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Basler Inc.
daA4200-30mci-NVJET-NVDK-AddOn Embedded Vision Kit
BECOM Systems GmbH
Sentis3D - M100 Board
BECOM Systems GmbH
Sentis3D - M520 Evaluation Kit
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Sentis3D - M100 Board

150-3002-1 Sentis3D - M100 Board

BECOM Systems GmbH

The Sentis3D - M100 is a new 3D sensor, operating on the Time of Flight (ToF) principle. The M100 is equipped with a PMD PhotonICs® 19k-S3 Time of Flight 3D chip. This smart 3D sensor delivers depth information and gray value image data for each pixel simultaneously. Therefore, it´s possible to analyze scenes based on 3D data only or in combination with 2D grayscale data. Using active IR illumination, the sensor can capture 3D and 2D information at a resolution of 160 x 120 pixels with up to 40 frames per second independently of ambient light. With a range of 3 m, a field of view of 90° and a size of only 50 x 55 x 36 mm, this Ethernet connected sensor can be used for next generation sensor systems in various application fields like robotics, gesture recognition, HMI or people counting. A dual core DSP is responsible for processing in which one of the core is fully available for your own application running natively on the sensor.

  • Embedded:Yes, DSP
  • Interface:Ethernet
  • Sensitivity:40fps
  • Sensor Type:Image Sensor
  • Supplied Contents:Board(s), Cable(s), Power Supply
  • Utilized IC / Part:Sentis-ToF-M100
  • Voltage - Supply:24V
Associated Product
BECOM Systems GmbH 150-3001-1
Category: Sensors, Transducers-Image, Camera Sensors