10-07 Prod Spec Datasheet by Molex

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molex 2759 6459 41572 ’ 4089 8088 KK 254 WEB PAGE TABLE OF CONTENTS REVISION: ECM INFORMATION: TITLE: SHEET No. EC No: M nlnc/nn DOCUMENT NUMBER: M M CREATED I REVISED BY: CHECKED BY: APPROVED BY: — m m PS-10-07 _
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KK 254 / .100
WIRE-TO-BOARD
BOARD-TO-BOARD
CONNECTOR SYSTEM
Crimp Terminal
Crimp Terminal
Series: 2759, 6459
Series: 41572
Crimp Terminal
Crimp Terminal
Series: 4089
Series: 8088
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Crimp Housing
PCB Connector
Series: 2695
Series: 4455
Vertical Header
RA Header
Series: 4030
Series: 4094
Vertical Header with Friction Lock
Right Angle Header with Friction Lock
Series: 6373
Series: 7478
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Vertical Header with Friction Lock
Right Angle Header with Friction Lock
Series: 6410
Series: 7395
Header, Vertical, Breakaway with
Friction Lock
Header, RA, Breakaway with Friction
Lock
Series: 42227
Series: 42228
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Header, Vertical, Breakaway
Header, RA, Breakaway
Series: 42375
Series: 42376
Header, Right-Angle, Breakaway,
Surface Mount Compatible
Series: 42377
molex mm Loco KK 254 WEB PAGE Locomooooooooooxlxlxlmmmma) TABLE OF CONT NTS REVISION. EC No. DATE. nlnE/n/I ECM \NFORMATION. TITLE. SHEET Nu. DOCUMENT NUMBER. PS-10-07 PART CREATED / REVTSED BY. CHECKED BY. APPROVED EV.
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Table of Contents
1.0 SCOPE .................................................................................................................................................. 6
2.0 PRODUCT DESCRIPTION .................................................................................................................... 6
2.1 PRODUCT NAME AND SERIES NUMBER (S) .................................................................................. 6
2.2 DIMENSIONS, MATERIALS, PLATING AND MARKINGS ................................................................. 6
2.3 SAFETY AGENCY APPROVALS....................................................................................................... 6
3.0 APPLICABLE DOCUMENTS AND SPECIFICATION ............................................................................. 7
3.1 MOLEX DOCUMENTS ...................................................................................................................... 7
3.2 INDUSTRY DOCUMENTS ................................................................................................................. 7
4.0 ELECTRICAL PERFORMANCE RATINGS ........................................................................................... 8
4.1 VOLTAGE .......................................................................................................................................... 8
4.2 CURRENT AND APPLICABLE WIRES .............................................................................................. 8
4.3 TEMPERATURE (AMBIENT +30°C TEMP) ....................................................................................... 8
4.4 DURABILITY ...................................................................................................................................... 8
5.0 QUALIFICATION ................................................................................................................................... 8
6.0 PERFORMANCE ................................................................................................................................... 9
6.1 ELECTRICAL PERFORMANCE ........................................................................................................ 9
6.2 MECHANICAL PERFORMANCE ..................................................................................................... 10
6.3 ENVIRONMENTAL PERFORMANCE .............................................................................................. 11
7.0 SOLDER INFORMATION .................................................................................................................... 12
7.1 SOLDER PROCESS TEMPERATURES .......................................................................................... 12
8.0 PACKAGING ....................................................................................................................................... 13
9.0 CABLE TIE AND/ OR TWIST LOCATION ............................................................................................ 13
1 2 2759, 6459 41572, 4809, 8088 2695 4455 4030, 4094 6373, 7478, 6410, 7395, , 42227 42228 42375, 42376, 42377 CCUS W TABLE OF CONTENTS REVISION. ECM \NFORMATION. TITLE. SHEET NO. EC No. DATE. 7 mum DOCUMENT NUMBER. M M CREATED / REV‘SED BV. CHECKED BV. APPROVED EV. WPE PART PS-10-07 A
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1.0 SCOPE
This Product Specification covers the 2.54 mm (.100 inch) centerline (pitch) 0.64 mm (.025) square pin headers
when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 30 AWG
wire using crimp technology.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBER (S)
Description
Series
Crimp Terminals
2759, 6459, 41572, 4809, 8088
Crimp Housings
2695
PCB Connectors
4455
Headers
4030, 4094, 6373, 7478, 6410, 7395, 42225, 42226, 42227, 42228,
42375, 42376, 42377, 4380, 42009, 43009, 46607
Other products conforming to this specification are noted on the individual drawings
2.2 DIMENSIONS, MATERIALS, PLATING AND MARKINGS
Terminal Material: Brass or Phos. Bronze (for Max performance use phos. bronze material.)
Housing: Nylon or Polyester
Pins: Brass or Phos. Bronze
For more information on dimensions, materials, and plating see the individual drawings.
RoHS compliant materials*.
*Refer to the “Product Environmental Compliance” section in Molex.com to know the individual PN RoHS
compliance status
2.3 SAFETY AGENCY APPROVALS
2.3.1 UL File Number: E29179
2.3.2 File Number*: LR19980
molex KK 254 WEB PAGE Molex Quality Crimpinq Handbook Order No. 6380070029 Molex So‘derabi‘ily Sgecificalion SMESVW 52 Molex Heat Resistance Sgecificalion A874000075013 Molex Moisture Technica‘ Advisory ASr454997001 Molex Package Handling Sgeciflcation 4549901007PK TABLE OF CONTENTS PS-10-07 REVISION. ECM \NFORMATION. TITLE. SHEET Nu. EC No. DATE. nlnE/n/I DOCUMENT NUMBER. T% PaLRCT CREATED / REV‘SED BY. CHECKED BY. APPROVED EV.
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SERIES
Agency Voltage
Rating (AC RMS or
DC)
Agency Current
Rating (Single
Circuit) (Amps)
Agency
Temperature
Rating (°C)
UL
CSA
UL
CSA
UL
2695
500 V AC
600 V DC
250
-
2.5
105°C
4455
600
250
-
2.5
105°C
4030
600
250
-
2.5
105°C
4094
600
250
-
2.5
105°C
6373
600
250
-
2.5
105°C
7478
600
250
-
2.5
105°C
6410
600
250
-
2.5
105°C
7395
600
250
-
2.5
105°C
42225
600
250
-
2.5
105°C
42226
600
250
-
2.5
105°C
42227
600
250
-
2.5
105°C
42228
600
250
-
2.5
105°C
42375
600
250
-
2.5
120°C
42376
600
250
-
2.5
120°C
42377
600
250
-
2.5
120°C
3.0 APPLICABLE DOCUMENTS AND SPECIFICATION
3.1 MOLEX DOCUMENTS
See series specific sales drawings and the other sections of this specifications for the necessary
referenced documents and specifications.
Cosmetic Specification PS-45499-002
Molex Quality Crimping Handbook Order No. 63800-0029
Molex Solderability Specification SMES-152
Molex Heat Resistance Specification AS-40000-5013
Molex Moisture Technical Advisory AS-45499-001
Molex Package Handling Specification 454990100-PK
ATS Application Tooling Specification*
*Application Tooling Specification for terminals is not provided in this document. ATS for terminals can be available
from respective terminal part number page in Molex.com
3.2 INDUSTRY DOCUMENTS
EIA-364-1000.01
UL-1977
CSA STD. C22.2 NO. 182.3-M1987
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4.0 ELECTRICAL PERFORMANCE RATINGS
4.1 VOLTAGE
500 Volts AC (or 600 Volts DC)
4.2 CURRENT AND APPLICABLE WIRES
(Current is dependent on connector size, contact material, plating, ambient temperature, printed circuit
board characteristics and related factors. Actual current rating is application dependent and should be
evaluated for each application.)
AWG
Amps (Max.)
Outside Insulation Diameter
22
4.00
See Drawings
24
3.75
See Drawings
26
3.50
See Drawings
28
3.00
See Drawings
30
2.50
See Drawings
Note: current ratings are for a single circuit, based on not exceeding 30°C temperature rise
4.3 TEMPERATURE (AMBIENT +30°C TEMP)
Brass Terminals
Phos Bronze Terminals
Operating Temperature
-40°C to +80°C*
-40°C to +105°C*
Non-Operating Temperature
-40°C to +105°C**
-40°C to +105°C
*including terminal temperature rise.
**parts not mated
4.4 DURABILITY
Tin / Gold plated: 25 mating cycles
As tested in accordance with EIA-364-1000.01 test method (see Sec. 6.2 of this specification).
5.0 QUALIFICATION
Laboratory conditions and sample selection are in accordance with EIA-364-1000.01
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6.0 PERFORMANCE
6.1 ELECTRICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Contact
Resistance
(Low Level)
Mate connectors: apply a maximum voltage
of 20 mV and a current of 100 mA.
10 milliohms
MAXIMUM
[initial]
Contact
Resistance of
Wire Termination
(Low Level)
Terminate the applicable wire to the terminal
and measure wire using a voltage of 20 mV
and a current of 100 mA.
2 milliohms
MAXIMUM
[initial]
Insulation
Resistance
Unmate & unmount connectors: apply a
voltage of 500 VDC between adjacent
terminals and between terminals to ground.
1000 Megohms
MINIMUM
Dielectric
Withstanding
Voltage
Unmate connectors: apply a voltage of {two
times the rated voltage plus 1000 volts} VAC
for 1 minute between adjacent terminals and
between terminals to ground.
No breakdown
Capacitance
Measure between adjacent terminals at 1
MHz.
2 picofarads
MAXIMUM
Temperature
Rise
(via Current Cycling)
Mate connectors: measure the temperature
rise at the rated current after:
1) 96 hours (steady state)
2) 240 hours (45 minutes ON and 15
minutes OFF per hour)
3) 96 hours (steady state)
Temperature rise:
+30°C MAXIMUM
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6.2 MECHANICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Connector Mate
and
Unmate Forces
Per circuit when mated to an .025 Sq. pin
header without friction lock.
Mate and unmate connector (male to female)
at a rate of 25 ± 6 mm (1 ± ¼ inch) per
minute.
4.9 N (1.1 lbf)
MAXIMUM insertion force
&
0.56 N (0.125 lbf)
MINIMUM withdrawal force
Connector Mate
and
Unmate Forces
46856 series only
Per circuit when mated to a .093 thick PCB
Mate and unmate connector at a rate of 25 ±
6 mm (1 ± ¼ inch) per minute.
6.67 N (1.5 lbf)
MAXIMUM insertion force
&
0.56 N (0.125 lbf)
MINIMUM withdrawal force
Terminal
Retention Force
(in Housing)
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm (1 ± ¼ inch)
per minute. (Forces will change with platings
and materials.)
17.8 N (4.0 lbf)
MINIMUM withdrawal force
Terminal
Insertion Force
(into Housing)
Apply an axial insertion force on the terminal
at a rate of 25 ± 6 mm (1 ± ¼ inch) per
minute. (Forces will change with platings and
materials.)
11.12 N (2.5 lbf)
MAXIMUM insertion force
Durability
Mate connectors up to 25 cycles at a
maximum rate of 10 cycles per minute prior to
Environmental Tests.
10 milliohms MAXIMUM
(change from initial)
Vibration
(Sine)
Mate connectors and vibrate per EIA 364-28,
test condition I.
10 milliohms MAXIMUM
(change from initial) &
Discontinuity < 1 microsecond
Shock
(Mechanical)
Mate connectors and shock at 50 g's with ½
sine wave (11 milliseconds) shocks in the ±X,
±Y,±Z axes (18 shocks total).
10 milliohms MAXIMUM
(change from initial]) &
Discontinuity < 1 microsecond
Wire
Pullout Force
(Axial)
Apply an axial pullout force on the wire at a
rate of 25 ± 6 mm (1 ± ¼ inch) per minute.
(For maximum performance use Molex
application tooling with stranded tinned
copper wire)
Wire pullout force depends on
crimp tooling. See relevant
Molex Application Tooling
Specification for requirements.
Normal
Force
Apply a perpendicular force.
2.94 N (300 grams) average
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Kinked PC Pin
Insertion Force
(into PCB Hole)
Apply an axial insertion force on pins at a rate
of 25 ± 6 mm (1 ± ¼ inch) per minute.
Number
of kinked
pins
Maximum
Insertion
force (per
pin)
Average
Insertion
force
(per pin)
2
44.0 N
(9.9 lbf)
15.1N
(3.4 lbf)
4
21.4 N
(4.8 lbf)
9.8 N
(2.2 lbf)
6
18.2 N
(4.1 lbf)
4.9 N
(1.1 lbf)
6.3 ENVIRONMENTAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Shock
(Thermal)
Mate connectors; expose to 5 cycles of:
Temperature °C Duration (Minutes)
-40 +0/-3 30
+25 ±10 5 MAXIMUM
+105 +3/-0 30
+25 ±10 5 MAXIMUM
10 milliohms MAXIMUM
(change from initial)
&
Visual: No Damage
Thermal Aging
Mate connectors; expose to:
96 hours at 105 ± 2°C
10 milliohms MAXIMUM
(change from initial])
&
Visual: No Damage
Humidity
(Steady State)
Mate connectors: expose to a temperature of
40 ± 2°C with a relative humidity of 90-95%
for 96 hours.
Note: Remove surface moisture and air dry
for 1 hour prior to measurements.
10 milliohms MAXIMUM
(change from initial)
&
Dielectric Withstanding Voltage:
No Breakdown at 500 VAC
&
Insulation Resistance:
1000 Megohms MINIMUM
&
Visual: No Damage
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Humidity
(Cyclic)
Mate connectors: cycle per EIA-364-31: 24
cycles at temperature 25 ± 3°C at 80 ± 5%
relative humidity and 65 ± 3°C at 50 ± 5%
relative humidity; dwell time of 1.0 hour;
ramp time of 0.5 hours.
{Note: Remove surface moisture and air dry
for 1 hour prior to measurements.}
10 milliohms MAXIMUM
(change from initial)
&
Dielectric Withstanding Voltage:
No Breakdown at 500 VAC
&
Insulation Resistance:
1000 Megohms MINIMUM
&
Visual: No Damage
Solderability
Per SMES-152
Solder coverage:
95% MINIMUM (per
SMES-152)
Solder
Resistance
Dip connector terminal tails in solder:
Solder Duration: 5 ± 0.5 seconds;
Solder Temperature: 230 ± 5°C
Visual:
No Damage to insulator material
Cold Resistance
Mate connectors:
Duration: 96 hours;
Temperature: -40 ± 3°C
10 milliohms MAXIMUM
(change from initial)
&
Visual: No Damage
Corrosive
Atmosphere:
Flowing Mixed Gas
(FMG)
Test per EIA-364-65, Class II,
Exposure to gasses for 4 days, unmated.
10 milliohms MAXIMUM
(change from initial)
&
Visual: No Damage
7.0 SOLDER INFORMATION
7.1 SOLDER PROCESS TEMPERATURES
Wave Solder: 235°C MAX
Molex Solderability Specification SMES-152
(Click Here)
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8.0 PACKAGING
Parts shall be packaged to protect against damage during normal handling, transit and storage. “For specific
part packaging details, refer to the packaging specification called out on the applicable product sales drawing.
9.0 CABLE TIE AND/ OR TWIST LOCATION
The “T” dimension defines a “free” length of wire, or a length of wire that is not subject to significant bias by
external factors such as a wire tie, wire twisting, or other means of bending or deforming of the wires that
repositions them from their natural relaxed state or location where they enter the housing. Wires are to be
dressed in such a manner to allow the terminals to float freely in the pocket. This dimension is general
recommendation and may need to be adjusted for different wire gauges and wire type and insulation thickness
and insulation material.
Circuit Sizes
Dimension T Minimum
2
4
6
0.50” (12.7mm)
8
0.75” (19.1mm)
10
12
1.00” (25.40mm)
14
16
1.25” (31.75mm)
18
20
1.50” (38.09mm)
22
24
1.75” (44.45mm)
Dim T

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