V8P8(HM3, -M3) Datasheet by Vishay General Semiconductor - Diodes Division

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V8P8
www.vishay.com Vishay General Semiconductor
Revision: 18-Dec-2019 1Document Number: 87709
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Current Density Surface Mount
TMBS® (Trench MOS Barrier Schottky) Rectifier
Ultra Low VF = 0.42 V at IF = 4 A
ADDITIONAL RESOURCES
FEATURES
Very low profile - typical height of 1.1 mm
Ideal for automated placement
Trench MOS Schottky technology
Low forward voltage drop, low power losses
High efficiency operation
Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
AEC-Q101 qualified available
- Automotive ordering code; base P/NHM3
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in low voltage high frequency inverters,
freewheeling, DC/DC converters, and polarity protection
applications.
MECHANICAL DATA
Case: SMPC (TO-277A)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3_X - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
(“_X” denotes revision code e.g. A, B,.....)
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Notes
(1) Mounted on 30 mm x 30 mm pad areas aluminum PCB
(2) Free air, mounted on recommended copper pad area
PRIMARY CHARACTERISTICS
IF(AV) 8.0 A
VRRM 80 V
IFSM 140 A
VF at IF = 8.0 A (TA = 125 °C) 0.54 V
TJ max. 150 °C
Package SMPC (TO-277A)
Circuit configuration Single
K
2
1
SMPC (TO-277A)
eSMP® Series
Anode 1
Anode 2
Cathode
K
3
3
3
D
D
D
3
D
3D Models
Available
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL V8P8 UNIT
Device marking code V88
Maximum repetitive peak reverse voltage VRRM 80 V
Maximum average forward rectified current (fig. 1) IF (1) 8.0 A
IF (2) 4.0
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load IFSM 140 A
Voltage rate of change (rated VR) dV/dt 10 000 V/μs
Operating junction and storage temperature range TJ, TSTG -40 to +150 °C
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V8P8
www.vishay.com Vishay General Semiconductor
Revision: 18-Dec-2019 2Document Number: 87709
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: pulse width 5 ms
Notes
(1) The heat generated must be less than the thermal conductivity from junction to ambient: dPD/dTJ < 1/RJA
(2) Free air mounted on recommended copper pad area; thermal resistance RJA - junction to ambient
(3) Mounted on 30 mm x 30 mm aluminum PCB; thermal resistance RJM - junction to mount
Note
(1) AEC-Q101 qualified
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT
Instantaneous forward voltage
IF = 4.0 A TA = 25 °C
VF (1)
0.49 -
V
IF = 8.0 A 0.58 0.66
IF = 4.0 A TA = 125 °C 0.42 -
IF = 8.0 A 0.54 0.62
Reverse current VR = 80 V TA = 25 °C IR (2) -0.7
mA
TA = 125 °C 8.0 20
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL V8P8 UNIT
Typical thermal resistance RJA (1)(2) 75 °C/W
RJM (3) 4
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
V8P8-M3/86A 0.10 86A 1500 7" diameter plastic tape and reel
V8P8-M3/87A 0.10 87A 6500 13" diameter plastic tape and reel
V8P8HM3_A/H (1) 0.10 H 1500 7" diameter plastic tape and reel
V8P8HM3_A/I (1) 0.10 I 6500 13" diameter plastic tape and reel
VISHAY. an: DwodesAmencasfllvwshayxmm DwodesAslafilvwshayLam DwodesEumge®vwshay com www wshay,com/doc791000
V8P8
www.vishay.com Vishay General Semiconductor
Revision: 18-Dec-2019 3Document Number: 87709
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Fig. 1 - Forward Current Derating Curve
Fig. 2 - Forward Power Loss Characteristics
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 4 - Typical Reverse Leakage Characteristics Per Diode
Fig. 5 - Typical Junction Capacitance
Fig. 6 - Typical Transient Thermal Impedance
0
1
2
3
4
5
6
7
8
9
0 25 50 75 100 125 150
Average Forward Rectified Current (A)
Mount Temperature (°C)
TM = 131 °C, RTJM = 4 °C/W
TA = 25 °C, RTJA = 75 °C/W
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0123456789
Average Power Loss (W)
Average Forward Current (A)
D = 0.1
D = 0.2
D = 0.3
D = 0.5
D = 1.0
D = 0.8
D = tp/T
T
tp
10
100
1000
10000
0.1
1
10
100
0 0.10.20.30.40.50.60.70.80.91.01.11.2
Axis Title
2nd line
Instantaneous Forward Current (A)
Instantaneous Forward Voltage (V)
T
J
= 100 °C
T
J
= 125 °C
T
J
= 150 °C
T
J
= -40 °C
T
J
= 25 °C
10
100
1000
10000
0.0001
0.001
0.01
0.1
1
10
100
20 40 60 80 100
Axis Title
1st line
2nd line
2nd line
Instantaneous Reverse Current (mA)
Percent of Rated Peak Reverse Voltage (%)
TJ= 150 °C
TJ= 125 °C
TJ= 100 °C
TJ= -40 °C
TJ= 25 °C
1
10
100
0.01 0.1 1 10 100
Transient Thermal Impedance (°C/W)
t - Pulse Duration (s)
Junction to Ambient
VISHAY. 7;] ~ 1 I I L L_J T on: DwodesAmencasfilvwshayLom DwodesAslafilvwshayLam DwodesEumge®vwshay com www wshay.com/doc791000
V8P8
www.vishay.com Vishay General Semiconductor
Revision: 18-Dec-2019 4Document Number: 87709
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
Conform to JEDEC® TO-277A
SMPC (TO-277A)
0.016 (0.40)
0.006 (0.15)
0.047 (1.20)
0.039 (1.00)
0.146 (3.70)
0.134 (3.40)
0.087 (2.20)
0.075 (1.90)
0.189 (4.80)
0.173 (4.40)
0.049 (1.24)
0.037 (0.94)
0.053 (1.35)
0.041 (1.05)
0.030 (0.75) NOM.
0.084 (2.13) NOM.
0.155 (3.94)
NOM.
Mounting Pad Layout
0.268
(6.80)
0.186 (4.72)
MIN.
0.050 (1.27)
MIN.
0.041
(1.04)
0.055 (1.40)
MIN.
0.189 (4.80)
MIN.
0.187 (4.75)
0.175 (4.45)
0.262 (6.65)
0.250 (6.35)
0.242 (6.15)
0.238 (6.05)
0.171 (4.35)
0.167 (4.25)
K
2
1
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Revision: 01-Jan-2021 1Document Number: 91000
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