Huawai EMC Presentation Datasheet by 3M

Q “ERG 2'31 0 Navigating EMS
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
1
Simulation and Design of
Printed Circuit Boards Utilizing
Novel Embedded Capacitance
Material
April 28, 2010
Yu Xuequan, Yanhang, Zhang Gezi, Wang Haisan
Huawei Technologies CO., LTD.
Shanghai, China
Tony_yu@huawei.com
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
2
Outline
Embedded Capacitance Material Introduction
Impedance Simulation Comparison for boards with ECM or FR-4
Power/Ground Core
Comparison of the power noise measurement
In Board Interference Analysis for ECM and FR4 Board
ECM Impact to Signal Integrity
Board Level EMC Performance Comparison – Simulation
Board Level EMC Performance Comparison – Test Result
The Application Prospect of the Embedded Capacitance Materials
Questions
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Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
3
Embedded Capacitance Material Introduction
Planar sandwich structure ECM
Higher capacitance density than thin
core FR4
Higher decoupling bandwidth than
discrete MLCC caps
3M C-PLY19
19um filled insulation
>6nf/sq inch C/A
Schematic illustration of 3M C-PLY19
Frequency response comparison , MLCC vs ECM
Electrical parameters comparison
FR4 plate capacitance vs ECM (3M C-PLY19)
Schematic illustration of PCB plate capacitor
Layer mule L1 L2 L3 L4 L6 Ls Layout figures Layout exp 1 anal. i on
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
4
Impedance Simulation Comparison for boards with
ECM or FR-4 Power/Ground Core
Same board stack up and layout
Only difference in Pwr/Gnd core
material
Impedance port set on same
position in simulation
Much lower impedance of ECM
from 10MHz~6GHz than FR4
Much more resonance in FR4
curve, higher impedance and
power noise
FR-4 PCB
3M C-PLY19 PCB
Impedance Comparison
Blue for ECM
Red for thin core FR-4 plate capacitor
Sample board Stack up
canventiunal FM materlals board embedded canacitors board 1" R I E E E
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
5
Comparison of the power noise measurement
Power noise ripple of FR4 board is much higher than that of ECM board.
ECM board shows superiority over FR4 on noise reduction in entire bandwidth
10MHz-4GHz.
ECM board noise close to white noise of Spectrum Analyzer in higher frequency
over 1.5GHz.
Very promising for ECM to improve power supply quality, digital /analog
interference in board & board level EMI.
-160
-140
-120
-100
-80
-60
-40
-20
0
0.01
0.14
0.26
0.39
0.52
0.65
0.77
0.9
1.03
1.15
1.28
1.41
1.54
1.66
1.79
1.92
2.04
2.17
2.3
2.43
2.55
2.68
2.81
2.94
3.06
3.19
3.32
3.44
3.57
3.7
3.83
3.95
GHz
dBm
3M C-PLY19 (0.75mil)
FR4 (3.54mil)
Power ripple noise comparison in time domain Power noise frequency spectrum comparison
mm: mm LY19"-_PCB 1 2 a A freq, GHz g H 5 UA E m 4S 6
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
6
In Board Interference Analysis for ECM and FR4
Board
Port set on same connectors
position on FR4 / ECM board
Transmission coefficient between
same ports of ECM board is much
lower than that of FR4 board
ECM board minimized risk for
interference from shared power
distribution system within board
FR-4 PCB 3M C-PLY19 PCB
Transmission coefficient comparison
Red for FR4, Port1,2 ,Blue for ECM, Port3,4
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Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
7
Set noise source and noise probe on same position of FR4 / ECM board
Same noise source input
smaller noise distribution area and lower noise amplitude on power plane
for ECM board
power noise distribution on FR-4
board power noise distribution on
ECM board
Simulation setup
In Board Interference Analysis for ECM and FR4
Board
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Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
8
Same noise source and probe setup
Superior noise spectrum of ECM board in all frequency range
Noise spectrum comparison on same probe position
In Board Interference Analysis for ECM and FR4
Board
Simulation setup
um mm m H mm 1 \2 ‘ 1‘ ,' 1 1 2 \s w \4 \J \4 \4 All Hum (0 75m” ‘ vauv unoulo +1!!! CrPLYIB (0 75ml) m4 (3.54mi1) a y.” 1,3 odd harmunic waves of 125 MHZ Cluck signals MHz
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
9
ECM Impact to Signal Integrity
Same functional circuit on
the board for FR4 and
ECM board
50MHz & 125MHz clock
on different zone but with
same power
125M Clock as aggressor
50M clock as victim to see
its signal wave and
spectrum received
50M clock on ECM board
less influenced by 125M
clock with better jitter and
duty cycle
Comparison of the 50 MHz clock
signal measured wave
Comparison of the 50 MHz clock signal
frequency spectrums on ECM and FR4 board
1255MHz CLOCK
CIRCUIT AREA
50MHz CLOCK
CIRCUIT AREA
50MHz CLOCK
SIGNAL PROBE
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
10
Board Level EMC Performance Comparison --
Simulation
PCB FR4(3.54mil)
PCB 3M C-PLY19
(0.75mil)
Free space field distribution
EMI simulation result (3 Meter field )
With same noise source excitation ,
free space field and 3 Meter field
result of ECM board is lower than
that of FR4 in all bandwidth
simulated
1'5 4?
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
11
0
10
20
30
40
50
60
70
30
101
172
243
314
385
456
527
598
670
741
812
883
954
1025
1096
1167
1238
1309
1380
1451
1522
1593
1664
1735
1807
1878
1949
Frequency (MHz)
dBuV/m
3M C-PLY19 (0.75mil)
FR4 (3.54mil)
Full Wave Darkroom
Radiated Emission Test Result 30MHz - 2GHz
Radiated Emission Test in standard full wave darkwave for FR4/ECM board.
Obvious better performance of ECM board from 30M to 2G ( only tested up to 2G)
Board Level EMC Performance Comparison – Test
Result
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
12
The Application Prospect of the Embedded
Capacitance Materials
Due to excellent performance of Embedded Capacitance Material in
SI , PI , EMC, it will be well suitable for application in:
1. Digital/analog Interference Design with Digital/analog Mixed Board
2. EMC Design of the Non-shielding Box-type Products with Plastics
shell
3. Power Integrity and Signal Integrity Design of the High Speed and
High Density Board
Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan
Simulation and Design of Printed Circuit Boards Utilizing Novel
Embedded Capacitance Material
13
Questions