DSC1102/22 Datasheet by Microchip Technology

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DSC] 102 AEIIIEIIEL" Features Pin 1 Tn 6 Enable Ternv‘ Sensor & Vm Compensation Circuitry Pin 2 l i J Pln 5 NC MEMS _ PLL _ Divider Gum! Osdllamr Driver Hr? Tn 4 GND Output EN Pin DSC1102 DSC1122 High Outputs Active Outputs Active NC Outputs Active Outputs Active Low Standby Outputs Disabled
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DSC1102 | DSC1122 Page 1 MK-Q-B-P-D-110410-02-6
Low-Jitter Precision LVPECL Oscillator
DSC1102
DSC1122
General Description
The DSC1102 & DSC1122 series of high
performance oscillators utilizes a proven
silicon MEMS technology to provide excellent
jitter and stability over a wide range of
supply voltages and temperatures. By
eliminating the need for quartz or SAW
technology, MEMS oscillators significantly
enhance reliability and accelerate product
development, while meeting stringent clock
performance criteria for a variety of
communications, storage, and networking
applications.
DSC1102 has a standby feature allowing it to
completely power-down when EN pin is
pulled low; whereas for DSC1122, only the
outputs are disabled when EN is low. Both
oscillators are available in industry standard
packages, including the small 3.2x2.5 mm2,
and are “drop-in” replacements for standard
6-pin LVPECL quartz crystal oscillators.
Block Diagram
Output Enable Modes
EN Pin
DSC1102
DSC1122
High
Outputs Active
Outputs Active
NC
Outputs Active
Outputs Active
Low
Standby
Outputs Disabled
Features
Low RMS Phase Jitter: <1 ps (typ)
High Stability: ±10, ±25, ±50 ppm
Wide Temperature Range
o Industrial: -40° to 85° C
o Ext. commercial: -20° to 70° C
High Supply Noise Rejection: -50 dBc
Short Lead Time: 2 Weeks
Wide Freq. Range: 2.3 to 460 MHz
Small Industry Standard Footprints
o 2.5x2.0, 3.2x2.5, 5.0x3.2, & 7.0x5.0 mm
Excellent Shock & Vibration Immunity
o Qualified to MIL-STD-883
High Reliability
o 20x better MTF than quartz oscillators
Low Current Consumption
Supply Range of 2.25 to 3.6 V
Standby & Output Enable Function
Lead Free & RoHS Compliant
LVDS & HCSL Versions Available
Applications
Storage Area Networks
o SATA, SAS, Fibre Channel
Passive Optical Networks
o EPON, 10G-EPON, GPON, 10G-PON
Ethernet
o 1G, 10GBASE-T/KR/LR/SR, and FCoE
HD/SD/SDI Video & Surveillance
PCI Express: Gen 1 & Gen 2
DisplayPort
Eli-mar — Enable Modes HBM CDM 1500 ZUnW> Temp Egngg %~ DSC11 0 2 C I 5 - 125.0000 T '_l Package : 7iox5iomm : 5‘0x3i2mm : 3i2x1.5mm : 2i5x1.0mm : 7iox5i0mm Sbablllg Picklng Freq (MHz) su Input logic high DSC1122 20 ns Output Logic Levels Output Transition time3 Rise Time Mazes:
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DSC1102 | DSC1122 Page 2 MK-Q-B-P-D-110410-02-6
DSC1102
DSC1122
Absolute Maximum Ratings
Item
Min
Max
Unit
Condition
Supply Voltage
-0.3
+4.0
V
Input Voltage
-0.3
VDD+0.3
V
Junction Temp
-
+150
°C
Storage Temp
-55
+150
°C
Soldering Temp
-
+260
°C
40sec max.
ESD
HBM
MM
CDM
-
4000
400
1500
V
Ordering Code
Note: 1000+ years of data retention on internal memory
Specifications
Notes:
1. Pin 6 VDD should be filtered with 0.1uf capacitor.
2. tsu is time to 100ppm of output frequency after VDD is applied and outputs are enabled.
3. Output Waveform and Test Circuit figures below define the parameters.
4. Output is enabled if pad is floated or not connected.
Parameter
Condition
Min.
Typ.
Max.
Unit
Supply Voltage1
VDD
2.25
3.6
V
Supply Current
IDD
EN pin low outputs are disabled
DSC1102
DSC1122
20
0.095
22
mA
Frequency Stability
Δf
Includes frequency variations due
to initial tolerance, temp. and
power supply voltage
±10
±25
±50
ppm
Aging
Δf
1 year @25°C
±5
ppm
Startup Time2
tSU
T=25°C
5
ms
Input Logic Levels
Input logic high
Input logic low
VIH
VIL
0.75xVDD
-
-
0.25xVDD
V
Output Disable Time3
tDA
5
ns
Output Enable Time
tEN
DSC1102
DSC1122
5
20
ms
ns
Enable Pull-Up Resistor4
Pull-up resistor exist
40
kΩ
LVPECL Outputs
Supply Current
IDD
Output Enabled, RL=50Ω
56.5
58
mA
Output Logic Levels
Output logic high
Output logic low
VOH
VOL
RL=50Ω
VDD-1.08
-
-
VDD-1.55
V
Pk to Pk Output Swing
Single-Ended
800
mV
Output Transition time3
Rise Time
Fall Time
tR
tF
20% to 80%
RL=50Ω, CL= 0pF
250
ps
Frequency
f0
Single Frequency
2.3
460
MHz
Output Duty Cycle
SYM
Differential
48
52
%
Period Jitter
JPER
2.5
psRMS
Integrated Phase Noise
JPH
200kHz to 20MHz @156.25MHz
100kHz to 20MHz @156.25MHz
12kHz to 20MHz @156.25MHz
0.25
0.38
1.7
2
psRMS
DSC11
125.0000
Freq (MHz)
125.0000
0
Enable Modes
0: Enable/Standby
2: Enable/Disable
-
Packing
T: Tape & Reel
: Tube
2
C
I
5
Package
A: 7.0x5.0mm
B: 5.0x3.2mm
C: 3.2x2.5mm
D: 2.5x2.0mm
N: 7.0x5.0mm (no center pad)
Temp Range
E: -20 to 70
I: -40 to 85
L: -40 to 105
Stability
1: ±50ppm
2: ±25ppm
5: ±10ppm
T
animal." + -I- I‘H "HM
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DSC1102 | DSC1122 Page 3 MK-Q-B-P-D-110410-02-6
DSC1102
DSC1122
Nominal Performance Parameters (Unless specified otherwise: T=25° C, VDD=3.3 V)
Power supply rejection ratio
Phase jitter (integrated phase noise)
Output Waveform
Typical Termination Scheme
-80
-70
-60
-50
-40
-30
-20
-10
0
0.1 1 10 100 1000 10000
Rejection (dBc)
Supply Noise Frequency (kHz)
50-mV
100-mV
0.0
0.5
1.0
1.5
2.0
2.5
0200 400 600 800 1000
Phase Jitter (ps RMS)
Low-end of integration BW: x kHz to 20 MHz
156MHz-LVPECL
212MHz-LVPECL
320MHz-LVPECL
410MHz-LVPECL
VIL
1/fo
Output
Enable
tDA
tEN
tF
tR
VIH
80%
20%
50%
Output
830 mv
VDD
0.1uF
82
130
100
82
130
VDD
2
3 4
5
6
mm iw€ MSL 1 Q 260 C refer to Jsm-ozoc Ramp-Up Rate (2009c to Peak Temp) 3 C/Sec Max. Preneat Time 150°C to not 60-180 Sec Time maintained above 217Dc 50-150 Sec Peak Temperature 255-260 c Time within sac of actual Peak 20-40 Sec Ramp-Down Rate a C/Sec Max. Time 25°C to Peak Temperature
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DSC1102 | DSC1122 Page 4 MK-Q-B-P-D-110410-02-6
DSC1102
DSC1122
Test Circuit
Solder Reflow Profile
0.1uF
VDD 0.01uF
IDD
VDA
6 4
5
1 3
2
LVPECL
LVPECL
VTT
50Ω50Ω
VTT= VDD- 2.0V
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
3°C/Sec Max.
Preheat Time 150°C to 200°C
60-180 Sec
Time maintained above 217°C
60-150 Sec
Peak Temperature
255-260°C
Time within 5°C of actual Peak
20-40 Sec
Ramp-Down Rate
6°C/Sec Max.
Time 25°C to Peak Temperature
8 min Max.
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
Reflow
Cool
Time
Temperature (°C)
3C/Sec Max.
6C/Sec Max.
200°C
217°C
150°C
25°C
260°C
3C/Sec Max.
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
Reflow
Cool
Time
Temperature (°C)
3C/Sec Max.
6C/Sec Max.
200°C
217°C
150°C
25°C
260°C
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
Reflow
Cool
Time
Temperature (°C)
3C/Sec Max.
6C/Sec Max.
200°C
217°C
150°C
25°C
260°C
3C/Sec Max.
mm EXTERNAL DIMENSIONS %fl rwwrmffi RECOMMENDED SOLDER PAD LAVOUT EXTERNAL DIMENSIONS J WH ifi+ RECOMMENDED SOLDER PAD LAVOUT
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DSC1102 | DSC1122 Page 5 MK-Q-B-P-D-110410-02-6
DSC1102
DSC1122
Package Dimensions
7.0 x 5.0 mm Plastic Package
1 2 3
46 5
7±0.10 [0.276±0.004]
5±0.10 [0.197±0.004]
123
465
1.1±0.01[0.43±0.004]
3.7 [0.146] REF
0.85±0.05
1.4 [0.055] 2.6 [0.102]
123
4
5
2.54[0.100]
Via to Power
Trace
Via to Ground
Plane
No. Pin Terminal
1 Enable
2 N/C
3 Ground
4
5 OUT-
6 VDD
OUT
6
EXTERNAL DIMENSIONS
Units: mm [ inches]
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
2.54 [0.100]
1.4±0.10 [0.055±0.004]
1.8 [0.071]
2.8 [0.110]
1.4 [0.055]
PAD TIE TO GND
5.0 x 3.2 mm Plastic Package
12 3
4
65
5±0.05 [0.197±0.002]
3.2±0.05 [0.126±0.002]
12
3
4 65
1.27 [0.050]
0.7±0.1 [0.079±0.002]
1.2 [0.047] REF
0.85±0.05
0.64 [0.025]
1.1 [ 0.043]
1.2 [0.047] REF
1 2 3
45
1.27[0.05]
Via to Power
Trace
Via to Ground
Plane
No. Pin Terminal
1 Enable
2 N/C
3 Ground
4
5 OUT-
6 VDD
OUT
6
EXTERNAL DIMENSIONS
Units: mm [ inches]
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
0.64±0.05
emu-EL EXTERNAL DIMENSIONS RECOMMENDED SOLDER PAD LAVOUT Li O f‘ i L EXTERNAL DIMENSIONS RECOMMENDED SDLDER PAD LAYOUT O
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DSC1102 | DSC1122 Page 6 MK-Q-B-P-D-110410-02-6
DSC1102
DSC1122
3.2 x 2.5 mm Plastic Package
1 2 3
46 5
3.2±0.05 [0.126±0.002]
2.5±0.05 [0.098±0.002]
12
3
4 65
0.5±0.05 [0.198±0.002]
0.9±0.05 [0.035±0.002]
1.05 [0.041]
0.7±0.1 [0.079±0.002]
0.1[0.004] REF
0.9 [0.035] REF
0.85±0.05
0.5 [0.197]
0.9 [0.035]
1 [ 0.039]
0.9 [0.035] REF
1 2 3
45
0.375
Via to Power
Trace
Via to Ground
Plane
No. Pin Terminal
1 Enable
2 N/C
3 Ground
4
5 OUT-
6 VDD
OUT
6
EXTERNAL DIMENSIONS
Units: mm [ inches]
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
2.5 x 2.0 mm Plastic Package
123
46 5
2.5±0.05 [0.098±0.002]
2.0±0.05 [0.079±0.002]
12
3
4 65
0.25±0.05 [0.099±0.002]0.65±0.05 [0.026±0.002]
0.825 [0.032]
0.7±0.1 [0.079±0.002]
0.765±0.1
0.535 REF
0.6 REF
0.7±0.1 [0.079±0.002]
0.85±0.05
0.25±0.05 [0.099±0.002]
0.65±0.05 [0.026±0.002]
0.85
0.7 REF
1 2 3
456
0.375
Via to
Power Trace
Via to Ground
Plane
No. Pin Terminal
1 Enable
2 N/C
3 Ground
4
5 OUT-
6 VDD
OUT
EXTERNAL DIMENSIONS
Units: mm [ inches]
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
Emma EXTERNAL DIMENSIONS RECOMMENDED SOLDER PAD lAVOU'f Pl; m: E a rwwr/W %% Ill Disclaimer: USA www.micrel.oom
______________________________________________________________________________________________________________________________________________
DSC1102 | DSC1122 Page 7 MK-Q-B-P-D-110410-02-6
DSC1102
DSC1122
7.0 x 5.0 mm Plastic Package
1 2 3
46 5
7±0.10 [0.276±0.004]
5±0.10 [0.197±0.004]
123
465
1.1±0.01[0.43±0.004]
3.7 [0.146] REF
0.85±0.05
1.4 [0.055] 2.6 [0.102]
123
4
5
2.54[0.100]
Via to Power
Trace
Via to Ground
Plane
No. Pin Terminal
1 Enable
2 N/C
3 Ground
4
5 OUT-
6 VDD
OUT
6
EXTERNAL DIMENSIONS
Units: mm [ inches]
RECOMMENDED SOLDER PAD LAYOUT
Units: mm [ inches]
2.54 [0.100]
1.4±0.10 [0.055±0.004]
1.4 [0.055]
Disclaimer:
Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a
warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license,
whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of
sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to
result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose
failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or
systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
MICREL, Inc. 2180 Fortune Drive, San Jose, California 95131 USA
Phone: +1 (408) 944-0800 Fax: +1 (408) 474-1000 Email: hbwhelp@micrel.com www.micrel.com

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