-CORE Central Office (EIA-364-21)
APPROVALS AND CERTIFICATIONS
UL and CSA approvals
APPLICATIONS
For more information,
please contact: Communications@fci.com
or visit us at www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
XCEDE® BACKPLANE CONNECTOR SYSTEM
XCEDE® ACCESSORIES
For more information,
please contact: Communications@fci.com
or visit us at www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
Xcede® accessories include vertical power, right-angle power, guide modules and end cap.
Power
Right Angle
End Cap Signal
Right
Angle
Guide
Module
Signal
Vertical
Power
Vertical
DAUGHTER CARD
Additional Features
In addition to providing individual right-angle receptacle
signal modules, customized groupings of right-angle
signal, guidance and power modules can be attached to a
single wafer organizer to form an integrated daughter
card connector.
BACKPLANE
Additional Features
• The wide ground contacts in the vertical backplane
headers feature a stiffening rib that extends near the tip
of the contact and are advanced ahead of the signal
contacts for robustness and signal pin protection.
STANDARD EON
.57mm DRILL
Small (Micro) EON
.45mm DRILL
Small (Micro) EON
.45mm DRILL
2 Options
2 Options
Receptacle
STANDARD EON
.55mm DRILL
XCEDE® BACKPLANE CONNECTOR SYSTEM
XCEDE® POWER SYSTEM
150 grams normal force nominal
3 levels of sequencing: 4.5mm, 6.0mm, 7.5mm
POWER RATING
Modular construction gives an effective current density of
8.6amps per mm.
Designed to meet UL 1977 CAF (Conductive Anodic
Filament) spacing requirement
Housing: High-temperature thermoplastic, UL94-V0
Wafers: High-temperature thermoplastic, UL94-V0
Contacts: High-performance copper alloy
Platings: Performance based plating, at separable
interface GR-1217-CORE (Central Office)
XCEDE® VERTICAL POWER PART NUMBER MATRIX
For more information,
please contact: Communications@fci.com
or visit us at www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
1 0 0 9 1 9 3 0 1 X X 0 0 LF
Wipe Distance (mm) Number
4.5 1
6.0 2
7.5 3
Column Number
1 1
2 2
3 3
Compliant Version Number
Performance based
plating for Telcordia
Central Office (CO)
1
Lead Free
Height Number of Columns Differential pairs per column Part Number
Standard 1,2 or 3 4 10091830
Less 1 mm 1,2 or 3 4 10091831
Less 3 mm 1,2 or 3 4 10115237
Standard 1,2 or 3 6 10115240
Less 1 mm 1 6 10115241
--IIIIIII—
XCEDE® BACKPLANE CONNECTOR SYSTEM
PART NUMBERS
For more information,
please contact: Communications@fci.com
or visit us at www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
Lead-free part numbers are listed in the table; tin-lead versions are available upon request. Header part numbers shown
provide 2mm signal contact wipe length; versions providing 3mm wipe length are also available. Customization of Monoblocks
are also available. Contact your local FCI sales representative for further information.
XCEDE® & XCEDE® HD PART NUMBER MATRIX
1 0 0 9 1 7 6 7 X 0 C X 0 D LF
Plating by Telcordia Application Letter
CO(LF) D
Lead Free
Module
Description
Letter Designation
Represented in Dash Number
Base
Module
Left Polarizing
Guidance
Module
(See Sheet 3)
J A B C D E F G H
Left Polarizing
Guidance
Module
(See Sheet 4)
Y P Q R S T U V W
Open Module
(Two Wall)
(See Sheet 2)
0 (ZERO)
Left Wall
Module
(See Sheet 5)
L
Right Wall
Module
(See Sheet 6)
M
Four Wall
Module
(See Sheet 7)
1
No
Key
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
No
Key
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
BAH
DEF
Signal Contact Mating Wipe Length Number
Wide Ground Compliant Pin Drill Size
2 4 Ø0.55 [0.0217in.] 1
3 4 Ø0.55 [0.0217in.] 2
2 4 Ø0.45 [0.0177in.] 3
3 4 Ø0.45 [0.0177in.] 4
2 3 Ø0.55 [0.0217in.] 5
3 3 Ø0.55 [0.0217in.] 6
Signal Contact Mating Wipe Length Number
Wide Ground Compliant Pin Drill Size
2 3 Ø0.45 [0.0177in.] 7
3 3 Ø0.45 [0.0177in.] 8
Description Letter
6-Column Differential Signal Module C
Hfl
XCEDE® BACKPLANE CONNECTOR SYSTEM
For more information,
please contact: Communications@fci.com
or visit us at www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
BPLXCEDE0115EA4
XCEDE® HD Vertical Header
Col Designator Number of Columns Differential pairs per column Part Number
X0J 4 3 10119126
X0C 6 3 10119128
X0E 8 3 10120124
X0J 4 4 10120126
X0C 6 4 10120128
X0E 8 4 10115091
X0J 4 6 10120130
X0C 6 6 10119130
X0E 8 6 10120132
XCEDE® Right Angle Receptacle
Col Designator Number of Columns Differential pairs per column Part Number
- 4 4 10091844
- 6 4 10091799
- 8 4 10091812
- 4 6 10105004
- 6 6 10105007
- 8 6 10105010
XCEDE® HD Vertical Header
Col Designator Number of Columns Differential pairs per column Part Number
X0J 4 2 10114868
X0C 6 2 10113947
X0E 8 2 10113949
X0J 4 3 10119187
X0C 6 3 10119189
X0E 8 3 10119191
X0J 4 4 10091836
X0C 6 4 10091767
X0E 8 4 10091777
X0J 4 6 10114508
X0C 6 6 10104997
X0E 8 6 10104999

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