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70-9155 Series Datasheet

AVX Corporation

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Datasheet

CONNECT
INTER
106 061418
Low Profile Single Contact
70-9155
Designers for ruggedized connectors to meet harsh environments continue to look
for new products which will reduce size and cost without jeopardizing
performance. The new Ultra-Low Profile (ULP) compression contact from AVX
surface mounts to a PCB and provides a reliable compression connection to the
mating board, even under extreme shock and vibration applications. With over 20
years of 1-Piece compression contact experience, this innovative contact offers full
connector performance functionality at the individual contact level. Thus, allowing
single contacts to be placed in any location or position on a PCB.
The high force beryllium copper contact is gold plated to maximize reliability and
signal integrity. The current offering has two contacts with nominal heights of
1.0mm and 1.5mm. Add in the “Z” axis tolerance range and the compressed height
covers 0.75mm up to 1.75mm. The contacts are supplied in tape and reel for easy
SMT placement.
ELECTRICAL
• Current Rating: 3 Amps
• Voltage Rating: UL 300V
Based on placement distance
9155
Series
70
Prefix
001
Number
of Ways
HOW TO ORDER
61X
Contact Description
ENVIRONMENTAL
• Operating Temperature:
-40ºC to +125ºC
MECHANICAL
• Contact Material: Beryllium Copper
• Contact Plating: Gold over Nickel
• Durability: 50, 500 and 1000 cycles
FEATURES AND BENEFITS
• Reliable gold plated Beryllium Copper contacts for high cycle life
and signal integrity up to 1000 cycles
• Tape and reel packaged for automated SMT placement
• Sweeping beam design for pluggable/module applications
• Three gold plating options to match end product environmental or
expected life requirements
APPLICATIONS
• Industrial/Ruggedized handheld or portable
devices
• BTB connection for any traditional power or
signal application
• Ground connections between PCB’s or
housings
Code Nominal Contact Operating
Operating Height Height Range
610 1.00mm 0.75mm to 1.25mm
615 1.50mm 1.25mm to 1.75mm
00X
Contact Description
Code Gold Description Availability
Thickness
004 0.1µm Nickel under Plate, Gold on Nose Standard
Tin on Remainder
006 0.4µm Nickel under Plate, Gold on Nose Special
Tin on Remainder Order
008 0.8µm Nickel under Plate, Gold on Nose Special
Tin on Remainder Order
Certification: UL File #E90723
CONNECT
INTER
107
061418
70-9155-001-610-006
NOMINAL WORKING HEIGHT 1.00MM
NOTES:
1. 9155 LOW PROFILE CONTACT, WORKING HEIGHT 0.75MM TO 1.25MM.
2. FOR FULL DETAILS REFER TO PRODUCT SPECIFICATION 201-01-153 AND
APPLICATIONS NOTES 201-01-154.
3. MATERIAL: COPPER ALLOY 0.2MM THICK.
4. PLATING: NICKEL ALL OVER WITH GOLD ON CONTACT NOSE AND TIN ON THE
REMAINDER. PARTS TO BE PACKED IN TAPE AND REEL. QTY PER REEL 3000.
5. OUTLINE OF CONNECTOR, ORIENTATION END “A”.
6. AREA TO KEPT FREE OF SOLDER RESIST, FURTHER INFORMATION IN
APPLICATION NOTES.
7. AREA BETWEEN PADS TO BE KEPT CLEAR OF TRACKS AND COMPONENTS.
8. SMT PADS PLATED TIN.
9. MATING PAD PLATED GOLD OVER NICKEL.
FULLY DEFLECTED
CONTACT
SUGGESTED MATING
PCB LAYOUT
SUGGESTED SMT
PCB LAYOUT
PACKING DETAILS
Low Profile Single Contact
70-9155
CONNECT
INTER
108 061418
70-9155-001-615-006
NOMINAL WORKING HEIGHT 1.50MM
NOTES:
1. 9155 LOW PROFILE CONTACT, WORKING HEIGHT 1.25MM TO 1.75MM.
2. FOR FULL DETAILS REFER TO PRODUCT SPECIFICATION 201-01-153 AND
APPLICATIONS NOTES 201-01-154.
3. MATERIAL: COPPER ALLOY 0.2MM THICK.
4. PLATING: NICKEL ALL OVER WITH GOLD ON CONTACT NOSE AND TIN ON THE
REMAINDER. PARTS TO BE PACKED IN TAPE AND REEL. QTY PER REEL 3000.
5. OUTLINE OF CONNECTOR, ORIENTATION END “A”.
6. AREA TO KEPT FREE OF SOLDER RESIST, FURTHER INFORMATION IN
APPLICATION NOTES.
7. AREA BETWEEN PADS TO BE KEPT CLEAR OF TRACKS AND COMPONENTS.
8. SMT PADS PLATED TIN.
9. MATING PAD PLATED GOLD OVER NICKEL.
FULLY DEFLECTED
CONTACT
SUGGESTED MATING
PCB LAYOUT
SUGGESTED SMT
PCB LAYOUT
PACKING DETAILS
Low Profile Single Contact
70-9155

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