QSE Series Datasheet by Samtec Inc.

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(0.80 mm) .0315" QSE SERIES
QSE–060–01–F–D–A
QSE–028–01–F–D–DP–A
QSE–020–01–L–D–A
Blade &
Beam
Design
Integral metal plane
for power or ground
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
SPECIFICATIONS Board Mates:
QTE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
QSE PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
020, –040, –060
(40 total pins per bank = –D)
014, –028, –042
(14 pairs per bank = –D–DP)
–D
= Single-
Ended
D–DP
= Differential
Pair
(–01 only)
TYPE AOTHER
OPTION
01
(0.64)
.025
(20.00) .7875
–D = (No. of Positions per Row/20) x
(20.00) .7875 + (1.27) .050
–D–DP = (No. of Positions per Row/14) x
(20.00) .7875 + (1.27) .050
01
02
(7.49)
.295
(0.15)
.006
(0.80)
.0315
(3.25)
.128
(3.05)
.120 (0.76)
.030
(7.24)
.285
(0.89)
.035
DIA –L
–GP
= Guide Post
(–020 only)
–K
= (8.25 mm) .325"
DIA Polyimide
Film Pick &
Place Pad
TR
= Tape & Reel
Packaging
–L
= Latching Option
(N/A on –042
& –060 positions)
–F
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ"
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50 µ"
(1.27 µm) min Ni on
all solder tails
HIGH-SPEED GROUND PLANE SOCKET
QTE
LEAD STYLE
MATED HEIGHT
WITH QSE*
01 (5.00) .197
02 (8.00) .315
03 (11.00) .433
04 (16.00) .630
05 (19.00) .748
07 (25.00) .984
09 (14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contacts:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Ye s
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
FILE NO. E111594
®
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
SEM/TEM1-DH1
QTE-D/QSE-D or QTE-DP/QSE-DP
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com Gbps
28
Gbps
14
QSE-DP/QTE-DPQSE-D/QTE-D
HIGH-SPEED CHANNEL PERFORMANCE
F-219
ALSO AVAILABLE
(MOQ Required)
15 mm, 22 mm and
30 mm stack height
30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
Edge Mount
• 56
(-DP), 80, 100
positions per row
• Retention,
Guide Posts and
Friction Lock options
.

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