DSC61xxB Datasheet by Microchip Technology

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‘ MICRQICHIP DSC61XXB
2019 Microchip Technology Inc. DS20006155A-page 1
DSC61XXB
Features
Wide Frequency Range: 3.5 kHz to 100 MHz
Ultra-Low Power Consumption: 3 mA/1 µA
(Active/Standby)
Ultra-Small Footprints
-1.6mm
1.2 mm
-2.0mm
1.6 mm
-2.5mm2.0 mm
Frequency Select Input Supports Two
Pre-Defined Frequencies
High Stability: ±20 ppm, ±25 ppm, ±50 ppm
Wide Temperature Range
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20° to +70°C
Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
High Reliability
- 20x Better MTF Than Quartz Oscillators
Supply Range of 1.71V to 3.63V
Short Sample Lead Time: <2 weeks
Lead Free & RoHS Compliant
Automotive Version Available: DSA61xxB
Applications
Low Power/Portable Applications: IoT,
Embedded/Smart Devices
Consumer: Home Healthcare, Fitness Devices,
Home Automation
Industrial: Building/Factory Automation,
Surveillance Camera
Automotive (Please Refer to the DSA61xx Family)
General Description
The DSC61xxB family of MEMS oscillators combines
the industry leading low power consumption and
ultra-small packages with exceptional frequency
stability and jitter performance over temperature. The
single-output DSC61xxB MEMS oscillators are
excellent choices for use as clock references in small,
battery-powered devices such as wearable and
Internet of Things (IoT) devices in which small size, low
power consumption, and long-term reliability are
paramount.
The DSC61xxB family is available in ultra-small
1.6 mm x 1.2 mm, 2.0 mm x 1.6 mm, and
2.5 mm x 2.0 mm packages. These packages are
“drop-in” replacements for standard 4-pin CMOS
quartz crystal oscillators. The Automotive Grade
AEC-Q100 qualified option is also available for this
device.
Package Types
DSC61XXB
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
OE/STDBY/FS
4
GND
VDD
OUT
3
2
1
Ultra-Small, Ultra-Low Power MEMS Oscillator
DSC61XXB
DS20006155A-page 2 2019 Microchip Technology Inc.
Block Diagram
DSC61XXB
MEMS
RESONATOR
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO OUTPUT
DIVIDER DRIVER
SUPPLY
REGULATION
PIN 1
OE/STDBY/FS
PIN 2
GND
PIN 4
VDD
PIN 3
OUTPUT
DIGITAL
CONTROL
DD DD VDD VDD o V‘H VDD V‘L DD EN
2019 Microchip Technology Inc. DS20006155A-page 3
DSC61XXB
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Supply Voltage VDD 1.71 3.63 V Note 1
Power Supply Ramp tPU 0.1 100 ms Note 8
Active Supply Current IDD —3.0 — mA
fOUT = 27 MHz, VDD = 1.8V, No
Load
Standby Supply Current ISTBY
—1 µA VDD = 1.8/2.5V, Note 2
—1.5 — V
DD = 3.3V, Note 2
Output Duty Cycle SYM 45 55 %
Frequency f00.0035 100 MHz —
Frequency Stability f—
±20
±25
±50
ppm All temp ranges, Note 3
Aging f—— ±5 ppm 1st year @ 25°C
±1 Per year after first year
Startup Time tSU —— 1.5 ms
From 90% VDD to valid clock
output, T = 25°C
Input Logic Levels VIH 0.7 x VDD V Input Logic High, Note 4
VIL 0.3 x VDD V Input Logic Low, Note 4
Output Disable Time tDA ——200 +
2 Periods ns Note 5
Output Enable Time tEN —— 1 µsNote 6
Enable Pull-up Resistor 300 kIf configured, Note 7
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
“/3, TA
DSC61XXB
DS20006155A-page 4 2019 Microchip Technology Inc.
Output Logic Levels
VOH 0.8 x VDD —— V
Output Logic High, I = 3 mA,
Std. Drive
Output Logic High, I = 6 mA,
High Drive
VOL 0.2 x VDD V
Output Logic Low, I = –3 mA,
Std. Drive
Output Logic Low, I = –6 mA,
High Drive
Output Transition Time
Rise Time/Fall Time
tRX/tFX
—1 1.5 ns
DSC61x2
High Drive,
20% to 80%
CL = 15 pF
VDD = 1.8V
—0.5 1.0 ns V
DD = 2.5V/3.3V
tRY/tFY
—1.2 2.0 ns
DSC61x1
Std Drive,
20% to 80%
CL = 10 pF
VDD = 1.8V
—0.6 1.2 ns V
DD = 2.5V/3.3V
Period Jitter, RMS JPER
—8.5 —psRMS
fOUT =
27 MHz
VDD = 1.8V
—7 — V
DD = 2.5V/3.3V
Cycle-to-Cycle Jitter
(Peak) JCy–Cy
—50 70 ps fOUT =
27 MHz
VDD = 1.8V
—35 60 V
DD = 2.5V/3.3V
Period Jitter
(Peak-to-Peak) JPP
—70 — ps fOUT =
27 MHz
VDD = 1.8V
—60 — V
DD = 2.5V/3.3V
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Pin 4 VDD should be filtered with 0.1 µF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
2019 Microchip Technology Inc. DS20006155A-page 5
DSC61XXB
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Junction Operating Temperature TJ–40 +150 °C —
Storage Ambient Temperature Range TA–55 +150 °C —
Soldering Temperature TS +260 °C 40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DSC61XXB
DS20006155A-page 6 2019 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The DSC61xxB is a highly configurable device and can be factory programmed in many different ways to meet the
customer’s needs. Microchip’s ClockWorks® Configurator http://clockworks.microchip.com/Timing/ must be used to
choose the necessary options, create the final part number, data sheet, and order samples. The descriptions of the pins
are listed in Table 2 -1 .
An explanation of the different options listed in Table 2-1 follows.
2.1 Pin 1
This is a control pin and may be configured to fulfill one
of three different functions. If not actively driven, a
10 k pull-up resistor is recommended.
2.1.1 OUTPUT ENABLE (OE)
Pin 1 may be configured as OE. Oscillator output may
be turned on and off according to the state of this pin.
2.1.2 STDBY
Pin 1 may be configured as Standby. When the pin is
low, both output buffer and PLL will be off and the
device will enter a low power mode.
2.1.3 FREQUENCY SELECT (FS)
Pin 1 may be configured as FS. The output may be set
to one of two pre-programmed frequencies. The output
clock frequencies can only be set to either kHz or MHz.
A combination of kHz and MHz cannot be set.
2.2 Pins 2 through 4
Pins 2 and 4 are the supply terminals, GND and VDD
respectively. Pin 3 is the clock output, programmable to
Standard and High Drive strength settings. Visit
ClockWorks® Configurator to customize your device.
2.3 Output Buffer Options
The DSC61xx family is available in multiple output
driver configurations.
The standard-drive (61x1) and high-drive (61x2) deliver
respective output currents of greater than 3 mA and
6 mA at 20%/80% of the supply voltage. For heavy
loads of 15 pF or higher, the high-drive option is
recommended.
TABLE 2-1: DSC61XXB PIN FUNCTION TABLE
Pin Number Pin Name Description
1
(Note 1)
OE Output Enable: H = Active, L = Disabled (High Impedance).
STDBY Standby: H = Device is active, L = Device is in standby (Low Power Mode).
FS Frequency Select: H = Output Frequency 1, L = Output Frequency 2.
2 GND Ground.
3 Output Oscillator clock output.
4 VDD Power supply: 1.71V to 3.63V.
Note 1: DSC610xB/1xB/3xB has a 300 k internal pull-up resistor on pin 1. DSC614xB/5xB/7xB has no internal
pull-up resistor on pin 1 and needs an external pull-up or to be driven by another chip.
4‘ fl WW ________ T <—> FIGURE 3-1: Output Waveform. —> 3) :: (i A O _F' E —I '— fi 0) FIGURE 3-3: Recommended Board Layout.
2019 Microchip Technology Inc. DS20006155A-page 7
DSC61XXB
3.0 DIAGRAMS
FIGURE 3-1: Output Waveform.
FIGURE 3-2: Test Circuit.
FIGURE 3-3: Recommended Board Layout.
VOH
VOL
VIL
1/fo
OUTPU
T
ENABLE
tDA
tEN
tF
tR
VIH
VDD
C1
GND
Enable
Output
Via to GND Layer
Via to GND Layer
<——> FIGURE 4-1: Solder Reflow Profile.
DSC61XXB
DS20006155A-page 8 2019 Microchip Technology Inc.
4.0 SOLDER REFLOW PROFILE
FIGURE 4-1: Solder Reflow Profile.
60-180
Seconds
Temperature (°C)
260
°C
3
°
C/sec max.
217
°C
200
°C
150
°C
25
°C
8 minutes max.
Pre-Heat
3
°
C/sec max.
Reflow
Cool
Time
6
°
C/sec max.
60-150
Seconds
20-40
Seconds
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max.
Preheat Time 150°C to 200°C 60 to 180 sec.
Time maintained above 217°C 60 to 150 sec.
Peak Temperature 255°C to 260°C
Time within 5°C of actual Peak 20 to 40 sec.
Ramp-Down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 minutes max.
SSS
2019 Microchip Technology Inc. DS20006155A-page 9
DSC61XXB
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
4-Lead VLGA*
2.5 x 2.0 Example
Example
XXXXXXX
XXXYYWW
SSS
0400000
DCP1834
287
4-Lead VFLGA*
2.0 x 1.6/1.6 x 1.2
XXXX
SSS
011H
502
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
SSS Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
, , Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar () symbol may not be to scale.
3
e
3
e
(DATUM A) (DATUM a) —\\‘ NOTE I \~ 7‘ ' I EEC TOP VIEW * // I I SEATING! I 7 ,7 7 PLANE J 4x SIDE VIEW an. I NOTEI / jig I BOTTOM VIEW MicrochIp Techno
DSC61XXB
DS20006155A-page 10 2019 Microchip Technology Inc.
0.07 C A B
0.03 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
12
N
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
12
N
0.10 C
0.08 C
Microchip Technology Drawing C04-1199A Sheet 1 of 2
4X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
D
E
B
A
0.05 C
0.05 C
2X
2X
4X L
b2
e
CH
CH
A
(A3)
A1
e1
e1
2
3X b1
3
2019 Microchip Technology Inc. DS20006155A-page 11
DSC61XXB
Microchip Technology Drawing C04-1199A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Overall Width
Terminal Length
Substrate Thickness (with Terminals)
Terminal Pitch
Standoff
Units
Dimension Limits
A1
A
b2
A3
e
L
E
N
1.20 BSC
0.20 REF
0.325
0.30
0.79
0.00
0.35
0.375
0.84
0.02
1.20 BSC
MILLIMETERS
MIN NOM
4
0.425
0.40
0.89
0.05
MAX
CH 0.125--Terminal 1 Index Chamfer
Overall Length D 1.60 BSC
Terminal Width
b1 0.25 0.30 0.35Terminal Width
Terminal Pitch e1 0.75 BSC
ii i_ Ti i4 1 !_| y |\
DSC61XXB
DS20006155A-page 12 2019 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
X2
Contact Width
Contact Pitch
MILLIMETERS
1.20 BSC
MIN
E1
MAX
Space Between Contacts (X4)
Contact Pad Length (X6)
G1
Y0.50
Microchip Technology Drawing C04-3199A
NOM
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
SILK SCREEN
12
4
X1Contact Width (X3)
Space Between Contacts (X3) G2 0.25
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
X1
Y
G2
(CH)
CContact Spacing 0.75
0.43
0.35
0.85
Contact 1 Index Chamfer CH 0.13 X 45° REF
C
E2
Contact Pitch 1.16 BSCE2
X2
G1
E1
(DATUM A) \ i (DATUM B) \\ NOTE1\%—7 ,77, ///J Q 0,05 c //g I 2 E TOP VIEW J // 010 c “.7 <1 seat‘ng="" 7="" 7="" 7="" plane="" 1j="" 74x7="" bottom="" view="">
2019 Microchip Technology Inc. DS20006155A-page 13
DSC61XXB
0.07 C A B
0.03 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
12
N
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
12
N
0.10 C
0.08 C
Microchip Technology Drawing C04-1200A Sheet 1 of 2
4X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
D
E
B
A
0.05 C
0.05 C
2X
2X
4X L
b2
e
CH
CH
A
(A3)
A1
e1
e1
2
3X b1
DSC61XXB
DS20006155A-page 14 2019 Microchip Technology Inc.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Overall Width
Terminal Length
Substrate Thickness (with Terminals)
Terminal Pitch
Standoff
Units
Dimension Limits
A1
A
b2
A3
e
L
E
N
1.55 BSC
0.20 REF
0.40
0.50
0.79
0.00
0.55
0.45
0.84
0.02
1.60 BSC
MILLIMETERS
MIN NOM
6
0.50
0.60
0.89
0.05
MAX
CH 0.15--Terminal 1 Index Chamfer
Overall Length D 2.00 BSC
Terminal Width
b1 0.30 0.35 0.40Terminal Width
Terminal Pitch e1 0.95 BSC
r; fj T 7; § F L777 f J_, J _ _| ' ‘ \ '_‘ |_l
2019 Microchip Technology Inc. DS20006155A-page 15
DSC61XXB
RECOMMENDED LAND PATTERN
Dimension Limits
Units
X2
Contact Width (X2)
Contact Pitch
MILLIMETERS
1.55 BSC
MIN
E
MAX
Space Between Contacts (X4)
Contact Pad Length (X6)
G1
Y0.70
Microchip Technology Drawing C04-3200A
NOM
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
SILK SCREEN
12
4
X1Contact Width (X4)
Space Between Contacts (X3) G2 0.25
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
X1
YG2
G1
E
(CH)
CContact Spacing 0.95
0.40
0.50
1.05
Contact 1 Index Chamfer CH 0.13 X 45° REF
C
(DATUM A) (DATUM B) // //I NOTEfiXfl/iiiiri \\ ‘ Q o I 2 EC TOP VIEW I // 0,10 0 I SEATING i PLANE SIDE VIEW BOTTOM VIEW Mmcmp Technangy Drawmg cuuznzA Shem I oiz
DSC61XXB
DS20006155A-page 16 2019 Microchip Technology Inc.
0.07 C A B
0.03 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
12
N
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
12
N
0.10 C
0.08 C
Microchip Technology Drawing C04-1202A Sheet 1 of 2
4X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
D
E
B
A
0.05 C
0.05 C
2X
2X
4X L
e
CH
CH
A
(A3)
A1
e1
e1
2
4X b1
2019 Microchip Technology Inc. DS20006155A-page 17
DSC61XXB
Microchip Technology Drawing C04-1202A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Overall Width
Terminal Length
Substrate Thickness (with Terminals)
Terminal Pitch
Standoff
Units
Dimension Limits
A1
A
A3
e
L
E
N
1.65 BSC
0.20 REF
0.60
0.79
0.00
0.65
0.84
0.02
2.00 BSC
MILLIMETERS
MIN NOM
4
0.70
0.89
0.05
MAX
CH 0.225--Terminal 1 Index Chamfer
Overall Length D 2.50 BSC
b1 0.60 0.65 0.70Terminal Width
Terminal Pitch e1 1.25 BSC
E]
DSC61XXB
DS20006155A-page 18 2019 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Contact Pitch
MILLIMETERS
1.65 BSC
MIN
E
MAX
Space Between Contacts (X4)
Contact Pad Length (X6)
G1
Y0.80
Microchip Technology Drawing C04-3202A
NOM
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
SILK SCREEN
12
4
XContact Width (X4)
Space Between Contacts (X3) G2 0.45
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
X
Y
G2C
E
(CH)
CContact Spacing 1.25
0.70
0.95
Contact 1 Index Chamfer CH 0.13 X 45° REF
G1
2019 Microchip Technology Inc. DS20006155A-page 19
DSC61XXB
APPENDIX A: REVISION HISTORY
Revision A (January 2019)
Initial creation of DSC61xxB Microchip data sheet
DS20006155A.
DSC61XXB
DS20006155A-page 20 2019 Microchip Technology Inc.
NOTES:
PART ND. x Dev 44x 44x 41x 41x I E: x § § 44x STDBY STDBY STDBV
2019 Microchip Technology Inc. DS20006155A-page 21
DSC61XXB
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Note 1: Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized fre-
quency. http://clockworks.microchip.com/timing/.
PART NO. X
Package
Device
Device: DSC61: Ultra-Small, Ultra-Low Power MEMS
Oscillator
Pin Definition: Selection Pin 1 Internal Pull-Up Register
0 OE Pull-up
1STDBY
Pull-up
2 FS Pull-up
4 OE None
5STDBY
None
6 FS None
Output Drive
Strength:
1
2
Standard
High
Packages: J = 4-Lead 2.5 mm x 2.0 mm VLGA
M = 4-Lead 2.0 mm x 1.6 mm VFLGA
H = 4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
A=40C to +125C (Automotive)
L=40C to +105C (Extended Industrial)
I = –40C to +85C (Industrial)
E=20C to +70C (Extended Commercial)
Frequency
Stability:
1 = ± 50 ppm
2 = ± 25 ppm
3 = ± 20 ppm
Revision: B = Revision B
Frequency: xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 100.0000 MHz
xxxkxxx = User-Defined Frequency between 003.500 kHz
and 999.999 kHz
xxxx = Frequency configuration code when pin 1 = FS.
Configure the part online through ClockWorks
Media Type: <blank>= 140/Tube (J Package Option)
<blank>= 100/Bag (M & H Package Option)
T = 1,000/Reel
B = 3,000/Reel
X
Pin 1
Definition
Note 1: Media Type identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with different media options.
X
Output
Drive
Strength
X
Temperature
Range
X
Frequency
Stability
X
Revision
XXX.XXXX
Frequency
X
Media
Type
Examples:
a) DSC6112JI2B-100.0000:
Ultra-Small, Ultra-Low Power MEMS Oscillator,
Pin 1 = STDBY with Internal Pull-Up, High Drive
Strength, 4-Lead 2.5 mm x 2.0 mm VLGA, Industrial
Temperature, ±25 ppm Stability, Revision B,
100 MHz Frequency, 140/Tube
b) DSC6101HE1B-016.0000T:
Ultra-Small, Ultra-Low Power MEMS Oscillator,
Pin 1 = OE with Internal Pull-Up, Standard Drive
Strength, 4-Lead 1.6 mm x 1.2 mm VFLGA, Extended
Commercial Temperature, ±50 ppm Stability,
Revision B, 16 MHz Frequency, 1,000/Reel
c) DSC6121MI2B-005QB:
Ultra-Small, Ultra-Low Power MEMS Oscillator,
Pin 1 = Freq. Select with Internal Pull-Up, Standard
Drive Strength, 4-Lead 2.0 mm x 1.6 mm VFLGA,
Industrial Temperature, ±25 ppm Stability, Revision B,
Two Frequencies Configured through ClockWorks,
3,000/Reel
DSC61XXB
DS20006155A-page 22 2019 Microchip Technology Inc.
NOTES:
YSTEM
2019 Microchip Technology Inc. DS20006155A-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4095-6
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
6‘ ‘MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS20006155A-page 24 2019 Microchip Technology Inc.
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