BLM18xN1x Ref Spec Sheet

Murata Electronics North America

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Spec. No. JENF243A-0003AC-01 P.1/12
MURATA MFG.CO., LTD.
Reference Only
Chip Ferrite Bead BLM18□□□□□□N1 Reference Specification
1.Scope
This reference specification applies to Chip Ferrite Bead BLM18_N Series.
2.Part Numbering
(ex.) BL M 18 AG 121 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension(L×) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical at
85at
125
BLM18RK121SN1D
120±25% 120 200 0.25 0.35
For
Digital
Interface
BLM18RK121SN1B
BLM18RK221SN1D
220±25% 220 200 0.30 0.40
BLM18RK221SN1B
BLM18RK471SN1D
470±25% 470 200 0.50 0.60
BLM18RK471SN1B
BLM18RK601SN1D
600±25% 600 200 0.60 0.70
BLM18RK601SN1B
BLM18RK102SN1D
1000±25% 1000 200 0.80 0.90
BLM18RK102SN1B
BLM18PG300SN1D
20 min. 30 1000 0.05 0.10
For DC
power line
BLM18PG300SN1B
BLM18PG330SN1D
33±25% 33
3000*1 1000*1 0.025 0.050
BLM18PG330SN1B
BLM18PG600SN1D
40 min. 60 1000 0.1 0.2
BLM18PG600SN1B
BLM18PG121SN1D
120±25% 120
2000*1 1000*1 0.05 0.10
BLM18PG121SN1B
BLM18PG181SN1D
180±25% 180
1500*1 1000*1 0.09 0.18
BLM18PG181SN1B
BLM18PG221SN1D
220±25% 220
1400*1 1000*1 0.10 0.14
BLM18PG221SN1B
BLM18PG331SN1D
330±25% 330
1200*1 1000*1 0.15 0.20
BLM18PG331SN1B
BLM18PG471SN1D
470±25% 470 1000 0.20 0.26
BLM18PG471SN1B
BLM18KG221SN1D
220±25 220 2200*1 1500*1 0.050 0.060
BLM18KG221SN1B
BLM18KG331SN1D
330±25 330 1700*1 1200*1 0.080 0.095
BLM18KG331SN1B
BLM18KG471SN1D
470±25 470 1500*1 1000*1 0.130 0.145
BLM18KG471SN1B
BLM18KG601SN1D
600±25 600 1300*1 1000*1 0.150 0.165
BLM18KG601SN1B
BLM18KG102SN1D
1000±25 1000 1000*1 800*1 0.200 0.230
BLM18KG102SN1B
BLM18SD220SN1D
22±25 22 6000*1 3500*1 0.008 0.013
BLM18SD220SN1B
BLM18SG330SN1D
33±25 33 6000*1 3500*1 0.008 0.013
BLM18SG330SN1B
Spec. No. JENF243A-0003AC-01 P.2/12
MURATA MFG.CO., LTD.
Reference Only
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical at
85at
125
BLM18AG121SN1D
120±25% 120 800 0.18 0.28
For
general
use
BLM18AG121SN1B
BLM18AG151SN1D
150±25% 150 700 0.25 0.35
BLM18AG151SN1B
BLM18AG221SN1D
220±25% 220 700 0.25 0.35
BLM18AG221SN1B
BLM18AG331SN1D
330±25% 330 600 0.30 0.40
BLM18AG331SN1B
BLM18AG471SN1D
470±25% 470 550 0.35 0.45
BLM18AG471SN1B
BLM18AG601SN1D
600±25% 600 500 0.38 0.48
BLM18AG601SN1B
BLM18AG102SN1D
1000±25% 1000 450 0.50 0.60
BLM18AG102SN1B
BLM18BB050SN1D
5±25% 5 800 0.05 0.10
For
high speed
signal line
BLM18BB050SN1B
BLM18BA050SN1D
5±25% 5 500 0.2 0.3
BLM18BA050SN1B
BLM18BB100SN1D
10±25% 10 700 0.10 0.20
BLM18BB100SN1B
BLM18BA100SN1D
10±25% 10 500 0.25 0.35
BLM18BA100SN1B
BLM18BB220SN1D
22±25% 22 700 0.20 0.30
BLM18BB220SN1B
BLM18BA220SN1D
22±25% 22 500 0.35 0.45
BLM18BA220SN1B
BLM18BB470SN1D
47±25% 47 600 0.25 0.35
BLM18BB470SN1B
BLM18BD470SN1D
47±25% 47 500 0.3 0.4
BLM18BD470SN1B
BLM18BA470SN1D
47±25% 47 300 0.55 0.65
BLM18BA470SN1B
BLM18BB600SN1D
60±25% 60 600 0.25 0.35
BLM18BB600SN1B
BLM18BA750SN1D
75±25% 75 300 0.70 0.80
BLM18BA750SN1B
BLM18BB750SN1D
75±25% 75 600 0.30 0.40
BLM18BB750SN1B
BLM18BB121SN1D
120±25% 120 550 0.30 0.40
BLM18BB121SN1B
BLM18BD121SN1D
120±25% 120 300 0.4 0.5
BLM18BD121SN1B
BLM18BA121SN1D
120±25% 120 200 0.9 1.0
BLM18BA121SN1B
BLM18BB141SN1D
140±25% 140 500 0.35 0.45
BLM18BB141SN1B
BLM18BB151SN1D
150±25% 150 450 0.37 0.47
BLM18BB151SN1B
BLM18BD151SN1D
150±25% 150 300 0.4 0.5
BLM18BD151SN1B
BLM18BB221SN1D
220±25% 220 450 0.45 0.55
BLM18BB221SN1B
BLM18BD221SN1D
220±25% 220 250 0.45 0.55
BLM18BD221SN1B
Spec. No. JENF243A-0003AC-01 P.3/12
MURATA MFG.CO., LTD.
Reference Only
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
DC Resistance
(Ω max.) Remark
Initial
Values Values
After
Testing
Typical at
85 at
125
BLM18BB331SN1D
330±25% 330 400 0.58 0.68
For
high speed
signal line
BLM18BB331SN1B
BLM18BD331SN1D
330±25% 330 250 0.5 0.6
BLM18BD331SN1B
BLM18BD421SN1D
420±25% 420 250 0.55 0.65
BLM18BD421SN1B
BLM18BB471SN1D
470±25% 470 300 0.85 0.95
BLM18BB471SN1B
BLM18BD471SN1D
470±25% 470 250 0.55 0.65
BLM18BD471SN1B
BLM18BD601SN1D
600±25% 600 200 0.65 0.75
BLM18BD601SN1B
BLM18BD102SN1D
1000±25% 1000 200 0.85 0.95
BLM18BD102SN1B
BLM18BD152SN1D
1500±25% 1500 150 1.2 1.3
BLM18BD152SN1B
BLM18BD182SN1D
1800±25% 1800 150 1.5 1.6
BLM18BD182SN1B
BLM18BD222SN1D
2200±25% 2200 150 1.5 1.6
BLM18BD222SN1B
BLM18BD252SN1D
2500±25% 2500 150 1.5 1.6
BLM18BD252SN1B
BLM18TG121TN1D
120±25% 120 200 0.25 0.3
For
general
use
(Thin type)
BLM18TG121TN1B
BLM18TG221TN1D
220±25% 220 200 0.3 0.4
BLM18TG221TN1B
BLM18TG601TN1D
600±25% 600 200 0.45 0.6
BLM18TG601TN1B
BLM18TG102TN1D
1000±25% 1000 100 0.6 0.8
BLM18TG102TN1B
BLM18SG260TN1D
26±25 26 6000*1 1000*1 0.007 0.012
For DC
power line
(Thin type)
BLM18SG260TN1B
BLM18SG700TN1D
70±25 70 4000*1 1000*1 0.020 0.030
BLM18SG700TN1B
BLM18SG121TN1D
120±25 120 3000*1 1000*1 0.025 0.035
BLM18SG121TN1B
BLM18SG221TN1D
220±25 220 2500*1 1000*1 0.040 0.055
BLM18SG221TN1B
BLM18SG331TN1D
330±25 330 1500*1 1000*1 0.070 0.085
BLM18SG331TN1B
BLM18SN220TN1D
22±7 22
8000*1 5000*1 0.004 0.005
BLM18SN220TN1B
BLM18KG260TN1D
26±25 26 6000*1 4000*1 0.007 0.012
BLM18KG260TN1B
BLM18KG300TN1D
30±25 30 5000*1 3300*1 0.010 0.015
BLM18KG300TN1B
BLM18KG700TN1D
70±25 70 3500*1 2200*1 0.022 0.032
BLM18KG700TN1B
BLM18KG101TN1D
100±25 100 3000*1 1900*1 0.030 0.040
BLM18KG101TN1B
BLM18KG121TN1D
120±25 120 3000*1 1900*1 0.030 0.040
BLM18KG121TN1B
Spec. No. JENF243A-0003AC-01 P.4/12
MURATA MFG.CO., LTD.
Reference Only
:Elect
r
ode
1.6±0.15 0.8±0.15
0.4 ±0.2
T
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(*1)In case of Rated current is more than 1A,
Rated Current is derated as right figure
depending on the operating temperature.
4.Style and Dimensions
Equivalent Circuit
(in mm)
5.Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3.
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
7-1-2 DC
Resistance Meet item 3. Measuring Equipment : Digital multi meter
For BLM18SN_TN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
Except resistance of the Substrate and Wire
BLM18SG***TN1* 0.5±0.15
BLM18SN***TN1* 0.6±0.15
BLM18TG***TN1* 0.6±0.1
BLM18KG***TN1* 0.6±0.15
BLM18*****SN1* 0.8±0.15
Resistance element becomes
dominant at high frequencies.
()
Unit Mass (Typical value)
BLM18*****SN1*:0.005g
BLM18*****TN1*:0.004g
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
Spec. No. JENF243A-0003AC-01 P.5/12
MURATA MFG.CO., LTD.
Reference Only
7-2.Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance
and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 6.8N
Applying Time : 5s±1s
Applied direction :Parallel to substrate
7-2-3 Bending
Strength It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×1.6mm
Deflection : 1.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-2-4 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Meet Table 2.
Table 2
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM18KG
Within ±40%)
(for BLM18SN
Within ±50%)
DC
Resistance Meet item 3.
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for 48h±4h.
7-2-6 Drop Products shall be no failure
after tested. It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
7-2-7 Solderability The electrodes shall be at
least 95% covered with new
solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM18SN
W
ithin ±50%)
DC
Resistance Meet item 3.
45mm
R340
F
Deflection
45mm Product
Pressure jig
R0.5
Substrate
Side view
Spec. No. JENF243A-0003AC-01 P.6/12
MURATA MFG.CO., LTD.
Reference Only
7-3.Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle Meet Table 3.
Table 3
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(for BLM18KG
Within-10%to+
50%)
(for BLM18SN
Within ±50%)
DC
Resistance Meet item 3.
1 cycle:
1 step:-55 °C(+0 °C,-3 °C) / 30min±3min
2 step:Ordinary temp. / 10min to 15min
3 step:+125 °C(+3 °C,-0 °C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity Meet Table 1.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-3 Heat Life Temperature : 125°C±3°C
(in case of Rated current is more than 1A,
do the test at : +85 °C±3°C)
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-4 Cold
Resistance Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Spec. No. JENF243A-0003AC-01 P.7/12
MURATA MFG.CO., LTD.
Reference Only
8.Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
Part Number Type Appearance and Dimensions
BLM18RK***SN1D
BLM18PG***SN1D
BLM18AG***SN1D
BLM18B****SN1D
BLM18KG****N1D
BLM18S****SN1D
BLM18SN***TN1D
8mm-
wide Paper tape
4mm-pitch
Item Dimension “a”
BLM18*****SN1D 1.1 max.
BLM18KG***TN1D
BLM18SN***TN1D
0.85 max.
BLM18SG***TN1D
BLM18TG***TN1D
8mm-
wide Paper tape
2mm-pitch
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape continuously and sealed by top tape
and bottom tape.
(2) Sprocket hole:The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Top tape
Bottom tape Base tape
165 to 180 degree F
0.9max.
2.0±0.05
2.0±0.1 4.0±0.1
φ
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed
1.85±0.1
1.05±0.1
φ
1.5
a
Direction of feed
4.0±0.1 4.0±0.1
1.85±0.1
2.0±0.
05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.05±0.1
2.0±0.05
2.0±0.05
Spec. No. JENF243A-0003AC-01 P.8/12
MURATA MFG.CO., LTD.
Reference Only
8-3.Taping Condition
(1)Standard quantity per reel
Type Quantity per 180mm reel
BLM18(except BLM18SG/BLM18TG) 4000 pcs. / reel
BLM18SG/BLM18TG 10000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS Marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(2), Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an
order.
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
W
D
Label
H
Spec. No. JENF243A-0003AC-01 P.9/12
MURATA MFG.CO., LTD.
Reference Only
9. Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Transportation equipment (vehicles,trains,ships,etc.)
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions
< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >
(in mm)
< For BLM18P/BLM18S/BLM18K type >
Type Rated
Current
(A) ab c
Land pad thickness
and dimension d
18µm 35µm 70µm
BLM18P
BLM18S
BLM18K
0.5 to 1.5
0.7
Flow
2.2 to 2.6
Reflow
1.8 to 2.0
0.7
0.7 0.7 0.7
1.7 to 2.5 1.2 0.7 0.7
3 to 4 2.4 1.2 0.7
5 to 6 6.4 3.3 1.65
BLM18SN 8 0.7 2.0 0.7 - 6.4 3.3
(in mm)
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
10-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Type Soldering a b c
BLM18 (except18P/18S/
BLM18K type) Flow 0.7 2.2 to 2.6 0.7
Reflow 1.8 to 2.0
a
b
Chip Ferrite Bead
Solder Resist
Pattern
c
a
b
Chip Ferrite Bead
Solder Resist
Pattern
d
c
Spec. No. JENF243A-0003AC-01 P.10/12
MURATA MFG.CO., LTD.
Reference Only
(3)soldering profile
Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、46s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 217°C60s~150s
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
10-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
1/3TtT
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Recommendable
Upper Limit
t
Limit Profile
Standard Profile
90s±30s
230
260
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
265℃±3
Spec. No. JENF243A-0003AC-01 P.11/12
MURATA MFG.CO., LTD.
Reference Only
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length: a<b) to the mechanical
stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew
Poor example
Good example
b
a
Screw Hole Recommended
Perforation
Slit
A
B
C
D
Spec. No. JENF243A-0003AC-01 P.12/12
MURATA MFG.CO., LTD.
Reference Only
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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