SmartFusion2 Pin Descriptions Datasheet by Microchip Technology

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O Microsemi
December 2015 1
© 2015 Microsemi Corporation
SmartFusion2 Pin Descriptions
User I/Os
SmartFusion®2 system-on-chip (SoC) field programmable gate array (FPGA) devices feature a flexible
I/O structure that supports a range of mixed voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V) through bank
selection. The MSIO, MSIOD, and DDRIO can be configured as differential I/Os or two single-ended
I/Os. These I/Os use one I/O slot to implement single-ended standards and two I/O slots for differential
standards. The DDRIO is shared between fabric logic and MDDR/FDDR whereas MSIO/MSIOD is
shared between MSS peripherals and fabric logic. When an MDDR/FDDR controller or MSS peripheral is
not used, the respective I/Os are available to fabric logic.
For functional block diagrams of MSIO, MSIOD, and DDRIO, refer to the UG0445: IGLOO2 FPGA and
SmartFusion2 SoC FPGA Fabric User Guide.
For supported I/O standards, refer to the “Supported Voltage Standards” table in the UG0445: IGLOO2
FPGA and SmartFusion2 SoC FPGA Fabric User Guide.
Bank Location Diagrams
I/Os are grouped on the basis of I/O voltage standard. The grouped I/Os of each voltage standard form
an I/O bank. Each I/O bank has dedicated I/O supply and ground voltages. Because of these dedicated
supplies, only I/Os with compatible standards can be assigned to the same I/O voltage bank.
Note: For M2S150-FC1152 device, SERDES blocks are not available in bank 9, 10, 12, and 13.
Figure 1 • SmartFusion2 M2S150TS/M2S150T/M2S150-FC1152 I/O Bank Locations
West
East
Bank 1
DDRIO / FDDR
(44 pairs)
Bank 3
MSIO
(21 pairs)
Bank 15
MSIOD
(18 pairs)
Bank 16
MSIOD
(27 pairs)
Bank 4
MSIO
(22 pairs)
Bank 17
MSIO
(20 pairs)
North
South
SmartFusion2
SoC FPGA
M2S150TS/M2S150T/M2S150
FC1152
Bank 5
MSIO
(21 pairs)
Bank 18
MSIO
(21 pairs)
Bank 7
JTAG
Bank 6
MSIO
(15 pairs)
Bank 14
MSIO
(7 pairs)
Bank 13
MSIOD /
SERDES0
(2 pairs)
Bank 12
MSIOD /
SERDES1
(2 pairs)
Bank 11
MSIO
(4 pairs)
Bank 10
MSIOD /
SERDES2
(2 pairs)
Bank 9
MSIOD /
SERDES3
(2 pairs)
Bank 8
MSIO
(9 pairs)
Bank 2
DDRIO / MDDR
(44 pairs)
Bank 0
MSIO
(6 pairs)
Revision 10
DS0115
O Microsemi
2 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 1, there are 21 single-ended user I/Os. Pin H27, MSI46NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI46NB1 is an input only pin.
2. For M2S050-FG896 device, SERDES blocks are not available in bank 6 and bank 9.
Figure 2 • SmartFusion2 M2S050TS/M2S050T/M2S050-FG896 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(44 pairs)
Bank 1
MSIO
(10 pairs)
Bank 6
MSIOD / SERDES_0
(2 pairs)
Bank 7
MSIOD
(27 pairs)
Bank 2
MSIO
(13 pairs)
Bank 8
MSIO
(23 pairs)
Bank 5
DDRIO / FDDR
(44 pairs)
North
South
SmartFusion2
SoC FPGA
M2S050TS/M2S050T/M2S050
FG896
Bank 4
JTAG
Bank 3
MSIO
(23 pairs)
Bank 9
MSIOD / SERDES_1
(2 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 3
Notes:
1. In bank 2, there are 21 single-ended user I/Os. Pin D23, MSI59NB2/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI59NB2 is an input only pin.
2. For M2S090-FG676 device, the SERDES block is not available in bank 6.
Figure 3 • SmartFusion2 M2S090TS/M2S090T/M2S090-FG676 I/O Bank Locations
West East
Bank 1
DDRIO / MDDR
(38 pairs)
Bank 6
MSIOD / SERDES 0
(2 pairs)
Bank 7
MSIOD
(18 pairs)
Bank 2
MSIO
(10 pairs)
Bank 8
MSIO
(40 pairs)
Bank 5
MSIO
(41 pairs)
North
South
SmartFusion2
SoC FPGA
M2S090TS/M2S090T/M2S090
FG676
Bank 4
JTAG
Bank 3
MSIO
(48 pairs)
Bank 0
MSIO
(15 pairs)
G Microsemi
4 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. For the M2S060-FG676 device, SERDES block is not available in bank7.
Figure 4 • SmartFusion2 M2S060TS/ M2S060T/M2S060-FG676 I/O Bank Locations
West
East
Bank 1
DDRIO / MDDR
(38 pairs)
Bank 7
MSIOD / SERDES_0
(2 pairs)
Bank 8
MSIOD
(18 pairs)
Bank 2
MSIO
(10 pairs)
Bank 9
MSIO
(35 pairs)
Bank 6
MSIO
(38 pairs)
North
South
SmartFusion2
SoC FPGA
M2S060TS/M2S060T/M2S060
FG676
Bank 4
MSIO
(23 pairs)
Bank 5
JTAG
Bank 3
MSIO
(14 pairs)
Bank 0
MSIO
(15 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 5
Notes:
1. For the M2S150-FCS536 device, SERDES interface is not available in bank 9, 10,12, and 13.
Figure 5 • SmartFusion2 M2S150TS/M2S150T/M2S150-FCS536 I/O Bank Locations
West
East
Bank 1
FDDRIO / FDDR
(30 pairs)
Bank 3
MSIO
(3 pairs)
Bank 15
MSIOD
(3 pairs)
Bank 16
MSIOD
(4 pairs)
Bank 4
MSIO
(16 pairs)
Bank 17
MSIO
(18 pairs)
North
South
SmartFusion2
SoC FPGA
M2S150TS/M2S150T/M2S150
FCS536
Bank 5
MSIO
(5 pairs)
Bank 18
MSIO
(11 pairs)
Bank 7
JTAG
Bank 14
MSIO
(2 pairs)
Bank 13
MSIOD /
SERDES_0
(1 pair)
Bank 12
MSIOD /
SERDES_1
(1 pair)
Bank 11
MSIO
(4 pairs)
Bank 10
MSIOD /
SERDES_2
(1 pair)
Bank 9
MSIOD /
SERDES_3
(1 pair)
Bank 8
MSIO
(2 pairs)
Bank 2
DDRIO / MDDR
(32 pairs)
Bank 0
MSIO
(4 pairs)
G Microsemi
6 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 2, there are 21 single-ended user I/Os. Pin D21, MSI59NB2/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI59NB2 is an input only pin.
2. For M2S090-FG484 device, SERDES block is not available in bank 6.
Figure 6 • SmartFusion2 M2S090TS/M2S090T/M2S090-FG484 I/O Bank Locations
West East
Bank 1
DDRIO / MDDR
(35 pairs)
Bank 6
MSIOD/SERDES 0
(2 pairs)
Bank 7
MSIOD
(18 pairs)
Bank 2
MSIO
(10 pairs)
Bank 8
MSIO
(20 pairs)
Bank 5
MSIO
(26 pairs)
North
South
SmartFusion2
SoC FPGA
M2S090TS/M2S090T/M2S090
FG484
Bank 4
JTAG
Bank 3
MSIO
(22 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 7
Notes:
1. For the M2S060S-FG484 and M2S060-FG484 devices, SERDES block is not available in bank 7.
2. In bank 2, there are 21 single-ended user I/Os. Pin D21, MSI47NB2/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI47NB2 is an input only pin.
Figure 7 • SmartFusion2 M2S060TS/M2S060T/M2S060-FG484 I/O Bank Locations
West
East
Bank 1
DDDRIO / MDDR
(35 pairs)
Bank 7
MSIOD/SERDES
(2 pairs)
Bank 8
MSIOD
(18 pairs)
Bank 2
MSIO
(10 pairs)
Bank 9
MSIO
(20 pairs)
Bank 6
MSIO
(26 pairs)
North
South
SmartFusion2
SoC FPGA
M2S060TS/M2S060T/M2S060
FG484
Bank 5
JTAG
Bank 4
MSIO
(22 pairs)
o Microsemi
8 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 1, there are 21 single-ended user I/Os. Pin D21, MSI46NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI46NB1 is an input only pin.
2. For M2S050-FG484 device, SERDES block is not available in bank 6.
Figure 8 • SmartFusion2 M2S050TS/M2S050T/M2S050-FG484 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(35 pairs)
Bank 6
MSIOD/SERDES 0
(2 pairs)
Bank 7
MSIOD
(18 pairs)
Bank 1
MSIO
(10 pairs)
Bank 8
MSIO
(20 pairs)
Bank 5
DDRIO
(26 pairs)
North
South
SmartFusion2
SoC FPGA
M2S050TS/M2S050T/M2S050
FG484
Bank 4
JTAG
Bank 3
MSIO
(22 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 9
Notes:
1. In bank 1, there are 21 single-ended user I/Os. Pin D21, MSI32NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI32NB1 is an input only pin.
2. For M2S025-FG484 device, SERDES block is not available in bank 5.
Figure 9 • SmartFusion2 M2S025TS/M2S025T/M2S025-FG484 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(35 pairs)
Bank 5
MSIOD/SERDES 0
(2 pairs)
Bank 6
MSIOD
(18 pairs)
Bank 1
MSIO
(10 pairs)
Bank 7
MSIO
(20 pairs)
Bank 4
MSIO
(26 pairs)
North
South
SmartFusion2
SoC FPGA
M2S025TS/M2S025T/M2S025
FG484
Bank 3
JTAG
Bank 2
MSIO
(22 pairs)
G Microsemi
10 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 1, there are 15 single-ended user I/Os. Pin D21, MSI26NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI32NB1 is an input only pin.
2. For M2S010-FG484 device, SERDES block is not available in bank 5.
Figure 10 • SmartFusion2 M2S010TS/M2S010T/M2S010-FG484 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(35 pairs)
Bank 5
MSIOD/SERDES 0
(2 pairs)
Bank 6
MSIOD
(18 pairs)
Bank 1
MSIO
(7 pairs)
Bank 7
MSIO
(18 pairs)
Bank 4
MSIO
(17 pairs)
North
South
SmartFusion2
SoC FPGA
M2S010TS/M2S010T/M2S010
FG484
Bank 3
JTAG
Bank 2
MSIO
(19 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 11
Note: In bank 1 there are 9 single-ended user I/Os. Pin D21, MSI16NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI16NB1 is an input only pin.
Figure 11 • SmartFusion2 M2S005S/M2S005-FG484 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(33 pairs)
Bank 5
MSIOD
(14 pairs)
Bank 1
MSIO
(4 pairs)
Bank 6
MSIO
(15 pairs)
North
South
SmartFusion2
SoC FPGA
M2S005S/M2S005
FG484
Bank 3
JTAG
Bank 2
MSIO
(12 pairs)
Bank 4
MSIO
(26 pairs)
o Microsemi
12 Revision 10
SmartFusion2 Pin Descriptions
Note: For the M2S150-FCV484 device, SERDES block is not available in banks 9, 10, 12, and 13.
Figure 12 • SmartFusion2 M2S150TS/M2S150T/M2S150-FCV484 I/O Bank Locations
West
East
Bank 1
DDRIO / FDDR
(29 pairs)
Bank 3
MSIO
(3 pairs)
Bank 16
MSIOD
(13 pairs)
Bank 4
MSIO
(19 pairs)
North
South
SmartFusion2
SoC FPGA
M2S150TS/M2S150T/M2S150
FCV484
Bank 17
MSIO
(4 pairs)
Bank 7
JTAG
Bank 5
MSIO
(9 pairs)
Bank 14
MSIO
(4 pairs)
Bank 13
MSIOD /
SERDES_0
(1 pair)
Bank 12
MSIOD /
SERDES_1
(1 pair)
Bank 11
MSIO
(2 pairs)
Bank 10
MSIOD /
SERDES_2
(1 pair)
Bank 9
MSIOD /
SERDES_3
(1 pair)
Bank 2
DDRIO / MDDR
(32 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 13
Note: For the M2S060-VF400 device, SERDES block is not available in bank 7.
Figure 13 • SmartFusion2 M2S060TS/M2S060T/M2S060-VF400 I/O Bank Locations
West
East
Bank 1
DDRIO / MDDR
(32 pairs)
Bank 7
MSIOD / SERDES_0
(2 pairs)
Bank 8
MSIOD
(14 pairs)
Bank 2
MSIO
(10 pairs)
Bank 9
MSIO
(11 pairs)
Bank 6
MSIO
(12 pairs)
North
South
SmartFusion2
SoC FPGA
M2S060TS/M2S060T/M2S060
VF400
Bank 5
JTAG
Bank 4
MSIO
(22 pairs)
o Microsemi
14 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 1, there are 21 single-ended user I/Os. Pin D18, MSI46NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI46NB1 is an input only pin.
2. For M2S050-VF400 device, SERDES block is not available in bank 6.
Figure 14 • SmartFusion2 M2S050TS/M2S050T/M2S050-VF400 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 6
MSIOD/SERDES 0
(2 pairs)
Bank 7
MSIOD
(14 pairs)
Bank 1
MSIO
(10 pairs)
Bank 8
MSIO
(11 pairs)
Bank 5
DDRIO
(12 pairs)
North
South
SmartFusion2
SoC FPGA
M2S050TS/M2S050T/M2S050
VF400
Bank 4
JTAG
Bank 3
MSIO
(22 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 15
Notes:
1. In bank 1, there are 21 single-ended user I/Os. Pin D18, MSI32NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI32NB1 is an input only pin.
2. For M2S025-VF400 device, SERDES block is not available in bank 5.
Figure 15 • SmartFusion2 M2S025TS/M2S025T/M2S025-VF400 I/O Bank Locations
G Microsemi
16 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 1 there are 15 single-ended user I/Os. Pin D18, MSI26NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI26NB1 is an input only pin.
2. For M2S010-VF400 device, SERDES block is not available in bank 5.
Figure 16 • SmartFusion2 M2S010TS/M2S010T/M2S010-VF400 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 5
MSIOD/SERDES 0
(2 pairs)
Bank 6
MSIOD
(14 pairs)
Bank 1
MSIO
(7 pairs)
Bank 7
MSIO
(11 pairs)
Bank 4
MSIO
(12 pairs)
North
South
SmartFusion2
SoC FPGA
M2S010TS/M2S010T/M2S010
VF400
Bank 3
JTAG
Bank 2
MSIO
(19 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 17
Note: In bank 1 there are 9 single-ended user I/Os. Pin D18, MSI16NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C, cannot
be configured as differential. The function MSI16NB1 is an input only pin.
Figure 17 • SmartFusion2 M2S005S/M2S005-VF400 I/O Bank Locations
Note: For M2S090-FCS325 device, SERDES block is not available in bank 6.
Figure 18 • SmartFusion2 M2S090TS/M2S090T/M2S090-FCS325 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 5
MSIOD
(14 pairs)
Bank 1
MSIO
(4 pairs)
Bank 6
MSIO
(11 pairs)
North
South
SmartFusion2
SoC FPGA
M2S005S/M2S005
VF400
Bank 3
JTAG
Bank 2
MSIO
(12 pairs)
Bank 4
MSIO
(12 pairs)
West
East
Bank 1
DDRIO / MDDR
(32 pairs)
Bank 6
MSIOD / SERDES 0
(2 pairs)
Bank 7
MSIOD
(4 pairs)
Bank 2
MSIO
(5 pairs)
Bank 8
MSIO
(20 pairs)
Bank 5
MSIO
(2 pairs)
North
South
SmartFusion2
SoC FPGA
M2S090TS/M2S090T/M2S090
FCS325
Bank 4
JTAG
Bank 3
MSIO
(21 pairs)
G Microsemi
18 Revision 10
SmartFusion2 Pin Descriptions
Note: For M2S060-FCS325 device, SERDES block is not available in bank 7.
Figure 19 • SmartFusion2 M2S060-FCS325 I/O Bank Locations
Bank 4
MSIO
(16 pairs)
West
East
Bank 1
DDRIO / MDDR
(32 pairs)
Bank 7
MSIOD / SERDES 0
(2 pairs)
Bank 2
MSIO
(5 pairs)
Bank 8
MSIOD
(9 pairs)
North
South
SmartFusion2
SoC FPGA
M2S060-FCS325
Bank 3
MSIO
(6 pairs)
Bank 6
MSIO
(12 pairs)
Bank 5
JTAG
Bank 9
MSIO
(18 pairs)
OMicrosemi.
SmartFusion2 Pin Descriptions
Revision 10 19
Note: For M2S050-FCS325 device, SERDES block is not available in bank 6.
Figure 20 • SmartFusion2 M2S050TS/M2S050T/M2S050-FCS325 I/O Bank Locations
West East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 6
MSIOD / SERDES 0
(2 pairs)
Bank 1
MSIO
(5 pairs)
Bank 7
MSIOD
(9 pairs)
North
South
SmartFusion2
SoC FPGA
M2S050TS/M2S050T/M2S050
FCS325
Bank 2
MSIO
(6 pairs)
Bank 5
DDRIO
(12 pairs)
Bank 3
MSIO
(16 pairs)
Bank 4
JTAG
Bank 8
MSIO
(18 pairs)
G Microsemi
20 Revision 10
SmartFusion2 Pin Descriptions
Note: For M2S025-FCS325 device, SERDES block is not available in bank 5.
Figure 21 • SmartFusion2 M2S025TS/M2S025T/M2S025-FCS325 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 5
MSIOD / SERDES 0
(2 pairs)
Bank 1
MSIO
(5 pairs)
Bank 6
MSIOD
(9 pairs)
North
South
SmartFusion2
SoC FPGA
M2S025TS/M2S025T/M2S025
FCS325
Bank 2
MSIO
(16 pairs)
Bank 4
MSIO
(12 pairs)
Bank 3
JTAG
Bank 7
MSIO
(14 pairs)
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 21
Notes:
1. In bank 1, there are 4 single-ended user I/Os. Pin G12, MSIO32NB1/MMUART_0_TXD/GPIO_27_B, cannot be
configured as differential. The function MSI32NB1 is an input only pin.
2. For M2S025-VF256 device, SERDES block is not available in bank 5.
Figure 22 • SmartFusion2 M2S025TS/M2S025T/M2S025-VF256 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 5
MSIOD / SERDES 0
(2 pairs)
Bank 6
MSIOD
(0 pairs)
Bank 7
MSIO
(5 pairs)
Bank 4
MSIO
(14 pairs)
North
South
SmartFusion2
SoC FPGA
M2S025TS/M2S025T/M2S025
VF256
Bank 3
JTAG
Bank 2
MSIO
(12 pairs)
Bank 1
MSIO
(0 pair)
G Microsemi
22 Revision 10
SmartFusion2 Pin Descriptions
Notes:
1. In bank 1, there are 4 single-ended user I/Os. Pin G12, MSI26NB1/MMUART_0_TXD/GPIO_27_B, cannot be configured
as differential. The function MSI26NB1 is an input only pin.
2. For M2S010-VF256 device, SERDES block is not available in bank 5.
Figure 23 • SmartFusion2 M2S010TS/M2S010T/M2S010-VF256 I/O Bank Locations
West
East
Bank 0
DDRIO / MDDR
(32 pairs)
Bank 5
MSIOD / SERDES 0
(2 pairs)
Bank 6
MSIOD
(0 pairs)
Bank 7
MSIO
(5 pairs)
Bank 4
MSIO
(14 pairs)
North
South
SmartFusion2
SoC FPGA
M2S010TS/M2S010T/M2S010
VF256
Bank 3
JTAG
Bank 2
MSIO
(12 pairs)
Bank 1
MSIO
(0 pair)
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 23
Note: In bank 1 there are 9 single-ended user I/Os. Pin D12, MSI16NB1/MMUART_0_TXD/GPIO_27_B, cannot be configured
as differential. The function MSI16NB1 is an input only pin.
Figure 24 • SmartFusion2 M2S005S/M2S005-VF256 I/O Bank Locations
West
East
Bank 0
DDRIO
(15 pairs)
Bank 5
MSIOD
(6 pairs)
Bank 6
MSIO
(14 pairs)
Bank 4
MSIO
(29 pairs)
North
South
SmartFusion2
SoC FPGA
M2S005S/M2S005
VF256
Bank 3
JTAG
Bank 2
MSIO
(12 pairs)
Bank 1
MSIO
(4 pairs)
G Microsemi
24 Revision 10
SmartFusion2 Pin Descriptions
Figure 25 • SmartFusion2 M2S010-TQ144 I/O Bank Locations
West
East
Bank 0
DDRIO
(10 pairs)
Bank 6
MSIOD
(4pairs)
Bank 2
MSIO
(7 pairs)
Bank 7
MSIO
(7pairs)
Bank 4
MSIO
(9 pairs)
North
South
SmartFusion2
SoC FPGA
M2S010-TQ144
Bank 3
JTAG
O Microsemi
SmartFusion2 Pin Descriptions
Revision 10 25
Figure 26 • SmartFusion2 M2S005S/M2S005-TQ144 I/O Bank Locations
West
East
Bank 0
DDRIO
(10 pairs)
Bank 5
MSIOD
(3 pairs)
Bank 2
MSIO
(7 pairs)
Bank 6
MSIO
(8 pairs)
Bank 4
MSIO
(10 pairs)
North
South
SmartFusion2
SoC FPGA
M2S005S/M2S005
TQ144
Bank 3
JTAG
o Microsemi
26 Revision 10
SmartFusion2 Pin Descriptions
Table 1 • Organization of I/O Banks in SmartFusion2 Devices - FC1152, FCS536, FCV484, FG896, FG676, and FG484
FC1152 FCS536 FCV484 FG896 FG676 FG484
Bank No.
M2S150TS
M2S150T
M2S150
M2S150TS
M2S150T
M2S150
M2S150TS
M2S150T
M2S150
M2S050TS
M2S050T
M2S050
M2S090TS
M2S090T
M2S090
M2S060TS
M2S060T
M2S060
M2S090TS
M2S090T
M2S090
M2S060TS
M2S060T
M2S060
M2S050TS
M2S050T
M2S050
M2S025TS
M2S025T
M2S025
M2S010TS
M2S010T
M2S010 M2S005S
Bank 0 MSIO:
fabric
MSIO:
fabric
– DDRIO:
MDDR or
fabric
MSIO:
fabric
MSIO:
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
Bank 1 DDRIO:
FDDR or
fabric
DDRIO:
FDDR or
fabric
DDRIO:
FDDR or
fabric
MSIO:
MSS or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
MSIO: MSS
or fabric
MSIO: MSS
or fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
Bank 2 DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
MSIO:
fabric
MSIO:
MSS or
fabric
MSIO:
fabric
MSIO: MSS
or fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
Bank 3 MSIO: MSS
or fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
MSIO:
fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
Bank 4 MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
JTAG/
SWD
JTAG/
SWD
MSIO:
fabric
JTAG/
SWD
MSIO:
fabric
JTAG/
SWD
MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
Bank 5 MSIO: MSS
or fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
DDRIO:
FDDR or
fabric
MSIO:
fabric
JTAG/
SWD
MSIO:
fabric
JTAG/
SWD
DDRIO:
FDDR or
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
Bank 6 MSIO: fabric MSIO: fabric MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
MSIO:
fabric
MSIOD:
SERDES 0
or fabric
MSIO:
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIOD:
fabric
MSIO:
fabric
Bank 7 JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
MSIOD:
fabric
MSIOD:
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIO:
fabric
MSIO:
fabric
Bank 8 MSIO:
fabric
MSIO:
fabric
–MSIO:
fabric
MSIO:
fabric
MSIOD:
SERDES 0
or fabric
MSIO:
fabric
MSIOD:
fabric
MSIO:
fabric
––
Note: Banks that are shaded should always be powered with the appropriate VDDI bank supplies.
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 27
Bank 9 MSIOD:
SERDES 3
or fabric
MSIOD:
SERDES 3
or fabric
MSIOD:
SERDES 3
or fabric
MSIOD:
SERDES 1
or fabric
–MSIO:
fabric
–MSIO:
fabric
–––
Bank 10 MSIOD:
SERDES 2
or fabric
MSIOD:
SERDES 2
or fabric
MSIOD:
SERDES 2
or fabric
–– –
Bank 11 MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
–– –
Bank 12 MSIOD:
SERDES 1
or fabric
MSIOD:
SERDES 1
or fabric
MSIOD:
SERDES 1
or fabric
–– –
Bank 13 MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
–– –
Bank 14 MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
–– –
Bank 15 MSIOD:
fabric
MSIOD:
fabric
––
Bank 16 MSIOD:
fabric
MSIOD:
fabric
MSIOD:
fabric
–– –
Bank 17 MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
–– –
Bank 18 MSIO:
fabric
MSIO:
fabric
––
Table 1 • Organization of I/O Banks in SmartFusion2 Devices - FC1152, FCS536, FCV484, FG896, FG676, and FG484 (continued)
FC1152 FCS536 FCV484 FG896 FG676 FG484
Bank No.
M2S150TS
M2S150T
M2S150
M2S150TS
M2S150T
M2S150
M2S150TS
M2S150T
M2S150
M2S050TS
M2S050T
M2S050
M2S090TS
M2S090T
M2S090
M2S060TS
M2S060T
M2S060
M2S090TS
M2S090T
M2S090
M2S060TS
M2S060T
M2S060
M2S050TS
M2S050T
M2S050
M2S025TS
M2S025T
M2S025
M2S010TS
M2S010T
M2S010 M2S005S
Note: Banks that are shaded should always be powered with the appropriate VDDI bank supplies.
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28 Revision 10
SmartFusion2 Pin Descriptions
Table 2 • Organization of I/O Banks in SmartFusion2 Devices - VF400, FCS325, VF256, and TQ144
VF400 FCS325 VF256 TQ144
Bank No
M2S060TS
M2S060T
M2S060
M2S050TS
M2S050T
M2S050
M2S025TS
M2S025T
M2S025
M2S010TS
M2S010T
M2S010 M2S005S
M2S090TS
M2S090T
M2S090
M2S060TS
M2S060T
M2S060
M2S050TS
M2S050T
M2S050
M2S025TS
M2S025T
M2S025
M2S025TS
M2S025T
M2S025
M2S010TS
M2S010T
M2S010 M2S005S M2S010 M2S005S
Bank 0 DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
fabric
DDRIO:
fabric
DDRIO:
fabric
Bank 1 DDRIO:
MDDR or
fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
DDRIO:
MDDR or
fabric
DDRIO:
MDDR or
fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
Bank 2 MSIO:
fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
MSIO:
fabric
MSIO:
fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO: MSS
or fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
MSIO:
MSS or
fabric
Bank 3 MSIO: MSS
or fabric
JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
MSIO:
fabric
MSIO:
fabric
MSIO:
MSS or
fabric
JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
JTAG/
SWD
Bank 4 MSIO:
fabric
JTAG/
SWD
MSIO:
fabric
MSIO: fabric MSIO:
fabric
JTAG/
SWD
MSIO:
fabric
JTAG/
SWD
MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
Bank 5 JTAG/
SWD
DDRIO:
FDDR or
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIO:
fabric
JTAG/
SWD
DDRIO:
FDDR or
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
–MSIOD:
fabric
Bank 6 MSIO:
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIOD:
fabric
MSIO:
fabric
MSIOD:
SERDES 0
or fabric
MSIO:
fabric
MSIOD:
SERDES 0
or fabric
MSIO:
fabric
MSIOD:
fabric
MSIOD:
fabric
MSIO:
fabric
MSIOD:
fabric
MSIO:
fabric
Bank 7 MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIO:
fabric
MSIO: fabric MSIOD:
fabric
MSIOD:
SERDES 0
or fabric
MSIOD:
fabric
MSIO:
fabric
MSIO:
fabric
MSIO:
fabric
–MSIO:
fabric
Bank 8 MSIOD:
fabric
MSIO:
fabric
––MSIO:
fabric
MSIOD:
fabric
MSIO:
fabric
–––
Bank 9 MSIO:
fabric
–– MSIO:
fabric
––
Note: Banks that are shaded should always be powered with the appropriate VDDI bank supplies.
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 29
All user I/Os have internal clamp diode control circuitry. A pull-up clamp diode must not be present in the
I/O circuitry if the hot-swap feature is used. The 3.3 V PCI standard requires a pull-up clamp diode on the
I/O, so it cannot be selected if hot-swap capability is required.
Table 3 • User I/O Types
Name Type Description
MSIOxyBz In/out MSIOs provide programmable drive strength, weak pull-up, and weak-pull-
down. In single ended mode, the I/O pair operates as two separate I/Os
named P and N. Some of these pins are also multiplexed with integrated
peripherals in the MSS (I2C, USB, SPI, UART, CAN, and fabric I/Os).This
allows MSIO pins to be multiplexed as I/Os for the FPGA fabric, the ARM®
Cortex®-M3 processor, or for given integrated MSS peripherals. MSIOs can be
routed to dedicated I/O buffers (MSSIOBUF) or in some cases to the FPGA
fabric interface through an IOMUX. SmartFusion2 I/O ports also support ESD
protection. MSIO I/O cells operate at up to 3.3 V and are capable of high-
speed LVDS2V5 and LVDS3V3 operation.
MSIODxyBz In/out MSIOD is very similar to MSIO, but drops 3.3 V and hot-plug support and adds
pre-emphasis, in order to achieve higher speeds. MSIODs provide
programmable drive strength, weak pull-up, and weak pull-down. MSIOD I/O
cells operate at up to 2.5 V and are capable of high-speed LVDS2V5
operation. Some of these pins are also multiplexed with the SERDES
interface. SmartFusion2 I/O ports support ESD protection.
DDRIOxyBz In/out The double data input output (DDRIO) is a multi-standard I/O optimized for
LPDDR/DDR2/DDR3 performance. In SmartFusion2 devices there are two
DDR subsystems: the fabric DDR and MSS DDR controllers. All DDRIOs can
be configured as differential I/Os or two single-ended I/Os. If you select
MDDR/FDDR, Libero SoC automatically connects MDDR/FDDR signals to the
DDRIOs. DDRIOs can be connected to the respective DDR subsystem PHYs
or can be used as user I/Os. Depending on the memory configuration, only the
required DDRIOs are used by Libero SoC. The unused DDRIOs are available
to connect to the fabric.
Note: For more information on I/O status of MSIO, MSIOD and DDRIO pins during power up/down
and default conditions, refer to AC396: SmartFusion2 and IGLOO2 in Hot Swapping and Cold
Sparing Application Note.
Figure 27 • Internal Clamp Diode Control Circuitry
Buffer
Pad
VDDI
PullupClampdiodepresents
in3.3VPCI,MSIODand
DDRIOs
PulldownClampdiode
presentsinalluserIO
standards
O Microsemi
30 Revision 10
SmartFusion2 Pin Descriptions
Naming Conventions
User I/O Naming Conventions
The naming convention used for each FPGA user I/O is IOxyBz, where:
IO is the type of I/O—MSIO, MSIOD, or DDRIO.
x refers the I/O pair number in bank z.
y is P (positive) or N (negative). In single-ended mode, the I/O pair operates as two separate I/Os
named P and N. Differential mode is implemented with a fixed I/O pair and cannot be split with an
adjacent I/O.
B is bank.
z refers to bank number (0–9 for M2S050-FG896).
Differential standards are implemented as true differential outputs and complementary single-ended
outputs for SSTL/HSTL. In the single-ended mode, the I/O pair operates as two separate I/Os named P
and N. All the configuration and data inputs/outputs are then separate and use names ending in P and N
to differentiate between the two I/Os.
For more information, refer to the "I/Os" chapter of the UG0445: IGLOO2 FPGA and SmartFusion2 SoC
FPGA Fabric User Guide.
Dedicated Global I/O Naming Conventions
Dedicated global I/Os are dual-use I/Os which can drive the global blocks either directly or through clock
conditioning circuits (CCC) or virtual clock conditioning circuits (VCCC). They can also be used as
regular user I/Os. These global I/Os are the primary source for bringing in the external clock inputs into
the SmartFusion2 device.
In the M2S050T-FG896 device, there are 16 global blocks located in the center of the fabric and 32
global I/Os located 8 each on the north, east, south, and west sides of the fabric. There are 6 CCC
blocks, located 2 each on northwest, northeast, and southwest side of the fabric and 2 VCCC blocks on
the southeast side of the fabric.
Dedicated global I/Os that drive the global blocks (GB) directly are named as GBn, where
n is 0 to 15.
Dedicated global I/Os that drive GBs through CCCs are named as CCC_xyz_CLKlw, where:
xy is the location—NE, SW, or NW.
z is 0 or 1.
I represents input clock
w refers to one of the four possible output clocks of the associated CCC_xyz—GL0, GL1, GL2, or
GL3.
Dedicated global I/Os that drive GBs through VCCCs are named as VCCC_SEz, where:
SE is southeast.
z is 0 or 1.
Unused dedicated global I/Os behave similarly to unused regular User I/Os (MSIO, MSIOD, DDRIO).
Libero configures unused User I/Os as input buffer disabled, output buffer tristated with weak pull-up.
For further details, refer to the "Fabric Global Routing Resources" chapter of the UG0449: SmartFusion2
SoC FPGA and IGLOO2 FPGA Clocking Resources User Guide.
o Microsemi
SmartFusion2 Pin Descriptions
Revision 10 31
Multi-Function I/Os
Certain I/Os can have more than one function. Users select the functionality through Libero configuration
tools.
The name of a pin shows the functionalities for which that pin can be configured and used.
Example pin name: MSIO48NB1/I2C_0_SCL/GPIO_31_B/USB_DATA1_C
This I/O port is multi-purpose and can be configured as MSIO, I2C0 clock, fabric I/O, or USB_DATA1_C.
MDDR/FDDR Interface
SmartFusion2 devices have MDDR/ FDDR blocks. The DDR subsystems are hardened ASIC blocks for
interfacing the LPDDR, DDR2, and DDR3 memories. It supports 8-/16-/32-bit data bus width modes. The
DDRIO uses fixed impedance calibration for different drive strengths. These values can be programmed
using Libero SoC software for the selected I/O standard. The values are fed to the pull-up/pull-down
reference network to match the impedance with an external resistor. For more information about
reference resistor values (for different drive modes), refer to the UG0445: IGLOO2 FPGA and
SmartFusion2 SoC FPGA Fabric User Guide.
DDR Controller Pins
Table 4 shows the DDR Controller pins.
Table 4 • DDR Controller Pins
Pin Name Type Reference Resistor ()
xDDR_CAS_N Out DRAM CASN.
xDDR_CKE Out DRAM Clock enable.
xDDR_CLK Out DRAM single-ended clock for differential pads.
xDDR_CLK_N Out DRAM single-ended clock for differential pads.
xDDR_CS_N Out DRAM Chip select.
xDDR_ODT Out DRAM on-die termination (ODT). 0: Termination Off
1: Termination On
xDDR_RAS_N Out DRAM RASN.
xDDR_RESET_N Out DRAM reset for DDR3.
xDDR_WE_N Out DRAM Write enable
xDDR_ADDR[15:0] Out DRAM address bits.
xDDR_BA[2:0] Out DRAM bank address.
xDDR_DM_RDQS[3:0] In/out DRAM data mask from bidirectional pads.
xDDR_DQS[3:0] In/out DRAM single-ended data strobe output for bidirectional pads.
xDDR_DQS[3:0]_N In/out DRAM single-ended data strobe output for bidirectional pads.
xDDR_DQ[31:0] In/out DRAM data input or output for bidirectional pads.
xDDR_DQ_ECC[3:0] In/out DRAM data input or output for SECDED.
xDDR_DM_RDQS_ECC In/out DRAM single-ended data strobe output for bidirectional pads.
xDDR_DQS_ECC In/out DRAM single-ended data strobe output for bidirectional pads.
xDDR_DQS_ECC_N In/out DRAM data input or output for bidirectional pads.
Notes:
1. Though calibration is not required, it is recommended to use corresponding resistor placeholder to connect the
xDDR_IMP_CALIB to the ground with or without a resistor.
2. x represents Fabric or MSS DDR.
G Microsemi
32 Revision 10
SmartFusion2 Pin Descriptions
For more information about DDR memory calibration, refer to the UG0445: IGLOO2 FPGA and
SmartFusion2 SoC FPGA Fabric User Guide.
For DDR termination details refer AC393: SmartFusion2 and IGLOO2 Board Design Guidelines
Application Note.
I/O Standards
Table 5 shows the supported I/O standards for different DDR memories.
xDDR_TMATCH_[0/1]_IN In DQS enable input for timing match between DQS and system clock.
For simulations, tie to xDDR_TMATCH_[0/1]_OUT.
xDDR_TMATCH_[0/1]_O
UT
Out DQS enable output for timing match between DQS and system clock.
For simulations, tie to xDDR_TMATCH_[0/1]_IN.
xDDR_TMATCH_ECC_IN In DQS enable input for timing match between DQS and system clock.
For simulations, tie to xDDR_TMATCH_ECC_OUT.
xDDR_TMATCH_ECC_O
UT
Out DQS enable output for timing match between DQS and system clock.
For simulations, tie to xDDR_TMATCH_ECC_IN.
xDDR_IMP_CALIB Ref Pull-down with resistor depending on voltage/standard:
• DDR2 - 150
DDR3 (1.5 V) - 240
• LPDDR - 150
Table 4 • DDR Controller Pins (continued)
Notes:
1. Though calibration is not required, it is recommended to use corresponding resistor placeholder to connect the
xDDR_IMP_CALIB to the ground with or without a resistor.
2. x represents Fabric or MSS DDR.
Table 5 • Supported I/O Standards for Different DDR Memories
Memory Type I/O Standard
DDR3 SSTL15I, SSTL15II
DDR2 SSTL18I, SSTL18II
LPDDR LVCMOS18
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 33
Supply Pins
SmartFusion2 devices support multi-standard I/Os (MSIOs), MSIODs, double data rate I/Os (DDRIOs),
microcontroller serial interfaces, high speed serial interfaces, and a debugging JTAG interface.
SmartFusion2 devices require the power supplies listed in Table 6.
Table 6 • Supply Pins
Name Type Description
VDD Supply DC core supply voltage. Must always power this pin.
VPP Supply1Power supply for charge pumps (for normal operation and
programming). Must always power this pin.
VPPNVM Supply1Analog sense circuit supply of embedded nonvolatile memory
(eNVM). Must be shorted to VPP.
VDDIx Bank power
supplies2
VDDIx, Bank x power
VREFx Supply3Reference voltage for MDDR/FDDR signals which is powered
through the corresponding Bank Supply (VDDIx). When unused,
VREFx can be DNC or grounded (VSS).
CCC_NE0_PLL_VDDA PLL power
supplies4
Analog power pad for PLL0
CCC_NE1_PLL_VDDA Analog power pad for PLL1
CCC_NW0_PLL_VDDA Analog power pad for PLL2
CCC_NW1_PLL_VDDA Analog power pad for PLL3
CCC_SW0_PLL_VDDA Analog power pad for PLL4
CCC_SW1_PLL_VDDA Analog power pad for PLL5
MSS_MDDR_PLL_VDDA Analog power pad for PLL of MDDR and MSS
FDDR_PLL_VDDA Analog power pad for PLL of FDDR
Notes:
1. For details on VPP and VPPNVM power supplies, refer to Table 2 - Recommended Operating Conditions of the
DS0128: IGLOO2 FPGA and SmartFusion2 SoC FPGA Datasheet.
2. For details on bank power supplies, refer to the “Recommendation for Unused Bank Supplies" table in the
AC393: SmartFusion2 and IGLOO2 Board Design Guidelines Application Note. For more details on user I/O pins (MSIO,
MSIOD, DDRIO) and supported voltage standards, refer to the Supported Voltage Standards table in the
UG0445: IGLOO2 FPGA and SmartFusion2 SoC FPGA Fabric User Guide.
3. Reference voltages should be powered with the appropriate bank supplies through voltage divider circuitry. If I/O banks
are being used as single-ended I/Os (and MDDR or FDDR functionalities are not being used), then VREFx can be left
floating (DNC) even though the VDDIx powered to the corresponding supplies.
4. If used as PLL, the supply must be connected over resistor and capacitors (filter circuitry) to a common PLL supply
(2.5 V or 3.3 V) to the corresponding on-board PLL return path. If PLL is unused or used as divider, the supply must
connect directly to either 2.5 V or 3.3 V (without filter circuitry).
5. If used, all SERDES PLL pins must be powered through resistor and capacitors (filter circuitry) to the correct appropriate
supply to the corresponding on-board return path. If unused must connect directly to the appropriate supplies (without
filter circuitry).
6. If used, all CCC PLL pins must be powered through resistor and capacitors (filter circuitry) to the appropriate supply to
the corresponding on-board return path on-board. If unused must connect directly to the Ground (without filter circuitry).
G Microsemi
34 Revision 10
SmartFusion2 Pin Descriptions
SERDES_x_VDD SERDESx
power supplies5
PCIe/PCS supply. It is a +1.2 V supply and internally shorted to VDD.
SERDES_x_L01_VDDAIO Tx/Rx analog I/O voltage. Low voltage power for Lane0 and Lane1 of
SERDESIFx, located on the left side. It is a +1.2 V SERDES PMA
supply.
SERDES_x_L23_VDDAIO Tx/Rx analog I/O voltage. Low voltage power for Lane2 and Lane3 of
SERDESIFx, located on the right side. It is a +1.2 V SERDES PMA
supply.
SERDES_x_L01_VDDAPLL Analog power for SERDESx PLL of Lane0 and Lane1. In used
condition, it must be connected to +2.5 V. In unused condition, it can
be connected to either +2.5 V or VDD (1.2 V).
SERDES_x_L23_VDDAPLL Analog power for SERDESx PLL of Lane2 and Lane3. In used
condition, it must be connected to +2.5 V. In unused condition, it can
be connected to either +2.5 V or VDD (1.2 V).
SERDES_x_L01_REFRET Local on-chip ground return path for SERDES_x_L01_VDDAPLL for
Lane0 and Lane1 of SERDESIF0, located on the left side. If unused,
it must be grounded (VSS).
SERDES_x_L23_REFRET Local on-chip ground return path for SERDES_x_L23_VDDAPLL for
Lane2 and Lane3 of SERDESIF0, located on the right side. If unused,
it must be grounded (VSS).
SERDES_x_PLL_VDDA High supply voltage for PLL SERDESx. It can be +2.5 V or +3.3 V.
SERDES_x_PLL_VSSA VDDA to on-die VSSA high pass filter connection for PLL SERDESx.
If unused, it must be grounded (VSS).
CCC_NE0_PLL_VSSA PLL return
paths6
Return path for corresponding analog PLL VDDA supply. High
frequency noise should be eliminated by placing the R-C filter circuitry
in between VDDA and VSSA pins.
CCC_NE_PLL_VSSA
CCC_NW0_PLL_VSSA
CCC_NW1_PLL_VSSA
CCC_SW0_PLL_VSSA
CCC_SW1_PLL_VSSA
MSS_MDDR_PLL_VSSA Analog ground pad for PLL of MDDR and MSS
FDDR_PLL_VSSA Analog ground pad for PLL of FDDR
Table 6 • Supply Pins (continued)
Name Type Description
Notes:
1. For details on VPP and VPPNVM power supplies, refer to Table 2 - Recommended Operating Conditions of the
DS0128: IGLOO2 FPGA and SmartFusion2 SoC FPGA Datasheet.
2. For details on bank power supplies, refer to the “Recommendation for Unused Bank Supplies" table in the
AC393: SmartFusion2 and IGLOO2 Board Design Guidelines Application Note. For more details on user I/O pins (MSIO,
MSIOD, DDRIO) and supported voltage standards, refer to the Supported Voltage Standards table in the
UG0445: IGLOO2 FPGA and SmartFusion2 SoC FPGA Fabric User Guide.
3. Reference voltages should be powered with the appropriate bank supplies through voltage divider circuitry. If I/O banks
are being used as single-ended I/Os (and MDDR or FDDR functionalities are not being used), then VREFx can be left
floating (DNC) even though the VDDIx powered to the corresponding supplies.
4. If used as PLL, the supply must be connected over resistor and capacitors (filter circuitry) to a common PLL supply
(2.5 V or 3.3 V) to the corresponding on-board PLL return path. If PLL is unused or used as divider, the supply must
connect directly to either 2.5 V or 3.3 V (without filter circuitry).
5. If used, all SERDES PLL pins must be powered through resistor and capacitors (filter circuitry) to the correct appropriate
supply to the corresponding on-board return path. If unused must connect directly to the appropriate supplies (without
filter circuitry).
6. If used, all CCC PLL pins must be powered through resistor and capacitors (filter circuitry) to the appropriate supply to
the corresponding on-board return path on-board. If unused must connect directly to the Ground (without filter circuitry).
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SmartFusion2 Pin Descriptions
Revision 10 35
Additional Notes on Supply Pins
As an alternative to leaving unused positive and ground level supplies floating (not connected,
open), they can be shorted to VSS on-board. This could be considered a better practice in
avionics, so that floating supplies do not pick up charge from radiation.
For on-board connectivity solutions, refer to the AC393: SmartFusion2 SoC FPGA and IGLOO2
FPGA Board Design Guidelines Application Note.
VSS Ground Ground pad for core and I/Os. Must always connect to ground.
VSSNVM Analog sense circuit ground of eNVM. Must always connect to
ground.
Table 6 • Supply Pins (continued)
Name Type Description
Notes:
1. For details on VPP and VPPNVM power supplies, refer to Table 2 - Recommended Operating Conditions of the
DS0128: IGLOO2 FPGA and SmartFusion2 SoC FPGA Datasheet.
2. For details on bank power supplies, refer to the “Recommendation for Unused Bank Supplies" table in the
AC393: SmartFusion2 and IGLOO2 Board Design Guidelines Application Note. For more details on user I/O pins (MSIO,
MSIOD, DDRIO) and supported voltage standards, refer to the Supported Voltage Standards table in the
UG0445: IGLOO2 FPGA and SmartFusion2 SoC FPGA Fabric User Guide.
3. Reference voltages should be powered with the appropriate bank supplies through voltage divider circuitry. If I/O banks
are being used as single-ended I/Os (and MDDR or FDDR functionalities are not being used), then VREFx can be left
floating (DNC) even though the VDDIx powered to the corresponding supplies.
4. If used as PLL, the supply must be connected over resistor and capacitors (filter circuitry) to a common PLL supply
(2.5 V or 3.3 V) to the corresponding on-board PLL return path. If PLL is unused or used as divider, the supply must
connect directly to either 2.5 V or 3.3 V (without filter circuitry).
5. If used, all SERDES PLL pins must be powered through resistor and capacitors (filter circuitry) to the correct appropriate
supply to the corresponding on-board return path. If unused must connect directly to the appropriate supplies (without
filter circuitry).
6. If used, all CCC PLL pins must be powered through resistor and capacitors (filter circuitry) to the appropriate supply to
the corresponding on-board return path on-board. If unused must connect directly to the Ground (without filter circuitry).
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SmartFusion2 Pin Descriptions
JTAG Pins
JTAG pins can operate at any voltage—1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (nominal). The debug port is
implemented using a serial wire JTAG debug port (SWJ-DP) rather than a serial wire debug port
(SW-DP). This enables either the M3 JTAG or the SW protocol to be used for debugging.
Table 7 • JTAG Pin Names and Descriptions
Name Type Bus Size Description
JTAGSEL In 1 JTAG controller selection.
If JTAGSEL is pulled High, an external TAP controller connects to the JTAG
interface—system controller TAP.
If JTAGSEL is pulled Low, an external TAP controller connects to either the
Cortex-M3 JTAG TAP (if debug is enabled) or an auxiliary TAP (if debug is
disabled).
JTAG_TCK/
M3_TCK
In 1 Test clock.
Serial input for JTAG boundary scan, ISP, and UJTAG. The TCK pin does not have
an internal pull-up/pull-down resistor. If JTAG is not used, Microsemi
recommends tying it off.
Connect TCK to GND or +3.3 V through a resistor placed close to the FPGA pin.
This prevents totem-pole current on the input buffer and operation in case TMS
enters an undesired state. Note that to operate at all +3.3 V voltages, 500 to
1 k will satisfy the requirements.
JTAG_TDI/
M3_TDI
In 1 Test data.
Serial input for JTAG boundary scan, ISP, and UJTAG usage. There is an internal
weak pull-up resistor on the TDI pin.
JTAG_TDO/
M3_TDO/
M3_SWO
Out 1 Test data.
Serial output for JTAG boundary scan, ISP, and UJTAG usage. The TDO pin does
not have an internal pull-up/-down resistor.
M3_SWO: Serial Wire Viewer output
JTAG_TMS/
M3_TMS/
M3_SWDIO
1 Test mode select.
The TMS pin controls the use of the IEEE1532 boundary scan pins (TCK, TDI,
TDO, and TRST). There is an internal weak pull-up resistor on the TMS pin.
M3_SWDIO: Serial Wire Debug data input/output
JTAG_TRSTB
/ M3_TRSTB
1 Boundary scan reset pin.
The TRST pin functions as an active low input to asynchronously initialize (or
reset) the boundary scan circuitry. There is an internal weak pull-up resistor on the
TRST pin. If JTAG is not used, an external pull-down resistor (1 k) could be
included to ensure the TAP is held in Reset mode. In critical applications, an upset
in the JTAG circuit could allow entering an undesired JTAG state. In such cases,
Microsemi recommends that you tie off TRST to GND through a resistor (1 k)
placed close to the FPGA pin. The TRSTB pin also resets the serial wire JTAG
debug port (SWJ-DP) circuitry within the Cortex-M3 processor.
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SmartFusion2 Pin Descriptions
Revision 10 37
Programming SPI
The system controller contains a dedicated SPI block for programming. The SPI is operated in either
Master or Slave mode. In Master mode, the SmartFusion2 device is interfaced with an external SPI flash
device and the programming data is downloaded from it to the FPGA. In Slave mode, it is communicated
with a remote device that initiates download of the programming data to the FPGA.
Dedicated I/Os
Dedicated I/Os (Table 9 and Table 10 on page 38) can be used for a single purpose such as SERDES,
device reset, or clock functions. SmartFusion2 dedicated I/Os:
Device reset pins
Crystal oscillator pins
SERDES I/Os
Programming SPI pins
Table 8 • Programming SPI Interface
Name Type Description
SC_SPI_SS Out SPI slave select
SC_SPI_SDO Out SPI data output
SC_SPI_SDI In SPI data input
SC_SPI_CLK Out SPI clock
FLASH_GOLDEN_N In If pulled Low, this indicates that the device is to be re-programmed from an image in
the external SPI flash attached to the SPI interface. If pulled High, the SPI is put into
slave mode. Add an external pull-up resistor value of 10 k to VDDI (Bank).
Notes:
1. If unused, SPI programming pins must be left floating.
2. For more details related to reset, clock, and programming, refer to the AC393: SmartFusion2 SoC FPGA and
IGLOO2 FPGA Board Design Guidelines Application Note.
3. For more information on remaining programming modes, refer to the UG0451: SmartFusion2 SoC FPGA and
IGLOO2FPGA Programming User Guide.
Table 9 • Device Reset and Crystal Oscillator Pin Types and Descriptions
Pin Type Description
Device Reset I/Os
DEVRST_N Input Device reset; active Low and powered by VPP. It is an asynchronous
signal and Schmitt trigger input with the maximum slew rate must not
exceed 1 µs. When DEVRST_N is asserted, all user IOs are fully tri-stated.
In unused condition, pull up to VPP through 10 k resistor.
Crystal Oscillator I/Os1, 2
XTLOSC_[MAIN/AUX]_EXTAL Input Crystal connection or external RC network.
XTLOSC_[MAIN/AUX]_XTAL Input Input clock from the main/auxiliary crystal oscillator
Notes:
1. The M2S050 device has only a main crystal oscillator.
2. Crystal oscillator pins have a nominal 50 k internal weak pull-ups to VPP. If unused, those pins can be left floating
(DNC). The pins should not be grounded (VSS).
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38 Revision 10
SmartFusion2 Pin Descriptions
SERDES I/Os
The SERDES I/Os available in SmartFusion2 devices are dedicated for high speed serial communication
protocols. The SERDES I/Os support protocols such as PCI Express 2.0, XAUI, serial gigabit media
independent interface (SGMII), serial rapid IO (SRIO), and any user-defined high speed serial protocol
implementation in fabric. Refer to the AC393: SmartFusion2 SoC FPGA and IGLOO2 FPGA Board
Design Guidelines Application Note for further information.
Table 10 • SERDES I/O Port Names and Descriptions
Port Name Type Description
Data / Reference Pads
SERDES_x_RXD0_P
Input1
Receive data. SERDES differential positive input for each lane.
Each SERDESIF consists of 4 RX signals. Here x = 0 for SERDESIF_0 and
x = 1 for SERDESIF_1.
SERDES_x_RXD1_P
SERDES_x_RXD2_P
SERDES_x_RXD3_P
SERDES_x_RXD0_N
Input1
Receive data. SERDES differential negative input for each lane.
Each SERDESIF consists of 4 RX signals. Here x = 0 for SERDESIF_0 and
x = 1 for SERDESIF_1.
SERDES_x_RXD1_N
SERDES_x_RXD2_N
SERDES_x_RXD3_N
SERDES_x_TXD0_P
Output2
Transmit data. SERDES differential positive output for each lane.
Each SERDESIF consists of 4 TX signals. Here x = 0 for SERDESIF_0 and
x = 1 for SERDESIF_1.
SERDES_x_TXD1_P
SERDES_x_TXD2_P
SERDES_x_TXD3_P
SERDES_x_TXD0_N
Output2
Transmit data. SERDES differential negative output for each lane.
Each SERDESIF consists of 4 TX signals. Here x = 0 for SERDESIF_0 and
x = 1 for SERDESIF_1.
SERDES_x_TXD1_N
SERDES_x_TXD2_N
SERDES_x_TXD3_N
Common I/O Pads per SERDES Interface
SERDES_x_L01_REXT
Reference2
External reference resistor connection to calibrate TX/RX termination value.
Each SERDESIF consists of 2 REXT signals—one for Lane0 and Lane1,
and another for Lane2 and Lane3. Here x = 0 for SERDESIF_0 and x = 1
for SERDESIF_1.
SERDES_x_L23_REXT
SERDES_x_REFCLK0_P
Clock3
Reference clock differential positive. Each SERDESIF consists of two
signals (REFCLK0_P, REFCLK1_P). Here x = 0 for SERDESIF_0 and x = 1
for SERDESIF_1.
SERDES_x_REFCLK1_P
SERDES_x_REFCLK0_N
Clock3
Reference clock differential negative. Each SERDESIF consists of two
signals (REFCLK0_P, REFCLK1_P). Here x = 0 for SERDESIF_0 and x = 1
for SERDESIF_1.
SERDES_x_REFCLK1_N
Notes:
1. If unused, must always connect to VSS (ground).
2. If the SERDES unit is not being used, these pins must remain floating (DNC).
3. These pins are MUXed with MSIOD functionality. If SERDES functionality and MSIOD functionality are not used, the
pins must be left floating. Libero SoC will disable unused I/Os and weakly pull them up.
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 39
Special Pins
The two live probe I/O cells are dual-purpose. If live probe functionality will never be used on these I/Os,
the user can configure the I/O as an input, output, or bidirectional. However, if the intent is to perform live
switching between the user I/O and probe functionality, then use the I/O only as an output. If it were
configured as an input during general use, then as soon as it is switched over to live probe operation, the
probe circuitry would drive out onto this I/O, potentially causing device damage.
Table 11 • Special Pins
Name Type Description
PROBE_A In/out The two live probe I/O cells are dual-purpose:
1. Live probe functionality
2. User I/O
PROBE_B In/out
CCC_xyz_CLKI0 Input Input clock from dedicated input pad 0. The xy portion refers to the CCC
location (NE, SW, SE, or NW) and z represents the CCC number (0 or 1).
CCC_xyz_CLKI1 Input Input clock from dedicated input pad 1. The xy portion refers to the CCC
location (NE, SW, SE, or NW) and z represents the CCC number (0 or 1).
CCC_xyz_CLKI2 Input Input clock from dedicated input pad 2. The xy portion refers to the CCC
location (NE, SW, SE, or NW) and z represents the CCC number (0 or 1).
CCC_xyz_CLKI3 Input Input clock from dedicated input pad 3. The xy portion refers to the CCC
location (NE, SW, SE, or NW) and z represents the CCC number (0 or 1).
GBx Input GB is a multiplexer that generates an independent global signal. The GBs can
be driven from multiple sources such as dedicated global I/Os, fabric CCCs,
VCCCs, and fabric routing
xDDR_TMATCH_[0/1]_IN Input DQS enable input for timing match between DQS and system clock.
TMATCH_IN and TMATCH_OUT pins need to be looped back with the trace
length as short as possible.
xDDR_TMATCH_[0/1]_OUT Output DQS enable output for timing match between DQS and system clock.
DNC Do not connect.
This pin should not be connected to any signals on the PCB; leave this pin
unconnected.
NC No connect
This pin is not connected to circuitry within the device. This pin can be driven
to any voltage or can be left floating with no effect on the operation of the
device.
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40 Revision 10
SmartFusion2 Pin Descriptions
Input Only Pins
These pins are differentially paired with Flash_golden_n (input only pin) and are input only when used to
connect to the FPGA fabric. These pins can be used as output for the listed MSS peripherals.
Table 12 • Input Only Pins
Device Pin Description
M2S050T-FG896 H27 MSI46NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI46NB1 is an input only
pin.
M2S090T-FG676 D23 MSI59NB2/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI59NB2 is an input only
pin.
M2S090T-FG484 D21 MSI59NB2/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI59NB2 is an input only
pin.
M2S060T-FG484 D21 MSI47NB2/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI47NB2 is an input only
pin.
M2S050T-FG484 D21 MSI46NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI46NB1 is an input only
pin.
M2S025T-FG484 D21 MSI32NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI32NB1 is an input only
pin.
M2S010T-FG484 D21 MSI26NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI32NB1 is an input only
pin.
M2S005-FG484 D21 MSI16NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI16NB1 is an input only
pin.
M2S050T-VF400 D18 MSI46NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI46NB1 is an input only
pin.
M2S025T-VF400 D18 MSI32NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI32NB1 is an input only
pin.
M2S010T-VF400 D18 MSI26NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI26NB1 is an input only
pin.
M2S005-VF400 D18 MSI16NB1/MMUART_0_TXD/GPIO_27_B/USB_DIR_C,
cannot be configured as differential. The function MSI16NB1 is an input only
pin.
M2S025T-VF256 G12 MSI26NB1/MMUART_0_TXD/GPIO_27_B,
cannot be configured as differential. The function MSI26NB1 is an input only
pin.
o Microsemi
SmartFusion2 Pin Descriptions
Revision 10 41
M2S010T-VF256 G12 MSI26NB1/MMUART_0_TXD/GPIO_27_B,
cannot be configured as differential. The function MSI26NB1 is an input only
pin.
M2S005-VF256 D12 MSI16NB1/MMUART_0_TXD/GPIO_27_B,
cannot be configured as differential. The function MSI16NB1 is an input only
pin.
Table 12 • Input Only Pins (continued)
Device Pin Description
G Microsemi
42 Revision 10
SmartFusion2 Pin Descriptions
Microcontroller Subsystem (MSS)
Table 13 • MSS Pin Names and Descriptions
Name Type Description
Inter-Integrated Circuit (I2C) Peripherals
I2C_0_SCL In/out I2C bus serial clock output.
I2C_0_SDA In/out I2C bus serial data input/output.
I2C_1_SCL In/out I2C bus serial clock output.
I2C_1_SDA In/out I2C bus serial data input/output.
Universal Asynchronous Receiver/Transmitter (UART) Peripherals
MMUART_0_CLK Out UART clock.
MMUART_0_TXD Out UART transmit data.
MMUART_0_RXD In UART receive data.
MMUART_0_CTS In UART clear to send.
MMUART_0_RTS Out UART request to send.
MMUART_0_DTR Out Modem data terminal ready.
MMUART_0_DCD In Modem data carrier detects.
MMUART_0_DSR In Modem data set ready.
MMUART_0_RI In Modem ring indicator.
MMUART_1_CLK Out UART Clock.
MMUART_1_TXD Out UART transmit data.
MMUART_1_RXD In UART receive data.
MMUART_1_CTS In UART clear to send.
MMUART_1_RTS Out UART request to send.
MMUART_1_DTR Out Modem data terminal ready.
MMUART_1_DCD In Modem data carrier detects.
MMUART_1_DSR In Modem data set ready.
MMUART_1_RI In Modem ring indicator.
Serial Peripheral Interface (SPI) Controllers
SPI_0_SS0 Out SPI slave select0.
SPI_0_SS1 Out SPI slave select1.
SPI_0_SS2 Out SPI slave select2.
SPI_0_SS3 Out SPI slave select3.
SPI_0_SS4 Out SPI slave select4.
SPI_0_SS5 Out SPI slave select5.
SPI_0_SS6 Out SPI slave select6.
SPI_0_SS7 Out SPI slave select7.
SPI_0_CLK Out SPI clock.
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 43
Note: All the pins can also be used as Fabric I/Os as all MSS pins are muxed with Fabric I/Os.
I/O Programmable Features
SmartFusion2 devices support different I/O programmable features for MSIO, MSIOD, and DDRIO. Each
I/O pair (P, N) supports the following programmable features:
Programmable drive strength
Programmable weak pull-up and pull-down
Configurable ODT and driver impedance
Programmable input delay
Programmable Schmitt input and receiver
For more information on SmartFusion2 I/O programmable features, refer to the "SmartFusion2 I/O
Features" table of the UG0445: IGLOO2 FPGA and SmartFusion2 SoC FPGA Fabric User Guide.
SPI_0_SDO Out SPI data output.
SPI_0_SDI In SPI data input.
SPI_1_SS0 Out SPI slave select0.
SPI_1_SS1 Out SPI slave select1.
SPI_1_SS2 Out SPI slave select2.
SPI_1_SS3 Out SPI slave select3.
SPI_1_SS4 Out SPI slave select4.
SPI_1_SS5 Out SPI slave select5.
SPI_1_SS6 Out SPI slave select6.
SPI_1_SS7 Out SPI slave select7.
SPI_1_CLK Out SPI clock.
SPI_1_SDO Out SPI data output.
SPI_1_SDI In SPI data input.
Table 13 • MSS Pin Names and Descriptions (continued)
Name Type Description
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44 Revision 10
SmartFusion2 Pin Descriptions
Packaging Information
FC1152
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the FC1152 package depicted in Figure 28 are found in the Excel® spreadsheet located
here: http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=132128
The following devices are available in the FC1152:
M2S150(T), (TS)
Figure 28 • FC1152 Package Drawing
A1 Ballpad Corner
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SmartFusion2 Pin Descriptions
Revision 10 45
FG896
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the FG896 package depicted in Figure 29 are found in the Excel spreadsheet located here:
http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131803
The following devices are available in the FG896:
M2S050(T), (TS)
Figure 29 • FG896 Package Drawing
123456789101112131415161718192021222324252627282930
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A1 Ball Pad Corner
Icrosemi M O OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOOOOOO
46 Revision 10
SmartFusion2 Pin Descriptions
FG676
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the FG676 package depicted in Figure 30 are found in the Excel® spreadsheet located
here: http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=132535
The following devices are available in the FG676:
M2S090(T), (TS)
Figure 30 • FG676 Package Drawing
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AE
AF
O Microsemi OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOOOO
SmartFusion2 Pin Descriptions
Revision 10 47
FG484
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the FG484 package depicted in Figure 31 are found in the Excel® spreadsheet located
here: http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131802
The following devices are available in the FG484:
M2S005(S)
M2S010(T), (TS)
M2S025(T), (TS)
M2S050(T), (TS)
M2S060(T), (TS)
M2S090(T), (TS)
Figure 31 • FG484 Package Drawing
A1 Ball Pad Corner
22 21 20 19 18 17 16 15 14 1312 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
O Microsemi A1 Ball Pad Corner 00000000000000000000 00000000000000000000 00000000000000000000 00000000000000000000 00000000000000000000 00000000000000000000 00000000000000000000 00000000000000000000 OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOOOOOO
48 Revision 10
SmartFusion2 Pin Descriptions
VF400
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the VF400 package depicted in Figure 32 are found in the Excel spreadsheet located here:
http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131805
The following devices are available in the VF400:
M2S005(S)
M2S010(T), (TS)
M2S025(T), (TS)
M2S050(T), (TS)
Figure 32 • VF400 Package Drawing
2019181716151413121110987654321
A
B
C
D
E
F
G
H
J
K
L
M
O
P
R
T
U
V
W
Y
A1 Ball Pad Corner
Microsemi O 000000000000000000000 000000000000000000000 OO O O O OO 00 OOOOOOOOOOOOOOO OO 00 OOOOOOOOOOOOOOO 00 00000 00000 00 00 000000000 00 OO 00 OO O O 00 OO 00 OO 0 00000 O 00 OO 00 OO 0 00000 O OO 00 00000 0 00000 0 00000 00 OO 0 00000 O OO 00 00 OO 0 00000 O OO 00 00 OO O O OO 00 00 00 000000000 00 00 00000 00000 00 OOOOOOOOOOOOOOO 00 OO OOOOOOOOOOOOOOO 00 OO O O O OO 000000000000000000000 000000000000000000000
SmartFusion2 Pin Descriptions
Revision 10 49
FCS325
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the FCS325 package depicted in Figure 33 are found in the Excel® spreadsheet located
here: http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=132603
The following devices are available in the FCS325:
M2S050(T), (TS)
Figure 33 • FCS325 Package Drawing
A1 Ball Pad Corner
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
O Microsemi 0000000000000 0000000000000 0000000000000 0000000000000 000000000000 000000000000 000000000000 000000000000 000000000000 000000000000 OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO OOOOOOOOOOOOOOOO $OOOOOOOOOO$$OOO OOOOOOO$$O 0000000000 0000000000 OOOOOO I:
50 Revision 10
SmartFusion2 Pin Descriptions
VF256
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Pin Tables
Pin tables for the VF256 package depicted in Figure 34 are found in the Excel® spreadsheet located
here: http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=133773
The following devices are available in the VF256:
M2S005(S)
M2S010(T), (TS)
M2S025(T), (TS)
Figure 34 • VF256 Package Drawing
$
$%DOO3DG&RUQHU

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o Microsemi
SmartFusion2 Pin Descriptions
Revision 10 51
TQ144
Note: For Package Manufacturing and Environmental information, visit the Resource Center at
Packaging Resource Center.
Figure 35 • TQ144 Package Drawing
NOTES: UNLESS OTHERWISE SPECIFIED
SEE DETAIL “A”
SEE DETAIL “B”
11
O
- 13
O
0.10 C
0.05
(N-4)X e
0.20 C A-B D
B3
7.95 REF.
1.0 DIA.
PIN#1 & EJECTOR PIN
DP
N
+
0.089
0.0381
Top View
Side View
Bottom View
E/2
7.95
E3
5E1
E1/2
D1/2
7.50 REF.
7.50 REF.
D1
57
7
D
C
C
ccc
SEATING
PLANE
D
D/2
2
A3
4
H
A
1. All dimensioning and tolerances confirm to ASME Y14.5-1994.
2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic
body at bottom of parting line.
3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body
at datum plane H.
4. To be determined at seating plane C.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 mm
per side. Dimension D1 and E1 include mold mismatch and are determined at datum plane H.
6. N is number of terminals.
DETAIL “A” DETAIL “B”
DETAIL “C”
e / 2
2
A2
A1
10
10
10
810
b
b
1
WITH LEAD FINISH
BASE METAL
0.08
0O MIN.
0-7O
0.08/0.20 R.
GAUGE PLANE
R. MIN.
0.20 MIN.
1.00 REF.
12
A, B, OR D
0.05
0.25
0.09/0.16 0.09/0.20
ddd M C A-B D
7. Package top dimensions are smaller than bottom dimensions by 0.10 millimeters and top
of package will not overhang bottom of package.
8. Dimension b does not include damber protrusion. Allowable damber protrusion shall be
not cause the lead width to exceed the maximum b dimension by more than 0.08 mm.
Damber can not be located on the lower radius or the foot.
9. All dimensions are in millimeters.
10. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
11. This drawing conforms to JEDEC registered outline m2s-026-c, variation BFB.
12. A1 is defined as the distance from the seating plane to the lowest point of the package body.
GATE PIN
1.50
+
0.20 A-BHD
4
2H
EVEN LEAD SIDES
3
O Microsemi
52 Revision 10
SmartFusion2 Pin Descriptions
Pin Tables
Pin tables for the TQ144 package depicted in Figure 35 on page 51 are found in the Excel® spreadsheet
located here:
http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=133134
The following devices are available in the TQ144:
M2S010
M2S005 (S)
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 53
List of Changes
The following table shows important changes made in this document for each revision.
Revision Changes Page
Revision 10
(December 2015)
Added Figure 19 • SmartFusion2 M2S060-FCS325 I/O Bank Locations.
(SAR 74266)
18
Added "MDDR/FDDR Interface" section (SAR 69579) 31
Revision 9
(July 2015)
Added Figure 7 • SmartFusion2 M2S060TS/M2S060T/M2S060-FG484 I/O Bank
Locations (SAR 67177).
7
Updated Table 1 • Organization of I/O Banks in SmartFusion2 Devices - FC1152,
FCS536, FCV484, FG896, FG676, and FG484.
26
Added Figure 27 • Internal Clamp Diode Control Circuitry.29
Updated Table 4 • Reference Resistors (SAR 67026). 30
Updated "Programming SPI" section (SAR 66178). 37
Updated "Supply Pins" section (SAR 66040). 33
Updated Table 12 • Input Only Pins.40
Revision 8
(January 2015)
Added Figure 4 • SmartFusion2 M2S060TS/ M2S060T/M2S060-FG676 I/O Bank
Locations.
4
Added Figure 5 • SmartFusion2 M2S150TS/M2S150T/M2S150-FCS536 I/O Bank
Locations.
5
Added Figure 11 • SmartFusion2 M2S150TS/M2S150T/M2S150-FCV484 I/O Bank
Locations.
12
Added Figure 12 • SmartFusion2 M2S060TS/M2S060T/M2S060-VF400 I/O Bank
Locations.
13
Removed all instances of and references to M2S100 device from Table 1 •
Organization of I/O Banks in SmartFusion2 Devices - FC1152, FCS536, FCV484,
FG896, FG676, and FG484 (SAR 62858).
26
Replaced VQ144 with TQ 144 from Table 2 • Organization of I/O Banks in
SmartFusion2 Devices - VF400, FCS325, VF256, and TQ144.
28
Removed GPIO or USB_DIR_C from Ta b l e 13.42
G Microsemi
54 Revision 10
SmartFusion2 Pin Descriptions
Revision 7
(June 2014)
Updated Notes for Bank Location figures (SAR 56735). NA
Added new Figure 28 • SmartFusion2 M2S010TS/M2S010T/M2S010-VF256 I/O
Bank Locations, Figure 29 • SmartFusion2 M2S005S/M2S005-VF256 I/O Bank
Locations, Figure 30 • SmartFusion2 M2S010-TQ144 I/O Bank Locations, and
Figure 31 • SmartFusion2 M2S005S/M2S005-TQ144 I/O Bank Locations (SAR
58291).
27, 28, 29,
and 30
Modified Table 1 • Organization of I/O Banks in SmartFusion2 Devices - FC1152,
FCS536, FCV484, FG896, FG676, and FG484 by moving VF400 and FCS 325
devices to Table 2 • Organization of I/O Banks in SmartFusion2 Devices - VF400,
FCS325, VF256, and TQ144 (SAR 58291).
26
Added VF256 and VQ144 devices to Table 2 • Organization of I/O Banks in
SmartFusion2 Devices - VF400, FCS325, VF256, and TQ144 (SAR 58291).
28
Modified notes in Table 4 • Reference Resistors (SAR 58085). 30
Modified notes in Table 6 • Supply Pins (SAR 56681). 33
Modified Table 6 • Supply Pins by adding 'x' to supply pin names and deleting the
individual pin names (SAR 58291).
33
Added Table 12 • Input Only Pins (SAR 56733). 40
Added Figure 34 • VF256 Package Drawing and Figure 35 • TQ144 Package
Drawing (SAR 58291).
50 and 51
Revision 6
(March 2014)
Modified Notes for the following figures: Figure 1 • SmartFusion2
M2S150TS/M2S150T/M2S150-FC1152 I/O Bank Locations, Figure 2 •
SmartFusion2 M2S050TS/M2S050T/M2S050-FG896 I/O Bank Locations, and
Figure 6 • SmartFusion2 M2S090TS/M2S090T/M2S090-FG484 I/O Bank Locations
(SAR 55001).
1, 2, and 4
Figure 18 • SmartFusion2 M2S090TS/M2S090T/M2S090-FCS325 I/O Bank
Locations, Figure 27 • SmartFusion2 M2S025TS/M2S025T/M2S025-VF256 I/O
Bank Locations, and Figure 31 • SmartFusion2 M2S005S/M2S005-TQ144 I/O Bank
Locations are new (SAR 55995).
17, 26, and
30
Updated Table 1 • Organization of I/O Banks in SmartFusion2 Devices - FC1152,
FCS536, FCV484, FG896, FG676, and FG484 for I/O types (SARs 55743 and
47532).
26
Note added for VPP and VPPNVM for 090, 100, and 150 devices in Table 6 •
Supply Pins for I/O types (SAR 55658).
33
Added descriptions for TMATCH pins to Table 11 • Special Pins (SAR 54080). 39
Revision Changes Page
o Microsemi
SmartFusion2 Pin Descriptions
Revision 10 55
Revision 5
(January 2014)
Table 3 • User I/O Types was corrected to change LVDS to LVDS2V5 (SAR 47753). 29
Updated description column in Table 3 • User I/O Types (SAR 48665). Also added a
Note for default state of I/Os (SAR 53163)
29
Updated description column for VREF0 and VREF5 in Table 6 • Supply Pins (SAR
47164). Also modified pin name from MDDR_PLL_VDDA to
MSS_MDDR_PLL_VDDA (SAR 52457).
33
Updated description column in Table 9 • Device Reset and Crystal Oscillator Pin
Types and Descriptions for DEVRST_N (SARs 48158, 50803, and 50159).
37
Updated the links (SAR 52241). N/A
Figure 1 • SmartFusion2 M2S150TS/M2S150T/M2S150-FC1152 I/O Bank
Locations
Figure 2 • SmartFusion2 M2S100TS/M2S100T-FC1152 I/O Bank Locations
Figure 4 • SmartFusion2 M2S090TS/M2S090T-FG676 I/O Bank Locations
Figure 10 • SmartFusion2 M2S005S/M2S005-FG484 I/O Bank Locations
Figure 16 • SmartFusion2 M2S005S/M2S005-VF400 I/O Bank Locations
Figure 18 • SmartFusion2 M2S050TS/M2S050T/M2S050-FCS325 I/O Bank
Locations
are new I/O Bank Location Figures for the FC1152, FG676, FG484, VF400, and
FCS325 (SAR 52411).
1
2
4
6
17
18
Figure 25 • FC1152 Package Drawing
Figure 27 • FG676 Package Drawing
Figure 30 • FCS325 Package Drawing
are new package drawings for the FC1152, FG676 and FCS325 (SAR 52411).
44
46
49
Figure 6 • SmartFusion2 M2S090TS/M2S090T/M2S090-FG484 I/O Bank Locations
Figure 19 • SmartFusion2 M2S025TS/M2S025T/M2S025-FCS325 I/O Bank
Locations
are new I/O Bank Location Figures for the FG484 and FCS325 (SAR 52721).
418
Revision Changes Page
G Microsemi
56 Revision 10
SmartFusion2 Pin Descriptions
Revision 4
(June 2013)
Figure 11 • SmartFusion2 M2S150TS/M2S150T/M2S150-FCV484 I/O Bank
Locations through Figure 15 • SmartFusion2 M2S010TS/M2S010T/M2S010-VF400
I/O Bank Locations are new for the VF400 package (SAR 47027).
616
Updated Bank names in Table 1 • Organization of I/O Banks in SmartFusion2
Devices - FC1152, FCS536, FCV484, FG896, FG676, and FG484 (SAR 47532).
26
VF400 was added to Table 1 • Organization of I/O Banks in SmartFusion2 Devices -
FC1152, FCS536, FCV484, FG896, FG676, and FG484 (SAR 47027).
26
Deleted incorrect references to 1.8 V from Table 4 • Reference Resistors (SAR
47736).
30
Several table notes were revised in Table 6 • Supply Pins (SARs 47216 and 45299).
Added recommendation for SERDES VDDAPLL supply when serdesif is unused
(SAR 48490). Added VDD_2V5 as a supply with range 1.2 V to 2.5 V (SAR 48628).
33
Updated the XTL pin names in Table 9 • Device Reset and Crystal Oscillator Pin
Types and Descriptions (SAR 48302). Added description for DEVRST_N stating
that "It is a dedicated I/O of type MSIO (3.3 V capable)" (SAR 48665).
37
Table 11 • Special Pins was expanded to include additional pins (SAR 44597).
Moved details for VDD_2V5 to Table 6 • Supply Pins (SAR 48628).
39
Updated the Pin Table for the "FG484" package with M2S090 (SAR 48301). 47
The "VF400" section is new (SAR 47027). 48
The Board Design Guidelines application note has been released and references to
it in this document are now hyperlinked to its location on the Microsemi website.
N/A
Revision 3
(February 2013)
The "SmartFusion2 Pin Descriptions" section has been separated from the rest of
the SmartFusion2 datasheet and is now published separately. Pin tables have been
removed from the document and replaced by links to sortable pin tables in an Excel
spreadsheet. Pin tables for non-T devices are being reworked and will be included
in a future release of the document (SAR 45184). The contents of the document
have been reorganized (SAR 45275).
N/A
Table 1 • Organization of I/O Banks in SmartFusion2 Devices - FC1152, FCS536,
FCV484, FG896, FG676, and FG484 was corrected to change MSIOD to MSIO for
bank 4 and bank 7, M2S010T and M2S025T devices on the FG484 package (SAR
45188).
26
Notes were added to several tables giving instructions on how to handle pins if
unused (SAR 45172):
Table 4 • Reference Resistors
Table 8 • Programming SPI Interface
Table 9 • Device Reset and Crystal Oscillator Pin Types and Descriptions
30
37
37
The "Special Pins" section is new (SAR 44597). 39
Connection information for some of the SERDES pins was clarified in the notes to
Table 10 • SERDES I/O Port Names and Descriptions (SAR 45172).
38
Revision 2
(February 2013)
The document was revised extensively, including major changes to Table 6 • Supply
Pins, new bank location diagrams, renaming of many pins and new pin tables for
FG484 and FG896 (SARs 42905, 42497, 43861, 45081).
33
Revision Changes Page
0 Microsemi
SmartFusion2 Pin Descriptions
Revision 10 57
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
Revision 1
(January 2013)
Table 6 • Supply Pins was revised to clarify instructions for unused pins (SAR
42435).
33
Figure 1 • SmartFusion2 (M2S050T) I/O Bank Location and Naming was revised.
The number of pairs in bank 1 was corrected to 10 (was 11) and the number of pairs
in bank 3 was corrected to 23 (was 25). Table 2 • SmartFusion2 (M2S050T) I/O
Bank Resource Usage is new (SAR 42412).
5
Table 4 • Reference Resistors is new (SAR 42835). 30
The description for the FLASH_GOLDEN pin in Table 8 • Programming SPI
Interface was corrected to reverse the conditions for High and Low (SAR 42484).
37
Table 10 • SERDES I/O Port Names and Descriptions was revised to clarify
handling of pins with and without transceiver (SAR 42494).
38
The "FG484" section is new, including pin tables for M2S010T, M2S025T, and
M2S050T (SAR 42480).
47
Revision 0
(September 2012)
Initial Release. N/A
Revision Changes Page
Microsemi.
51700115PKG-10/12.15
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One Enterprise, Aliso Viejo,
CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
Sales: +1 (949) 380-6136
Fax: +1 (949) 215-4996
E-mail: sales.support@microsemi.com
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custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and
has approximately 3,600 employees globally. Learn more at www.microsemi.com.
© 2015 Microsemi Corporation. All
rights reserved. Microsemi and the
Microsemi logo are trademarks of
Microsemi Corporation. All other
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property of their respective owners.
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or
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liability whatsoever arising out of the application or use of any product or circuit. The products sold
hereunder and any other products sold by Microsemi have been subject to limited testing and should not
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