LTST-C171KRKT Datasheet by LITEON

LITEIO] l I“ D oProELEcTHoNIcs
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
Product Data Sheet
LTST-C171KRKT
Spec No. :DS22-2000-109
Effective Date: 03/09/2021
Revision: G
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Features
* Meet ROHS, Green Product.
* Super thin (0.80H mm) Chip LED.
* Ultra bright AlInGaP Chip LED.
* Package In 8mm Tape On 7" Diameter Reels.
* EIA STD package.
* I.C. compatible.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared And Vapor Phase Reflow Solder Process.
Package Dimensions
Part No. Lens Source Color
LTST-C171KRKT Water Clear AllnGaP Red
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
Part No. : LTST-C171KRKT Page : 1 of 11
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Absolute Maximum Ratings At Ta=25
Parameter
LTST-C171KRKT
Unit
Power Dissipation 75 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 80 mA
DC Forward Current 30 mA
Derating Linear From 50°C 0.4 mA/°C
Reverse Voltage 5 V
Operating Temperature Range -55°C to + 85°C
Storage Temperature Range -55°C to + 85°C
Infrared Soldering Condition 260°C For 10 Seconds
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Suggestion Profile:
(1) Suggest IR Reflow Condition For Pb Free Process
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Electrical Optical Characteristics At Ta=25
Parameter Symbol Part No.
LTST-
Min. Typ. Max. Unit Test Condition
Luminous Intensity IV C171KRKT
18.0 54.0 mcd IF = 20mA
Note 1
Viewing Angle 2θ1/2 C171KRKT
130 deg Note 2 (Fig.6)
Peak Emission Wavelength
λP C171KRKT
639 nm Measurement
@Peak (Fig.1)
Dominant Wavelength λd C171KRKT
631 nm Note 3
Spectral Line Half-Width Δλ C171KRKT
20 nm
Forward Voltage VF C171KRKT
2.0 2.4 V IF = 20mA
Reverse Current IR C171KRKT
10 μA VR = 5V
Capacitance C C171KRKT
40 PF VF = 0
f = 1MHZ
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
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Bin Code List
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Luminous Intensity Unit : mcd @20mA
Bin Code Min. Max.
M 18.0 28.0
N 28.0 45.0
P 45.0 71.0
Q 71.0 112.0
R 112.0 180.0
Tolerance on each Intensity bin is +/-15%
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Typical Electrical / Optical Characteristics Curves
(25 °C Ambient Temperature Unless Otherwise Noted)
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal
temperature for
less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Temperature
Soldering time 300°C Max.
3 sec. Max.
(one time only)
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
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ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Classification
Test Item
Test Condition Reference Standard
Endurance
Test
Operation Life Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5,RH= 9095%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
High Temperature
Storage Ta= 105±5
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008
JIS C 7021:B-10
Low Temperature
Storage Ta= -55±5
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12
Environmental
Test
Temperature
Cycling
105 25 -55 25
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5 -40 ± 5
10mins 10mins 10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Solder
Resistance T.sol= 260 ± 5
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
IR-Reflow
Normal Process
Ramp-up rate(183 to Peak) +3/ second max
Temp. maintain at 125(±25) 120 seconds max
Temp. maintain above 183 60-150 seconds
Peak temperature range 235+5/-0
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6/second max
MIL-STD-750D:2031.2
J-STD-020C
IR-Reflow
Pb Free Process
Ramp-up rate(217 to Peak) +3/ second max
Temp. maintain at 175(±25) 180 seconds max
Temp. maintain above 217 60-150 seconds
Peak temperature range 260+0/-5
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6/second max
MIL-STD-750D:2031.2
J-STD-020C
Solderability
T.sol= 235 ± 5
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage 95% of the dipped surface
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
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9. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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