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Seeed Technology Co., Ltd
114991684 Sipeed MAIX-I Series
Seeed Technology Co., Ltd
114991695 Sipeed MAIX-I Series
 
Xilinx Inc.
Zynq® UltraScale+™
Seeed Technology Co., Ltd

114991695 Sipeed MAIX-I Series

Sipeed MAIX‐I Module without Wi-Fi 1st RISC‐V 64 AI Module, K210 Inside

Seeed Technology Co., Ltd

AI is pervasive today, from consumer to enterprise applications. With the explosive growth of connected devices, combined with a demand for privacy/confidentiality, low latency and bandwidth constraints, AI models trained in the cloud increasingly need to be run at the edge. MAIX is Sipeed’s purpose‐built module designed to run AI at the edge, it’s called a AIoT. It delivers high performance in a small physical and power footprint, enabling the deployment of high‐accuracy AI at the edge, and the competitive price make it possible embed to any IoT devices. As you see, Sipeed MAIX is quite like Google edge TPU, but it acts as master controller, not an accelerator like edge TPU, so it is more low cost and low power than AP+edge TPU solution.

Datasheets:
Specifications
  • Architecture:MPU
  • Connectivity:I²C, SPI, UART/USART
  • Core Processor:RISC-V Dual Core 64bit
  • Flash Size:8MB/16MB/128MB
  • Number of I/O:48
  • Operating Temperature:-30°C ~ 85°C
  • Package / Case:Module
  • Packaging:Bulk
  • Peripherals:DMA, I²S, PWM, WDT
  • Primary Attributes:Audio Processor (APU), Neural Network Processor (KPU)
  • RAM Size:8MB
  • Speed:400MHz
  • Supplier Device Package:Module
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